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    • 1. 发明授权
    • Method and device for treating holes or recesses extending into workpieces with liquid treatment media
    • 用液体处理介质处理延伸到工件中的孔或凹槽的方法和装置
    • US06240934B1
    • 2001-06-05
    • US09036107
    • 2000-08-16
    • Franz DurstGunter BrennMichael SchaferHeinrich MeyerHeribert Streup
    • Franz DurstGunter BrennMichael SchaferHeinrich MeyerHeribert Streup
    • B08B302
    • C25D5/08B08B3/02B08B3/022H05K3/0088
    • The treatment, for example the cleaning of holes or recesses in workpieces, is problematic when the holes or recesses have an opening width of below 0.5 mm, and especially when the latter do not penetrate the workpiece (blind bores). In known methods, gas bubbles adhering to the side-walls of holes of this type cannot be removed or liquids situated within the holes cannot be effectively exchanged. With the method according to the invention an effective exchange of the liquid contained in the holes and situated outwith the holes is made possible. For this purpose the liquid treatment means is sprayed as a jet into the holes, said jet having a diameter which is smaller than that of the holes. Furthermore, a device is described for carrying out this method which is characterised by a nozzle with one or several nozzle discharge openings with a diameter below 0.5 mm, by a liquid supply unit by means of which liquid treatment medium is pumped through the nozzle discharge openings and by a filter unit, communicating with the openings and the feeder unit, for removing particles from the treatment medium.
    • 当孔或凹部的开口宽度小于0.5mm时,特别是当后者不穿透工件(盲孔)时,处理,例如清洁工件中的孔或凹槽是有问题的。 在已知的方法中,粘附在这种类型的孔的侧壁上的气泡不能被去除,或者位于孔内的液体不能被有效地交换。根据本发明的方法,有效地交换包含在孔中的液体并且位于 使得孔成为可能。 为此目的,将液体处理装置作为射流喷射到孔中,所述射流的直径小于孔的直径。此外,描述了一种用于执行该方法的装置,其特征在于具有一个或 通过液体供应单元将液体处理介质泵送通过喷嘴排出口和通过与开口和进料器单元连通的过滤器单元,从而从中除去颗粒的几个喷嘴排出开口 处理介质。
    • 2. 发明授权
    • Process for metallization of a nonconductor surface
    • 非导体表面的金属化工艺
    • US5693209A
    • 1997-12-02
    • US518575
    • 1995-08-23
    • Burkhard BresselHeinrich MeyerWalter MeyerKlaus Gedrat
    • Burkhard BresselHeinrich MeyerWalter MeyerKlaus Gedrat
    • C08G61/12C25D5/56H05K3/18
    • H05K3/188C08G61/123C25D5/56H05K2203/0796Y10S205/92
    • The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.
    • 用于直接金属化具有非导体表面的电路板的方法包括使非导体表面与碱性高锰酸盐溶液反应以形成化学吸附在非导体表面上的二氧化锰; 形成弱酸和吡咯或吡咯衍生物及其可溶性低聚物的水溶液; 使含有吡咯单体及其低聚物的水溶液与其上具有化学吸附的二氧化锰的非导体表面接触,以在非导体表面上沉积粘附的导电不溶性聚合物产物; 并在其上形成有不溶性粘附聚合物产物的非导体表面上直接电沉积金属。 低聚物有利地在室温至溶液凝固点之间的温度下形成含有0.1至200g / l吡咯单体的水溶液。
    • 6. 发明授权
    • Process for manufacturing inductive counting systems
    • 制造感应计数系统的过程
    • US6120672A
    • 2000-09-19
    • US068404
    • 1998-06-05
    • Franz KohnleHeinrich MeyerGonzalo Urrutia Desmaison
    • Franz KohnleHeinrich MeyerGonzalo Urrutia Desmaison
    • G06K19/07B42D15/10C23C18/16C23C18/18G06K19/067G06K19/077H05K3/18C23C28/00
    • H05K3/184C23C18/1605C23C18/1653G06K19/067
    • A process is described for producing inductively operating counting systems by forming a conducting structure on an electrically non-conducting substrate, comprising a step involving the application of a suitable catalyst for the currentless deposition of metals onto the electrically non-conducting substrate as well as conventional pretreatment and post-treatment steps. The following process steps are essential for the process according to the invention:1) Application of a liquid photoresist, the liquid photoresist being printed only onto the surface not subsequently covered by the conductive pattern and onto the fine-structured portions of the conduction pattern,2) Subsequent photostructuring of the fine-structured portions of the conductive pattern by illumination and subsequent developing,3) Subsequent currentless deposition of a first thin metallic layer onto the exposed, catalytically coated surface regions,4) Subsequent electrolytic deposition of a second metallic layer onto the first metallic layer, and5) Subsequent application of a decorative protective lacquer or varnish film.
    • PCT No.PCT / EP97 / 00845 Sec。 371日期:1998年6月5日 102(e)1998年6月5日PCT 1997年2月21日提交PCT公布。 公开号WO97 / 39163 日期1997年10月23日描述了一种用于通过在非导电衬底上形成导电结构来生产电感计数系统的方法,其包括施加合适的催化剂以将金属无电镀沉积到非导电 底物以及常规的预处理和后处理步骤。 以下工艺步骤对于根据本发明的方法是必需的:1)液体光致抗蚀剂的应用,液态光致抗蚀剂仅被印刷在随后被导电图案覆盖的表面上和导电图案的精细结构部分上, 2)通过照明和随后的显影对导电图案的精细结构部分进行随后的光结构,3)随后无电镀沉积第一薄金属层到暴露的,催化涂覆的表面区域上,4)随后的电解沉积第二金属层 在第一金属层上,以及5)随后应用装饰性保护漆或清漆膜。
    • 7. 发明授权
    • Process for the electrolytic deposition of metal layers
    • 金属层电解沉积工艺
    • US6099711A
    • 2000-08-08
    • US66313
    • 1998-04-23
    • Wolfgang DahmsHeinrich MeyerStefan Kretschmer
    • Wolfgang DahmsHeinrich MeyerStefan Kretschmer
    • C25D3/38C25D5/18H05K3/24C25D21/18
    • C25D3/38C25D5/18H05K3/241Y10S205/92
    • The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes and applying direct current, only uneven metal distribution can be attained on complex shaped workpieces. By using a pulse current or pulse voltage method, the problem of the coatings being of varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes. In order to guarantee sufficient stability of the anodes and a bright coating even at those points on the workpiece surfaces, onto which the metal is deposited with high current density, it is essential to add compounds of an electrochemically reversible redox system to the depositing solution.
    • PCT No.PCT / EP96 / 05140 Sec。 371日期:1998年4月23日 102(e)1998年4月23日PCT 1996年11月21日PCT PCT。 出版物WO97 / 19206 日期1997年5月29日本发明涉及金属涂层的电解沉积方法,特别是具有一定物理机械和光学性质以及均匀涂层厚度的铜涂层的电解沉积方法。 根据已知的使用可溶性阳极并施加直流电流的方法,在复杂形状的工件上只能获得不均匀的金属分布。 通过使用脉冲电流或脉冲电压法,可以确实减少涂层在工件表面各处的厚度变化的问题。 然而,在沉积过程中通过溶解阳极的几何比例的连续变化的另外的问题并不解决。 这可以通过使用不溶性阳极来避免。 为了确保阳极和光亮涂层的稳定性,即使在工件表面上的这些点,金属以高电流密度沉积在其上,必须将电化学上可逆的氧化还原体系的化合物添加到沉积溶液中。
    • 9. 发明授权
    • Rubber mounting with hydraulic damping
    • 橡胶安装带液压阻尼
    • US4697794A
    • 1987-10-06
    • US851879
    • 1986-04-11
    • Heinz BrennerHeinrich MeyerKurt Schmidt
    • Heinz BrennerHeinrich MeyerKurt Schmidt
    • B60K5/12F16F9/10F16F13/00F16F13/10F16F13/12F16F13/18B60G15/04F16M13/00
    • F16F13/105
    • A resilient mounting, such as a rubber mounting, with hydraulic damping, in particular for mounting engines of motor vehicles, has two rigid end walls which are disposed opposite to each other in the axial direction, and at least two chambers which are disposed axially one behind the other and which contain damping fluid. The chambers are separated by a rigid partitioning wall. The chambers communicate with each other through a flow passage which extends in an annular configuration around the axis of the mounting, the flow passage being formed in the rigid partitioning wall. The rigid partitioning wall is arranged radially inwardly of, and supported by, an elastic, axially movable diaphragm which is fixedly and sealingly clamped at its outer periphery. At least one of the chambers is defined in part by a rubber-elastic spring member constituting part of the generally peripheral wall of the chamber. Travel-limiting surfaces may be provided at the periphery of the rigid partitioning wall, outboard of its connection to the diaphragm, so as to control movement of the rigid partitioning wall.
    • 具有液压阻尼,特别是用于安装机动车辆的发动机的橡胶安装件的弹性安装具有沿轴向彼此相对设置的两个刚性端壁和至少两个轴向布置的室 在另一个之后并且包含阻尼流体。 室由刚性分隔壁分开。 这些腔室通过一个流动通道彼此连通,该流动通道围绕安装件的轴线以环形构型延伸,流动通道形成在刚性分隔壁中。 刚性分隔壁布置在弹性的可轴向移动的隔膜的径向内侧并由其支撑,该隔膜在其外周被固定和密封地夹紧。 至少一个室由构成室的大致周壁的一部分的橡胶弹簧构件部分地限定。 行程限制表面可以设置在刚性分隔壁的外围,其与隔膜的连接外侧,以便控制刚性分隔壁的运动。
    • 10. 发明授权
    • Axially damping hydraulic mount
    • 轴向阻尼液压支架
    • US08783667B2
    • 2014-07-22
    • US13133965
    • 2009-12-01
    • Heinrich MeyerDetlev HagedornStefan Vollmann
    • Heinrich MeyerDetlev HagedornStefan Vollmann
    • F16F13/18
    • F16F13/22F16F13/106
    • Axially damping hydraulic mount is provided, relating to elastomer mounts for engine mounts for damping the vibrations transmitted from internal combustion engine to the body and for acoustic decoupling. The hydraulic mount includes a frustoconical elastomer support spring, between mount core and upper part of outer jacket, with a working chamber and a compensating chamber for fluid damping medium. Chambers are separated from one another by a separator extending transversely to the mount axis and includes a coupling diaphragm, wherein the working chamber is enclosed by support spring and separating element. Compensating chamber is enclosed by separating element and elastomer bellows. A duct on the separating element is enclosed by a duct part. To counteract excessive increase in dynamic spring rate when frequencies of axially acting vibrations are present, the duct part is occupied by an additional mass. Then the duct part is rigidly connected to a mass element.
    • 提供了轴向阻尼液压支架,涉及用于发动机支架的弹性体支架,用于阻尼从内燃机传递到车身的振动和用于声学解耦。 液压支架包括一个截头圆锥形弹性体支撑弹簧,位于安装芯和外护套的上部之间,具有工作室和用于流体阻尼介质的补偿室。 室通过横向于安装轴线延伸的分离器彼此分开,并且包括耦合隔膜,其中工作室由支撑弹簧和分离元件包围。 补偿室由分离元件和弹性体波纹管封闭。 分离元件上的管道被管道部分包围。 为了克服轴向作用振动的频率存在时动态弹簧刚度的过度增加,管道部分被另外的质量占据。 然后,管道部分刚性地连接到质量元件。