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    • 1. 发明申请
    • PROCESSING SYSTEM AND METHOD OF OPERATING A PROCESSING SYSTEM
    • 处理系统和操作处理系统的方法
    • US20110299961A1
    • 2011-12-08
    • US13000354
    • 2009-04-07
    • Ralph LindenbergErkan KoparalThomas Berger
    • Ralph LindenbergErkan KoparalThomas Berger
    • B65H5/00H01L21/677
    • H01L21/67748H01L21/67173
    • A coating system 1 comprises a swing station 2 including a swing module and an arrangement of chambers. The arrangement of chambers comprises a lock chamber 3 and a first coating chamber 4. The lock chamber 3 is configured as a combined lock-in/lock-out chamber. The arrangement of chambers has a first substantially linear transport path T1 indicated by dashed lines, and a second substantially linear transport path T2 indicated by dashed lines. The arrangement of the paths T1 and T2 establishes a dual track. The system 1 includes a transport system for moving a substrate through the arrangement of chambers 3, 4 along the first transport path T1 and/or along the second transport path T2 as indicated by arrows. One or particularly both chambers 3 and 4 comprise transfer means for transferring the substrate/carrier from the first path T1 to the second path T2 by a lateral movement of a dual or triple track section and/or from the second path T2 to the first path T1.
    • 涂覆系统1包括包括摆动模块和室的排列的摆动站2。 室的布置包括锁定室3和第一涂覆室4.锁定室3被构造为组合的锁定/锁定室。 室的布置具有由虚线表示的第一基本上线性的传输路径T1和由虚线表示的第二基本上线性的传输路径T2。 路径T1和T2的布置建立双轨。 系统1包括用于沿着第一传送路径T1和/或沿箭头所示的第二传送路径T2移动基板通过室3,4的布置的传送系统。 一个或特别是两个腔室3和4包括传送装置,用于通过双轨道或三轨道部分的横向移动和/或从第二路径T2到第一路径将衬底/载体从第一路径T1传送到第二路径T2 T1。
    • 2. 发明申请
    • PROCESSING SYSTEM AND METHOD OF OPERATING A PROCESSING SYSTEM
    • 处理系统和操作处理系统的方法
    • US20090324368A1
    • 2009-12-31
    • US12163498
    • 2008-06-27
    • Erkan KoparalRalph LindenbergThomas Berger
    • Erkan KoparalRalph LindenbergThomas Berger
    • B65H1/00
    • H01L21/67748H01L21/67173
    • A coating system comprises a swing station including a swing module and an arrangement of chambers. The arrangement of chambers comprises a lock chamber and a first coating chamber. The lock chamber is configured as a combined lock-in/lock-out chamber. The arrangement of chambers has a first substantially linear transport path indicated by dashed lines, and a second substantially linear transport path indicated by dashed lines. The arrangement of the paths establishes a dual track. The system includes a transport system for moving a substrate through the arrangement of chambers, along the first transport path and/or along the second transport path as indicated by arrows. One or particularly both chambers comprise transfer means for transferring the substrate/carrier from the first path to the second path by a lateral movement and/or from the second path to the first path.
    • 一种涂覆系统包括一个包括摆动模块和一个室的排列的摆动站。 腔室的布置包括锁定室和第一涂覆室。 锁定室被配置为组合的锁定/锁定室。 室的布置具有由虚线表示的第一基本上线性的传输路径和由虚线表示的第二基本上线性的传输路径。 路径的布置建立了双轨道。 该系统包括用于沿着第一输送路径和/或沿箭头所示的第二输送路径移动基板通过室的布置的输送系统。 一个或特别是两个腔室包括用于通过横向移动和/或从第二路径将衬底/载体从第一路径转移到第二路径的传送装置。
    • 4. 发明授权
    • Coating apparatus and method
    • 涂布装置及方法
    • US09211563B2
    • 2015-12-15
    • US14000369
    • 2012-02-21
    • Erkan KoparalAndreas Kloeppel
    • Erkan KoparalAndreas Kloeppel
    • B05C13/00B05D7/00C23C14/56H01L21/67H01L21/677
    • B05C13/00B05D7/56C23C14/568H01L21/67173H01L21/67712H01L21/6776
    • A substrate processing system for processing an essentially vertically oriented substrate is described. The system includes a first processing chamber having a first processing region to deposit a first layer comprising a first material, a second processing chamber having a second processing region to deposit a second layer over the first layer, the second layer comprising a second material, a third processing chamber having a third processing region to deposit a layer comprising the second material, a transfer chamber providing essentially linear transport paths with the first, second, and third chambers, respectively, and a chamber comprising a first and a second transportation track, wherein at least one of the first and second transportation tracks forms an essentially linear transportation path with the first processing chamber, wherein the first chamber is adapted to receive the substrate from the transfer chamber, and to deposit a further layer comprising the first material.
    • 描述了用于处理基本垂直取向的基板的基板处理系统。 该系统包括具有第一处理区域的第一处理室,以沉积包括第一材料的第一层,具有第二处理区域的第二处理室以在第一层上沉积第二层,第二层包括第二材料, 第三处理室具有第三处理区域以沉积包含第二材料的层,传送室分别与第一,第二和第三室提供基本上线性的输送路径,以及包括第一和第二输送轨道的室,其中 所述第一和第二输送轨道中的至少一个与所述第一处理室形成基本上线性的输送路径,其中所述第一室适于从所述转移室接收所述基板,并沉积包括所述第一材料的另外的层。
    • 5. 发明申请
    • COATING SYSTEM AND METHOD FOR COATING A SUBSTRATE
    • 用于涂覆基材的涂覆系统和方法
    • US20090304907A1
    • 2009-12-10
    • US12135581
    • 2008-06-09
    • Erkan Koparal
    • Erkan Koparal
    • C23C16/00B05D5/12
    • C23C14/568C23C14/566
    • A coating system comprises a lock-in chamber and a lock-out chamber. Furthermore, the coating system comprises a first transfer chamber connected with the lock-in chamber and the lock-out chamber. In the transfer chamber a first rotatable transfer module is arranged. The substrate holders may be rotated around a central axis such that substrate holders may be positioned in alignment with the lock-in chamber and the lock-out chamber, respectively. The coating station further includes a first process chamber and a second process chamber. Furthermore, the coating system includes a second transfer chamber having a second rotatable transfer module including a third substrate holder and a fourth substrate holder. The second transfer chamber is connected with the first process chamber and the second process chamber as well as a third process chamber and a fourth process chamber. The third process chamber and the fourth process chamber are arranged parallel, i.e., like a cluster arrangement, at the second transfer chamber. The invention provides for a possibility to increase the availability of the system by a sandwich arrangement of two parallel coating chambers and arranged on a forward path and a return path, respectively, between two transfer chambers which are configured to transfer the substrate from the forward path to the return path and vice versa.
    • 涂覆系统包括锁定室和锁定室。 此外,涂覆系统包括与锁定室和锁定室连接的第一传送室。 在传送室中布置有第一可旋转传递模块。 衬底保持器可以围绕中心轴线旋转,使得衬底保持器可以分别定位成与锁定室和锁定室对准。 涂装站还包括第一处理室和第二处理室。 此外,涂覆系统包括具有第二可旋转传递模块的第二传送室,第二转移模块包括第三基板保持​​器和第四基板保持器。 第二传送室与第一处理室和第二处理室连接,以及第三处理室和第四处理室。 第三处理室和第四处理室在第二传送室处平行布置,即如簇排列。 本发明提供了通过两个平行涂覆室的夹层结构来增加系统的可用性的可能性,并且分别布置在两个传送室之间的前向路径和返回路径上,这两个传送室被配置为从前向路径 到返回路径,反之亦然。
    • 6. 发明申请
    • Machine for treating substrates and method
    • 用于处理底物和方法的机器
    • US20070144889A1
    • 2007-06-28
    • US11580721
    • 2006-10-13
    • Erkan KoparalDieter Haas
    • Erkan KoparalDieter Haas
    • C23C14/32C23C14/00C23C16/00
    • C23C16/54C23C14/568
    • A machine 1 for treating substrates S comprises an infeed area 6, at least a first process chamber 2, a second process chamber 3, a third process chamber 4, and a fourth process chamber 8 for the execution of a treatment, for example the application of a coating to a substrate S for coating, as well as an outfeed area 7. The four process chambers 2,3, 4 and 8 are connected to a central transport chamber 5. The first process chamber 2 fourth process chamber 8 are each arranged between one of the lock areas 6 or 7 and the central transport chamber 5 in series. The second process chamber 3 and the third process chamber 4 are connected in parallel and independently accessible from each other to the central transport chamber. The treatment method comprises the stages: a) infeed of a substrate into the machine 1; b) transport of the substrate S into the first process chamber 2 and execution of a first treatment stage; c) transport of the substrate S into the central transport chamber 5; d) transport of the substrate S alternatively into the second process chamber 3 or the third process chamber 4, and execution of a second treatment stage; e) transport of the substrate S into the central transport chamber 5; and g) outfeed of the substrate S from the machine 1.
    • 用于处理基板S的机器1包括进给区域6,至少第一处理室2,第二处理室3,第三处理室4和用于执行处理的第四处理室8,例如应用 涂布到用于涂布的基材S上的涂层以及出料区域7。 四个处理室2,3,4和8连接到中央传送室5。 第一处理室2的第四处理室8分别布置在锁定区域6或7中的一个和中央传送室5之间。 第二处理室3和第三处理室4并联连接并且彼此独立地接近中央传送室。 处理方法包括以下阶段:a)将基材送入机器1; b)将基板S输送到第一处理室2中并执行第一处理台; c)将衬底S运送到中央传送室5中; d)将衬底S交替地输送到第二处理室3或第三处理室4中,并执行第二处理阶段; e)将衬底S运送到中央传送室5中; 和g)从机器1输出基片S.
    • 7. 发明申请
    • COATING APPARATUS AND METHOD
    • 涂装装置及方法
    • US20140044880A1
    • 2014-02-13
    • US14000369
    • 2012-02-21
    • Erkan KoparalAndreas Kloeppel
    • Erkan KoparalAndreas Kloeppel
    • B05C13/00B05D7/00
    • B05C13/00B05D7/56C23C14/568H01L21/67173H01L21/67712H01L21/6776
    • A substrate processing system for processing an essentially vertically oriented substrate is described. The system includes a first processing chamber having a first processing region to deposit a first layer comprising a first material, a second processing chamber having a second processing region to deposit a second layer over the first layer, the second layer comprising a second material, a third processing chamber having a third processing region to deposit a layer comprising the second material, a transfer chamber providing essentially linear transport paths with the first, second, and third chambers, respectively, and a chamber comprising a first and a second transportation track, wherein at least one of the first and second transportation tracks forms an essentially linear transportation path with the first processing chamber, wherein the first chamber is adapted to receive the substrate from the transfer chamber, and to deposit a further layer comprising the first material.
    • 描述了用于处理基本垂直取向的基板的基板处理系统。 该系统包括具有第一处理区域的第一处理室,以沉积包括第一材料的第一层,具有第二处理区域的第二处理室以在第一层上沉积第二层,第二层包括第二材料, 第三处理室具有第三处理区域以沉积包含第二材料的层,传送室分别与第一,第二和第三室提供基本上线性的输送路径,以及包括第一和第二输送轨道的室,其中 所述第一和第二输送轨道中的至少一个与所述第一处理室形成基本上线性的输送路径,其中所述第一室适于从所述转移室接收所述基板,并沉积包括所述第一材料的另外的层。