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    • 1. 发明授权
    • Method of forming metal ion transistor
    • 形成金属离子晶体管的方法
    • US07998828B2
    • 2011-08-16
    • US12725817
    • 2010-03-17
    • Fen ChenArmin Fischer
    • Fen ChenArmin Fischer
    • H01L21/34H01L29/12H01L27/148H01L51/40H01L21/335H01L21/8232H01L21/339H01L21/00H01L21/84H01L21/76H01L21/20H01L21/36
    • H01L45/00
    • A method of forming a metal ion transistor comprises forming a first electrode in a first isolation layer; forming a second isolation layer over the first isolation layer; forming a first cell region of a low dielectric constant (low-k) dielectric over the first electrode in the second isolation layer, the first cell region isolated from the second isolation layer; forming a cap layer over the second isolation layer and the first cell region, at least thinning the cap layer over the first cell region; depositing a layer of the low-k dielectric over the second isolation layer and the first cell region; forming metal ions in the low-k dielectric layer; patterning the low-k dielectric layer to form a second cell region; sealing the second cell region using a liner; and forming a second electrode contacting the second cell region and a third electrode contacting the second cell region.
    • 一种形成金属离子晶体管的方法包括在第一隔离层中形成第一电极; 在所述第一隔离层上形成第二隔离层; 在所述第二隔离层中的所述第一电极上形成低介电常数(低k)电介质的第一电池区,所述第一电池区与所述第二隔离层隔离; 在所述第二隔离层和所述第一单元区域上形成盖层,至少使所述盖层在所述第一单元区域上变薄; 在所述第二隔离层和所述第一单元区域上沉积所述低k电介质层; 在低k电介质层中形成金属离子; 图案化低k电介质层以形成第二电池区; 使用衬垫密封第二电池区域; 以及形成与第二单元区域接触的第二电极和与第二单元区域接触的第三电极。
    • 2. 发明申请
    • PROGRAMMABLE RESISTOR, SWITCH OR VERTICAL MEMORY CELL
    • 可编程电阻器,开关或垂直存储器单元
    • US20080173975A1
    • 2008-07-24
    • US11625607
    • 2007-01-22
    • Fen ChenArmin FischerJason P. Gill
    • Fen ChenArmin FischerJason P. Gill
    • H01L29/00H01L21/02
    • H01L45/1266H01L27/2463H01L45/085H01L45/1233H01L45/14H01L45/145H01L45/1616H01L45/1683
    • Disclosed are embodiments of a device and method of forming the device that utilize metal ion migration under controllable conditions. The device embodiments comprise two metal electrodes separated by one or more different dielectric materials. One electrode is sealed from the dielectric material, the other is not. The device is adapted to allow controlled migration of embedded metal ions from the unsealed electrode into dielectric material to form a conductive path under field between the electrodes and, thereby, to decrease the resistance of the dielectric material. Reversing the field causes the metal ions to reverse their migration, to break the conductive metallic path between the electrodes and, thereby, to increase the resistance of the dielectric material. Thus, the device can comprise a simple switch or programmable resistor. Additionally, by monitoring the resistance change, a two-state, two-terminal, silicon technology-compatible, flash memory device with a very simple tuning process can be created.
    • 披露了在可控条件下形成利用金属离子迁移的装置的装置和方法的实施例。 器件实施例包括由一种或多种不同电介质材料隔开的两个金属电极。 一个电极与介电材料密封,另一个不是。 该器件适于允许将嵌入的金属离子从非密封电极受控地迁移到电介质材料中,以形成电极之间的导电路径,从而降低电介质材料的电阻。 反转场导致金属离子反向迁移,以破坏电极之间的导电金属路径,从而增加电介质材料的电阻。 因此,该装置可以包括简单的开关或可编程电阻器。 另外,通过监控电阻变化,可以创建具有非常简单的调整过程的两状态,两端,硅技术兼容的闪存器件。
    • 3. 发明授权
    • Metal ion transistor
    • 金属离子晶体管
    • US07859025B2
    • 2010-12-28
    • US11951579
    • 2007-12-06
    • Fen ChenArmin Fischer
    • Fen ChenArmin Fischer
    • H01L45/00
    • H01L45/00
    • A metal ion transistor and related methods are disclosed. In one embodiment, the metal ion transistor includes a cell positioned in at least one isolation layer, the cell including a metal ion doped low dielectric constant (low-k) dielectric material sealed from each adjacent isolation layer; a first electrode contacting the cell on a first side; a second electrode contacting the cell on a second side; and a third electrode contacting the cell on a third side, wherein each electrode is isolated from each other electrode.
    • 公开了一种金属离子晶体管及相关方法。 在一个实施例中,金属离子晶体管包括位于至少一个隔离层中的电池,该电池包括从每个相邻隔离层密封的金属离子掺杂低介电常数(低k)电介质材料; 在第一侧上与第一电极接触的第一电极; 在第二侧接触所述电池的第二电极; 以及在第三侧与第一电极接触的第三电极,其中每个电极彼此隔离。
    • 4. 发明申请
    • METHOD OF FORMING METAL ION TRANSISTOR
    • 形成金属离子晶体管的方法
    • US20100184280A1
    • 2010-07-22
    • US12725817
    • 2010-03-17
    • Fen ChenArmin Fischer
    • Fen ChenArmin Fischer
    • H01L21/335
    • H01L45/00
    • A method of forming a metal ion transistor comprises forming a first electrode in a first isolation layer; forming a second isolation layer over the first isolation layer; forming a first cell region of a low dielectric constant (low-k) dielectric over the first electrode in the second isolation layer, the first cell region isolated from the second isolation layer; forming a cap layer over the second isolation layer and the first cell region, at least thinning the cap layer over the first cell region; depositing a layer of the low-k dielectric over the second isolation layer and the first cell region; forming metal ions in the low-k dielectric layer; patterning the low-k dielectric layer to form a second cell region; sealing the second cell region using a liner; and forming a second electrode contacting the second cell region and a third electrode contacting the second cell region.
    • 一种形成金属离子晶体管的方法包括在第一隔离层中形成第一电极; 在所述第一隔离层上形成第二隔离层; 在所述第二隔离层中的所述第一电极上形成低介电常数(低k)电介质的第一电池区,所述第一电池区与所述第二隔离层隔离; 在所述第二隔离层和所述第一单元区域上形成盖层,至少使所述盖层在所述第一单元区域上变薄; 在所述第二隔离层和所述第一单元区域上沉积所述低k电介质层; 在低k电介质层中形成金属离子; 图案化低k电介质层以形成第二电池区; 使用衬垫密封第二电池区域; 以及形成与第二单元区域接触的第二电极和与第二单元区域接触的第三电极。
    • 6. 发明授权
    • Analyzing EM performance during IC manufacturing
    • 分析IC制造过程中的EM性能
    • US08917104B2
    • 2014-12-23
    • US13222306
    • 2011-08-31
    • Fen ChenRoger A. DufresneKai D. FengRichard J. St-Pierre
    • Fen ChenRoger A. DufresneKai D. FengRichard J. St-Pierre
    • G01R31/3187G01R31/28
    • G01R31/2858
    • A testing structure, system and method for monitoring electro-migration (EM) performance. A system is described that includes an array of testing structures, wherein each testing structure includes: an EM resistor having four point resistive measurement, wherein a first and second terminals provide current input and a third and fourth terminals provide a voltage measurement; a first transistor coupled to a first terminal of the EM resistor for supplying a test current; the voltage measurement obtained from a pair of switching transistors whose gates are controlled by a selection switch and whose drains are utilized to provide a voltage measurement across the third and fourth terminals. Also included is a decoder for selectively activating the selection switch for one of the array of testing structures; and a pair of outputs for outputting the voltage measurement of a selected testing structure.
    • 用于监测电迁移(EM)性能的测试结构,系统和方法。 描述了包括测试结构阵列的系统,其中每个测试结构包括:具有四点电阻测量的EM电阻器,其中第一和第二端子提供电流输入,第三和第四端子提供电压测量; 耦合到所述EM电阻器的第一端子以提供测试电流的第一晶体管; 由一对开关晶体管获得的电压测量,其栅极由选择开关控制,并且其漏极用于在第三和第四端子处提供电压测量。 还包括用于选择性地激活测试结构阵列之一的选择开关的解码器; 以及用于输出所选择的测试结构的电压测量的一对输出。