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1. 发明申请

US20210116637A1 Si Photonic Platform and Photonic Interposer 有权
公开(公告)号：US20210116637A1
公开(公告)日：2021-04-22
申请号：US16658103
申请日：2019-10-20
申请人： Dong Li , Ge Yi
发明人： Dong Li , Ge Yi
IPC分类号： G02B6/12 , G02B6/122 , G02B6/13
摘要： A CMOS compatible material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index material(s) fabricated first on a unpatterned SOI wafer, a bonded system substrate, a set of photonic circuitry made within a SOI layer of the SOI wafer after its substrate and BOX layer removed, and some coupling devices enabling light travelling between the devices made within these two layers. A solution to provide IIIV laser diodes boned and embedded in the system substrate is also proposed. The invention provides a great material platform to offer full set of photonic building blocks for all sort of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field size.

2. 发明申请

US20210080648A1 CMOS Compatible Material Platform for Photonic Integrated Circuits 有权
公开(公告)号：US20210080648A1
公开(公告)日：2021-03-18
申请号：US16571081
申请日：2019-09-14
申请人： Dong Li , Ge Yi
发明人： Dong Li , Ge Yi
IPC分类号： G02B6/12 , H01L25/04 , G02B1/00 , G02B6/42
摘要： A CMOS compatible heterogeneously integrated material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index (contrast) material(s), a bonded single crystal Si layer transfer from either a SOI wafer or a ion implanted single crystal Si wafer ready for ion cut split on top of the bottom layer, and some devices enabling light coupling between the devices made within these two layers. The invention provides a great material platform to offer a full set of photonic building blocks for all sorts of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field.

3. 发明授权

US10935722B1 CMOS compatible material platform for photonic integrated circuits 有权
公开(公告)号：US10935722B1
公开(公告)日：2021-03-02
申请号：US16571081
申请日：2019-09-14
申请人： Dong Li , Ge Yi
发明人： Dong Li , Ge Yi
IPC分类号： G02B6/12 , G02B6/42 , H01L25/04 , G02B1/00
摘要： A CMOS compatible heterogeneously integrated material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index (contrast) material(s), a bonded single crystal Si layer transfer from either a SOI wafer or a ion implanted single crystal Si wafer ready for ion cut split on top of the bottom layer, and some devices enabling light coupling between the devices made within these two layers. The invention provides a great material platform to offer a full set of photonic building blocks for all sorts of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field.

4. 发明申请

US20200382092A1 METHODS OF MAKING ACOUSTIC WAVE DEVICES 审中-公开
公开(公告)号：US20200382092A1
公开(公告)日：2020-12-03
申请号：US16428860
申请日：2019-05-31
申请人： Dong Li , Ying Ma , Ge Yi , Zongrong Liu
发明人： Dong Li , Ying Ma , Ge Yi , Zongrong Liu
IPC分类号： H03H9/02 , H03H9/17
摘要： An acoustic wave device system with its piezoelectric layer originating from a single crystal piezoelectric wafer/substrate is invented along with sets of detailed process steps to fabricate such a device using wafer-to-wafer and/or die-to-wafer bonding technologies. The proposed device system is particularly good to make bulk acoustic wave (BAW) devices. Methods allowing the single crystal piezoelectric wafer/substrate to be re-used are also given. The proposed methods include detailed process steps to allow heterogeneous integration of electrical chips into the system in a very cost efficient manner. The invention provides a practical and low-cost approach to fabricate the radio frequency (RF) front end chip incorporating RF filters and electronic components integrated into a small footprint which is particularly useful for mobile device and RF stations.

5. 发明申请

US20210379234A1 Purified Air Supply System 有权
公开(公告)号：US20210379234A1
公开(公告)日：2021-12-09
申请号：US16946093
申请日：2020-06-05
申请人： Dong Li , Ge Yi
发明人： Dong Li , Ge Yi
IPC分类号： A61L9/20
摘要： A air purification system, whose air flow pipeline made of highly reflective and low absorptive material for UVC or UVB light acts also as a UV light waveguide, with a UVC and/or UVB LED built inside the pipeline, is invented. The system is based on the design concept of maximizing UV light exposure dosage to deactivate all the bioaerosols in the air flow pass through the system. The proposed system can be easily integrated into travel pillow, backbag, handbag, belt bag as well as air supply systems for public and private transport systems. The system provides purified air supply for travelers in the closed environment such as in a airplane, or on a train against various dangerous viruses including COVID-19 and SARS virus. It can also be used in office during flu season as well as provide cleaned air supply to its users against the hay-fever.

6. 发明申请

US20210100924A1 Air Purification System 有权
公开(公告)号：US20210100924A1
公开(公告)日：2021-04-08
申请号：US16592775
申请日：2019-10-04
申请人： Dong Li , Ge Yi
发明人： Dong Li , Ge Yi
IPC分类号： A61L9/20 , B01D53/00 , B01D53/88 , A61L9/014
摘要： A portable or handhold air purification system, whose air flow pipeline made of highly reflective and low absorptive material for UVC or UVB light acts also as a UV light waveguide, is invented. The system is based on the design concept of maximizing UV light exposure dosage to deactivate all the pollutants in the air flow going through to allow the system to use UVC and/or UVB LED. The system also has some features around the middle point of the air flow path to either further increase light exposure, or clean the air flow through the interaction between the specially designed nano particles and incoming UV light. Moreover, an ozone filter and an air heating devices, with energy either from the heat sink of LED's TEC or a device based on plasmonic resonance induced photothermal effects, are placed near the air outlet of the system for further enhancement. The system is very useful for travelers in the closed environment such as in a airplane, or on a train. It can also use in office during flu season as well as provide cleaned air supply to its users against the hay-fever.

7. 发明申请

US20210005572A1 CHIP FRONT SURFACE TOUCHLESS FLIP CHIP BONDERS 有权
公开(公告)号：US20210005572A1
公开(公告)日：2021-01-07
申请号：US16504271
申请日：2019-07-07
申请人： Dong Li , Ying Ma , Ge Yi , Zongrong Liu
发明人： Dong Li , Ying Ma , Ge Yi , Zongrong Liu
IPC分类号： H01L23/00 , H01L21/56 , H01L21/683
摘要： A piece of chip-to-wafer and chip-to-chip bonding equipment, which has innovative designs enabling chip(s) from either a diamagnetic carrier or a diced wafer to expose the chip back side surface for pickup, is invented. The designs either use a levitation technology, or air dynamic, or a novel mechanical design to fulfill the chip front surfaces touchless requirement to avoid the chip surface contamination. The invented chip bonder is particularly useful for bonding applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces or bonding surfaces.

8. 发明授权

US09293694B2 Magnetoresistive random access memory cell with independently operating read and write components 有权
公开(公告)号：US09293694B2
公开(公告)日：2016-03-22
申请号：US13288860
申请日：2011-11-03
申请人： Ge Yi , Shaoping Li , Dong Li , Yunjun Tang , Zongrong Liu
发明人： Ge Yi , Shaoping Li , Dong Li , Yunjun Tang , Zongrong Liu
IPC分类号： G11C11/00 , H01L43/08 , G11C11/16
CPC分类号： H01L43/08 , G11C11/16 , G11C11/161 , G11C11/1675
摘要： A new class of the memory cell is proposed. There are two separated pulse data writing and sensing current paths. The in-plane pulse current is used to flip the magnetization direction of the perpendicular-anisotropy data storage layer sandwiched between a heavy metal writing current-carrying layer and a dielectric layer. The magnetization state within data storage layer is detected by the patterned perpendicular-anisotropy tunneling magnetoresistive (TMR) stack via the output potential of the stack. Two detailed memory cells are proposed: in one proposed cell, the data storage layer is independent from but kept close to the sensing TMR stack, whose magnetization orientation affects magnetization configuration within the free layer of the TMR stack, therefor ultimately affects the output potential of the stack; in the other proposed cell, the perpendicular-anisotropy data storage layer is the free layer of the sensing TMR stack, whose magnetization state will directly affect the output potential of the stack when sensing current passes through.

9. 发明授权

US09218864B1 Magnetoresistive random access memory cell and 3D memory cell array 有权
标题翻译：磁阻随机存取存储单元和3D存储单元阵列
公开(公告)号：US09218864B1
公开(公告)日：2015-12-22
申请号：US14506618
申请日：2014-10-04
申请人： Ge Yi , Dong Li
发明人： Ge Yi , Dong Li
IPC分类号： G11C11/00 , G11C11/16
CPC分类号： G11C11/161 , G11C11/1653 , G11C11/1659 , G11C11/1673 , G11C11/1675 , G11C11/18 , G11C2213/71 , H01L27/228 , H01L43/08
摘要： A novel three-terminal SOT-MRAM memory cell with a unique magnetic stabilization layer or structure is proposed. A complementary magnetic footprint of the data storage layer for the memory cell is able to be created within the magnetic stabilization layer or structure by the magnetic field from the storage layer to enhance the magnetic and thermal stability of the memory cell. Several designs for both perpendicular and in-plane SOT-MRAM memory cell have been invented. With proper wire connection and sensing arrangement, the proposed memory cell is capable of forming not only the 2D array but also 3D array.
摘要翻译：提出了具有独特磁稳定层或结构的新型三端SOT-MRAM存储单元。能够通过来自存储层的磁场在磁稳定层或结构内产生用于存储单元的数据存储层的补充磁足迹，以增强存储单元的磁稳定性和热稳定性。已经发明了用于垂直和平面内的SOT-MRAM存储器单元的几种设计。通过适当的导线连接和传感装置，所提出的存储单元不仅可以形成2D阵列，而且可以形成3D阵列。

10. 发明授权

US11626312B2 Metal spring anchor for advanced packaging 有权
公开(公告)号：US11626312B2
公开(公告)日：2023-04-11
申请号：US16987240
申请日：2020-08-06
申请人： Dong Li , Ge Yi
发明人： Dong Li , Ge Yi
IPC分类号： H01L21/687 , H01L21/68 , H01L21/673 , H01L21/67
摘要： An Fan-out packaging system, comprising dedicated frame with associated movable metallic spring feature(s) for incoming known-good-die (KGD), is invented. The movable spring anchor(s) along with the boundaries of the frame locks the KGD in its designated position during EMC implementation and subsequent processes. In this system/approach, the position accuracy of KGDs during the wafer reconstitution process will be mostly dominated by the dicing accuracy. The proposed system is a very low cost approach as it does not need the expensive software/tool set and does not have a low throughput site-to-site lithography correction during exposure after metrology is carried out for every flash field. This system is particularly useful for chiplet consisting of component chips from different technologies and from substrate made of different material. The frames can be further used as part of function component for the packaged system either as electromagnetic shield, or heat dissipation/heat sink, or even RF antenna as well as other passive devices or active components.

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