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1. 发明申请

US20120190277A1 INSERT CARRIER AND METHOD FOR THE SIMULTANEOUS DOUBLE-SIDE MATERIAL-REMOVING PROCESSING OF SEMICONDUCTOR WAFERS 有权
标题翻译：用于半导体波形的同时双面材料去除处理的插入件和方法
公开(公告)号：US20120190277A1
公开(公告)日：2012-07-26
申请号：US13311575
申请日：2011-12-06
申请人： Georg Pietsch , Michael Kerstan
发明人： Georg Pietsch , Michael Kerstan
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/28
摘要： An insert carrier is configured to receive at least one semiconductor wafer for double-side processing of the wafer between two working disks of a lapping, grinding or polishing process. The insert carrier includes a core of a first material that has a first surface and a second surface, and at least one opening configured to receive a semiconductor wafer. A coating at least partially covers the first and second surfaces of the core. The coating includes a surface remote from the core that includes a structuring including elevations and depressions. A correlation length of the elevations and depressions is in a range of 0.5 mm to 25 mm and an aspect ratio of the structuring is in a range of 0.0004 to 0.4.
摘要翻译：插入物承载件构造成容纳至少一个半导体晶片，用于在研磨，研磨或抛光工艺的两个工作盘之间对晶片进行双面处理。插入物承载件包括具有第一表面和第二表面的第一材料的芯和被配置为接收半导体晶片的至少一个开口。涂层至少部分地覆盖芯的第一和第二表面。涂层包括远离芯的表面，其包括包括高度和凹陷的结构。高度和凹陷的相关长度在0.5mm至25mm的范围内，结构的纵横比在0.0004至0.4的范围内。

2. 发明授权

US07867059B2 Semiconductor wafer, apparatus and process for producing the semiconductor wafer 失效
标题翻译：用于制造半导体晶片的半导体晶片，装置和工艺
公开(公告)号：US07867059B2
公开(公告)日：2011-01-11
申请号：US11941171
申请日：2007-11-16
申请人： Georg Pietsch , Michael Kerstan , Werner Blaha
发明人： Georg Pietsch , Michael Kerstan , Werner Blaha
IPC分类号： B24B49/00
CPC分类号： H01L21/02013 , B24B7/17 , B24B7/228 , B24D7/14
摘要： The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.
摘要翻译：本发明涉及通过半导体晶片的双面研磨制造半导体晶片的方法，其中半导体晶片在两侧同时研磨，首先通过粗磨，然后使用研磨工具进行精磨。在粗磨和精磨之间的半导体晶片保持定位在研磨机中，并且研磨工具在从粗磨到精磨过渡期间继续施加基本恒定的载荷。本发明还涉及一种用于在2mm×2mm面积的测量窗口中在小于16nm的前表面上具有局部平坦度值并且小于40nm的半导体晶片的半导体晶片测量窗口为10mm×10 mm面积。

3. 发明授权

US08974267B2 Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers 有权
标题翻译：用于半导体晶片的同时双面材料去除处理的插入载体和方法
公开(公告)号：US08974267B2
公开(公告)日：2015-03-10
申请号：US13311575
申请日：2011-12-06
申请人： Georg Pietsch , Michael Kerstan
发明人： Georg Pietsch , Michael Kerstan
IPC分类号： B24B1/00 , B24B37/28
CPC分类号： B24B37/28
摘要： An insert carrier is configured to receive at least one semiconductor wafer for double-side processing of the wafer between two working disks of a lapping, grinding or polishing process. The insert carrier includes a core of a first material that has a first surface and a second surface, and at least one opening configured to receive a semiconductor wafer. A coating at least partially covers the first and second surfaces of the core. The coating includes a surface remote from the core that includes a structuring including elevations and depressions. A correlation length of the elevations and depressions is in a range of 0.5 mm to 25 mm and an aspect ratio of the structuring is in a range of 0.0004 to 0.4.
摘要翻译：插入物承载件构造成容纳至少一个半导体晶片，用于在研磨，研磨或抛光工艺的两个工作盘之间对晶片进行双面处理。插入物承载件包括具有第一表面和第二表面的第一材料的芯和被配置为接收半导体晶片的至少一个开口。涂层至少部分地覆盖芯的第一和第二表面。涂层包括远离芯的表面，其包括包括高度和凹陷的结构。高度和凹陷的相关长度在0.5mm至25mm的范围内，结构的纵横比在0.0004至0.4的范围内。

4. 发明授权

US08685270B2 Method for producing a semiconductor wafer 有权
标题翻译：半导体晶片的制造方法
公开(公告)号：US08685270B2
公开(公告)日：2014-04-01
申请号：US12902558
申请日：2010-10-12
申请人： Juergen Schwandner , Thomas Buschhardt , Diego Feijoo , Michael Kerstan , Georg Pietsch , Guenter Schwab
发明人： Juergen Schwandner , Thomas Buschhardt , Diego Feijoo , Michael Kerstan , Georg Pietsch , Guenter Schwab
IPC分类号： C03C15/00 , C03C25/68 , B44C1/22 , H01L21/302 , H01L21/461
CPC分类号： B24B37/042 , B24B37/08 , H01L21/02013 , H01L21/02019 , H01L21/02021 , H01L21/02024
摘要： A method for producing a semiconductor wafer sliced from a single crystal includes rounding an edge using a grinding disk containing abrasives with an average grain size of 20.0-60.0 μm. A first simultaneous double-side material-removing process is performed wherein the semiconductor wafers are processed between two rotating ring-shaped working disks, each working disk having a working layer containing abrasives having an average grain size of 5.0-20.0 μm, wherein the semiconductor wafer is placed in a cutout in one of a plurality of carriers rotatable by a rolling apparatus such that the semiconductor wafer lies in a freely movable manner in the carrier and the wafer is movable on a cycloidal trajectory. A second simultaneous double-side material-removing process is performed including processing the semiconductor wafers between two rotating ring-shaped working disks, each working disk having a working layer containing abrasives having an average grain size of 0.5-15.0 μm.
摘要翻译：用于制造从单晶切片的半导体晶片的方法包括使用包含平均粒径为20.0-60.0μm的研磨剂的研磨盘对边缘进行四舍五入。进行第一同时双面材料去除工艺，其中半导体晶片在两个旋转环形工作盘之间加工，每个工作盘具有包含平均粒度为5.0-20.0μm的研磨剂的工作层，其中半导体晶片被放置在由滚动装置旋转的多个载体之一的切口中，使得半导体晶片以可自由移动的方式位于载体中，并且晶片可以在摆线轨迹上移动。进行第二同时双面材料去除处理，包括在两个旋转环形工作盘之间处理半导体晶片，每个工作盘具有包含平均晶粒尺寸为0.5-15.0μm的研磨剂的工作层。

5. 发明申请

US20100099337A1 Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers 有权
标题翻译：用于双面加工平面工件的装置和用于多个半导体晶片的同时双面材料去除处理的方法
公开(公告)号：US20100099337A1
公开(公告)日：2010-04-22
申请号：US12581195
申请日：2009-10-19
申请人： Michael Kerstan , Georg Pietsch , Frank Runkel , Conrad von Bechtolsheim , Helge Moeller
发明人： Michael Kerstan , Georg Pietsch , Frank Runkel , Conrad von Bechtolsheim , Helge Moeller
IPC分类号： B24B7/17 , B24B1/00 , B24B47/12
CPC分类号： B24B7/17 , B24B37/08 , B24B47/12
摘要： A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.
摘要翻译：用于平面工件的双面加工的装置具有在其间形成有上下工作盘的工作间隙，该工作间隙包含具有用于工件的切口的托盘，所述托盘具有周向齿，通过该圆周齿滚动内齿轮或外齿轮或销环，其中齿轮或销环具有多个齿轮或销布置，其在滚动期间与承载盘的齿啮合，至少一个销装置具有限定运动的导向件载体盘的边缘在至少一个轴向方向上，引导件由圆周肩部或周向凹槽形成。

6. 发明授权

US09539695B2 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers 有权
标题翻译：载体，涂布载体的方法，以及用于半导体晶片的同时双面材料去除加工的方法
公开(公告)号：US09539695B2
公开(公告)日：2017-01-10
申请号：US12242963
申请日：2008-10-01
申请人： Georg Pietsch , Michael Kerstan , Heiko aus dem Spring
发明人： Georg Pietsch , Michael Kerstan , Heiko aus dem Spring
IPC分类号： B24B37/08 , B24B37/28 , B24B37/32 , B24B37/04
CPC分类号： B24B37/28 , B24B37/042 , B24B37/08 , B24B37/32 , Y10T29/49
摘要： Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90. The carriers are preferably coated with the second material after chemical surface activation and application of adhesion promoter, and may be used for simultaneous double-side material-removing machining of a plurality of semiconductor wafers.
摘要翻译：适于接收一个或多个半导体晶片以用于研磨，研磨或抛光机器的加工的载体包括具有高硬度的第一材料的芯，所述芯完全或部分地涂覆有第二材料，并且还至少一个用于接收半导体晶片的切口，其中所述第二材料是肖氏A硬度为20-90的热固性聚氨酯弹性体。载体优选在化学表面活化和施加粘合促进剂之后用第二材料涂覆，并且可以用于多个半导体晶片的同时双面材料去除加工。

7. 发明授权

US08911281B2 Method for trimming the working layers of a double-side grinding apparatus 有权
标题翻译：一种用于修整双面研磨装置的工作层的方法
公开(公告)号：US08911281B2
公开(公告)日：2014-12-16
申请号：US13181619
申请日：2011-07-13
申请人： Georg Pietsch , Michael Kerstan
发明人： Georg Pietsch , Michael Kerstan
IPC分类号： B24B1/00 , B24B53/017 , B24B37/08 , B24B37/28
CPC分类号： B24B53/017 , B24B37/08 , B24B37/28
摘要： A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing the grinding apparatus including the upper and lower working disks and providing at least one carrier including an outer toothing. The upper and lower working disks are rotated. The carrier is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. Loose abrasives are added to a working gap formed between the working layers. A carrier, without workpieces inserted therein, is moved in the working gap so as to effect material removal from the working layers.
摘要翻译：一种用于修整两个工作层的方法，包括施加在平面工件的同时双面加工的研磨装置的上下工作盘的相互面对的侧面上的粘结磨料，包括提供包括上下工作盘和提供至少一个包括外齿的载体。上下工作盘旋转。载体使用滚动装置在旋转的工作盘之间移动，并且相对于工作盘的工作层在摆线路径上移动外齿。将松散的磨料添加到在工作层之间形成的工作间隙中。没有插入其中的工件的载体在工作间隙中移动，以便从工作层中去除材料。

8. 发明申请

US20090203297A1 Semiconductor Wafer, Apparatus and Process For Producing The Semiconductor Wafer 失效
标题翻译：半导体晶片，用于生产半导体晶片的器件和工艺
公开(公告)号：US20090203297A1
公开(公告)日：2009-08-13
申请号：US11941171
申请日：2007-11-16
申请人： Georg Pietsch , Michael Kerstan , Werner Blaha
发明人： Georg Pietsch , Michael Kerstan , Werner Blaha
IPC分类号： B24B7/17 , H01L21/302 , B24B1/00
CPC分类号： H01L21/02013 , B24B7/17 , B24B7/228 , B24D7/14
摘要： The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.
摘要翻译：本发明涉及通过半导体晶片的双面研磨制造半导体晶片的方法，其中半导体晶片在两侧同时研磨，首先通过粗磨，然后使用研磨工具进行精磨。在粗磨和精磨之间的半导体晶片保持定位在研磨机中，并且研磨工具在从粗磨到精磨过渡期间继续施加基本恒定的载荷。本发明还涉及一种用于在2mm×2mm面积的测量窗口和在测量窗口中小于40nm的小于16nm的前表面上具有局部平坦度值的半导体晶片的实施方法和半导体晶片 10毫米×10毫米的面积。

9. 发明申请

US20090104852A1 Carrier, Method For Coating A Carrier, and Method For The Simultaneous Double-Side Material-Removing Machining Of Semiconductor Wafers 有权
标题翻译：载体，涂层载体的方法和半导体晶片的同时双面材料去除加工的方法
公开(公告)号：US20090104852A1
公开(公告)日：2009-04-23
申请号：US12242963
申请日：2008-10-01
申请人： Georg Pietsch , Michael Kerstan
发明人： Georg Pietsch , Michael Kerstan
IPC分类号： B24B1/00 , B24B41/06 , B23P17/00
CPC分类号： B24B37/28 , B24B37/042 , B24B37/08 , B24B37/32 , Y10T29/49
摘要： Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90. The carriers are preferably coated with the second material after chemical surface activation and application of adhesion promoter, and may be used for simultaneous double-side material-removing machining of a plurality of semiconductor wafers.
摘要翻译：适于接收一个或多个半导体晶片以用于研磨，研磨或抛光机器的加工的载体包括具有高硬度的第一材料的芯，所述芯完全或部分地涂覆有第二材料，并且还至少一个用于接收半导体晶片的切口，其中所述第二材料是肖氏A硬度为20-90的热固性聚氨酯弹性体。载体优选在化学表面活化和施加粘合促进剂之后用第二材料涂覆，并且可以用于多个半导体晶片的同时双面材料去除加工。

10. 发明授权

US08512099B2 Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers 有权
标题翻译：多个半导体晶片同时进行双面材料去除处理的方法
公开(公告)号：US08512099B2
公开(公告)日：2013-08-20
申请号：US12581195
申请日：2009-10-19
申请人： Michael Kerstan , Georg Pietsch , Frank Runkel , Conrad von Bechtolsheim , Helge Moeller
发明人： Michael Kerstan , Georg Pietsch , Frank Runkel , Conrad von Bechtolsheim , Helge Moeller
IPC分类号： B24B1/00
CPC分类号： B24B7/17 , B24B37/08 , B24B47/12
摘要： A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner and an outer gear wheel or pin ring, wherein the gear wheels or pin rings have a multiplicity of gear or pin arrangements which engage the teeth of the carrier discs during rolling, at least one of the pin arrangements having a guide which delimits movement of the margin of the carrier disc in at least one axial direction, the guide formed by a circumferential shoulder or a circumferential groove.
摘要翻译：用于平面工件的双面加工的装置具有在其间形成有上下工作盘的工作间隙，该工作间隙包含具有用于工件的切口的托盘，所述托盘具有周向齿，通过该圆周齿滚动内齿轮或外齿轮或销环，其中齿轮或销环具有多个齿轮或销布置，其在滚动期间与承载盘的齿啮合，至少一个销装置具有限定运动的导向件载体盘的边缘在至少一个轴向方向上，引导件由圆周肩部或周向凹槽形成。

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