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1. 发明授权

US07240420B1 System and method for post-fabrication reduction of minimum feature size spacing of microcomponents 失效
标题翻译：微元件最小特征尺寸间距后制造的系统和方法
公开(公告)号：US07240420B1
公开(公告)日：2007-07-10
申请号：US09884205
申请日：2001-06-19
申请人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
发明人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
IPC分类号： B81B5/00
CPC分类号： B81B3/0054 , B81B2201/037 , Y10T29/5313
摘要： A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation space therebetween. At least one of the microcomponents includes an extension part that is operable to reduce the separation space. Such an extension part may include an extension member that is movably extendable away from its associated microcomponent to reduce the separation space between its associated microcomponent and another microcomponent. The extension part may be latched at a desired position by a latching mechanism. The extension part may be implemented such that the extension member eliminates the separation space, thereby resulting in such extension member engaging another microcomponent. Such engagement may be achieved without requiring power to be applied to the microcomponents. Certain embodiments are insensitive to etching inaccuracy encountered during fabrication.
摘要翻译：公开了一种系统和方法，其使后期制造减少了微型部件的最小特征尺寸间距。提供了一种用于制造微组件组件的方法，其中制造了至少两个在其间具有分隔空间的微组件。微组件中的至少一个包括可操作以减小分离空间的延伸部分。这种延伸部分可以包括可移动地延伸远离其相关联的微型部件的延伸部件，以减小其相关的微型部件和另一微型部件之间的分离空间。延伸部分可以通过闭锁机构锁定在期望的位置。延伸部件可以被实现为使得延伸部件消除分离空间，从而导致这种延伸部件与另一个微型部件接合。可以在不需要将功率施加到微型部件的情况下实现这种接合。某些实施例对制造期间遇到的蚀刻不精确性不敏感。

2. 发明授权

US06677225B1 System and method for constraining totally released microcomponents 失效
标题翻译：限制全部释放微量元件的系统和方法
公开(公告)号：US06677225B1
公开(公告)日：2004-01-13
申请号：US09616500
申请日：2000-07-14
申请人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
发明人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
IPC分类号： H01L2144
CPC分类号： B81B3/0051 , B81B2203/053 , B81B2203/055
摘要： A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a “pallet” having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.
摘要翻译：公开了限制从基板完全释放以处理这种完全释放的微型部件的微组件的系统和方法。优选的实施方案提供了将完全释放的微量组分约束到碱（例如另一微量组分或底物）的系统和方法。例如，优选的实施方案提供了限制构件，其用于将微组件约束至基底，因为微量组分完全从这种基底释放。因此，这样的约束构件可以在制造期间从其衬底释放这种微组件期间有助于保护微组件与其衬底。此外，优选实施例提供了约束构件，其适用于将完全释放的微组件约束到基座以用于微组件的后制造处理。为了进一步帮助完全释放的微型部件的后制造处理，优选实施例可以被实现为具有一个或多个微部件约束的“托盘”。此外，优选实施例的约束构件使得当需要时可以从完全释放的微组件从这种约束中移除，但是防止完全释放的微元件不经意地逃避这样的约束。例如，在一个实施例中，约束构件被实现为可移动的构件，其可以被移动以从其底部不受约束的完全释放的微元件。

3. 发明授权

US06510359B1 Method and system for self-replicating manufacturing stations 失效
标题翻译：自动复制制造站的方法和系统
公开(公告)号：US06510359B1
公开(公告)日：2003-01-21
申请号：US09569330
申请日：2000-05-11
申请人： Ralph C. Merkle , Eric G. Parker , George D. Skidmore
发明人： Ralph C. Merkle , Eric G. Parker , George D. Skidmore
IPC分类号： G06F1900
CPC分类号： G05B19/4188 , G05B19/41805 , G05B2219/40261 , G05B2219/45031 , Y02P90/04 , Y02P90/24 , Y10S977/70 , Y10S977/882 , Y10S977/887
摘要： A system and method which provide a non-biological self replicating manufacturing system (“SRMS”) are disclosed. A preferred embodiment provides an SRMS that enables assembly stations to replicate. In a preferred embodiment, positional assembly is utilized by one or more assembly stations to construct like assembly stations. Furthermore, in a most preferred embodiment, such assembly stations are small scale devices that are capable of working with small scale parts, such as micron-scale, nanometer-scale or even molecular-scale parts, in order to construct like assembly devices. The SRMS of a preferred embodiment performs surface-to-surface assembly. For example, an assembly station on a first surface (e.g., wafer), Surface A, constructs a like assembly station on another surface (e.g., wafer), Surface B. Most preferably, the assembly stations replicate at an exponential rate.
摘要翻译：公开了一种提供非生物自我复制制造系统（“SRMS”）的系统和方法。优选实施例提供了使组装站能够复制的SRMS。在优选实施例中，一个或多个组装工位利用位置组合来构造类似的组装工位。此外，在最优选的实施例中，这样的组装工位是能够与诸如微米尺度，纳米尺度或甚至分子尺度部件之类的小尺寸部件一起工作的小型装置，以便构造类似的装配装置。优选实施例的SRMS执行表面到表面组装。例如，在第一表面（例如，晶片）表面A上的组装站在另一表面（例如，晶片），表面B上构造类似的组装工位。最优选地，组装工位以指数速率复制。

4. 发明授权

US06398280B1 Gripper and complementary handle for use with microcomponents 有权
标题翻译：夹具和互补手柄用于微型组件
公开(公告)号：US06398280B1
公开(公告)日：2002-06-04
申请号：US09569329
申请日：2000-05-11
申请人： Eric G. Parker , George D. Skidmore
发明人： Eric G. Parker , George D. Skidmore
IPC分类号： B66C142
CPC分类号： H05K13/0404 , B25J7/00 , B25J15/00
摘要： A system and method which provide a gripping mechanism and a complementary “handle,” which enable a microcomponent to be grasped with the gripping mechanism are disclosed. A preferred embodiment provides a gripper and a complementary handle, which is implemented on a microcomponent to be grasped, to enable the gripper to effectively grasp the microcomponent by grasping the complementary handle implemented for such component. A preferred embodiment provides a gripper and a complementary handle that is implemented on a microcomponent to enable the microcomponent to be accurately picked-and-placed with the gripper. The complementary handle may be an integrated part of the microcomponent to be grasped, or the handle may be a separate component that is capable of being permanently or temporarily coupled to a microcomponent. Most preferably, the gripper and complementary handle may be implemented to constrain all six degrees of freedom, both translational and rotational, of a grasped handle relative to the gripper.
摘要翻译：公开了一种提供夹持机构和互补的“手柄”的系统和方法，其使得能够用夹持机构抓住微组件。一个优选实施例提供了夹持器和互补手柄，其被实现在要被抓握的微型部件上，以使得夹具能够通过抓住为这种部件实现的互补手柄来有效地抓住微型部件。优选实施例提供了一种夹持器和一个在微型部件上实施的互补手柄，以使得微型部件能够与夹具精确地拾取和放置。互补手柄可以是要被抓握的微组件的集成部分，或者手柄可以是能够永久地或临时耦合到微组件的单独组件。最优选地，夹持器和互补手柄可以被实现为约束抓握手柄相对于夹持器的所有六个自由度（平移和旋转）。

5. 发明授权

US07799132B2 Patterned atomic layer epitaxy 有权
标题翻译：图案原子层外延
公开(公告)号：US07799132B2
公开(公告)日：2010-09-21
申请号：US11955845
申请日：2007-12-13
申请人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup , Robert J. Folaron
发明人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup , Robert J. Folaron
IPC分类号： C30B25/04
CPC分类号： C30B25/14 , C30B25/04
摘要： A patterned layer is formed by removing nanoscale passivating particle from a first plurality of nanoscale structural particles or by adding nanoscale passivating particles to the first plurality of nanoscale structural particles. Each of a second plurality of nanoscale structural particles is deposited on each of corresponding ones of the first plurality of nanoscale structural particles that is not passivated by one of the plurality of nanoscale passivating particles.
摘要翻译：通过从第一多个纳米尺度结构颗粒中去除纳米尺度钝化颗粒或通过将纳米尺度钝化颗粒添加到第一多个纳米尺度结构颗粒中而形成图案层。第二多个纳米尺度结构颗粒中的每一个沉积在第一多个纳米尺度结构颗粒中的相应的一个纳米级结构颗粒中，其不被多个纳米级钝化颗粒之一钝化。

6. 发明申请

US20090140147A1 PIXEL STRUCTURE HAVING AN UMBRELLA TYPE ABSORBER WITH ONE OR MORE RECESSES OR CHANNELS SIZED TO INCREASE RADIATION ABSORPTION 有权
标题翻译：具有UMBRELLA型吸收体的像素结构，具有一个或更多的凹槽或通道，以增加放射吸收
公开(公告)号：US20090140147A1
公开(公告)日：2009-06-04
申请号：US11949367
申请日：2007-12-03
申请人： George D. Skidmore , Christopher G. Howard
发明人： George D. Skidmore , Christopher G. Howard
IPC分类号： H01L31/00
CPC分类号： H01L27/14669 , G01J5/0225 , G01J5/046 , G01J5/0853 , G01J5/20 , H01L27/14601 , H01L27/14625
摘要： A pixel structure for use in an infrared imager is provided. The pixel structure includes a substrate and a bolometer. The bolometer includes a transducer that has a spaced apart relationship with respect to the substrate and has an electrical resistance that varies in response to changes in the temperature of the transducer. The bolometer also includes an absorber that has a spaced apart relationship with respect to the transducer and has a thermal connection to the transducer permitting radiation absorbed by the absorber to heat the transducer. The absorber has a top side defining a recess or channel in the absorber. The recess or channel is adapted to effect the propagation path of a portion of radiation received by the absorber such that the radiation portion is absorbed by the absorber rather than exiting the absorber. The recess or channel also decreases the thermal mass of the bolometer.
摘要翻译：提供了一种用于红外成像仪的像素结构。像素结构包括基板和测辐射热计。测辐射热计包括一个与衬底具有间隔开关系的换能器，并具有响应换能器温度变化而变化的电阻。测辐射热计还包括与换能器具有间隔开的关系的吸收器，并且具有与换能器的热连接，允许由吸收器吸收的辐射来加热换能器。吸收器具有限定吸收器中的凹部或通道的顶侧。凹部或通道适于影响由吸收体接收的辐射的一部分的传播路径，使得辐射部分被吸收体吸收而不是离开吸收体。凹槽或通道也会降低测辐射热计的热质。

7. 发明授权

US07326293B2 Patterned atomic layer epitaxy 有权
标题翻译：图案原子层外延
公开(公告)号：US07326293B2
公开(公告)日：2008-02-05
申请号：US11089814
申请日：2005-03-25
申请人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup, II , Robert J. Folaron
发明人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup, II , Robert J. Folaron
IPC分类号： C30B19/08
CPC分类号： C30B25/14 , C30B25/04
摘要： A patterned layer is formed by removing nanoscale passivating particle from a first plurality of nanoscale structural particles or by adding nanoscale passivating particles to the first plurality of nanoscale structural particles. Each of a second plurality of nanoscale structural particles is deposited on each of corresponding ones of the first plurality of nanoscale structural particles that is not passivated by one of the plurality of nanoscale passivating particles.
摘要翻译：通过从第一多个纳米尺度结构颗粒中去除纳米尺度钝化颗粒或通过将纳米尺度钝化颗粒添加到第一多个纳米尺度结构颗粒中而形成图案层。第二多个纳米尺度结构颗粒中的每一个沉积在第一多个纳米尺度结构颗粒中的相应的一个纳米级结构颗粒中，其不被多个纳米级钝化颗粒之一钝化。

8. 发明授权

US06672795B1 System and method for coupling microcomponents 失效
标题翻译：用于耦合微元件的系统和方法
公开(公告)号：US06672795B1
公开(公告)日：2004-01-06
申请号：US09570170
申请日：2000-05-11
申请人： Matthew D. Ellis , George D. Skidmore
发明人： Matthew D. Ellis , George D. Skidmore
IPC分类号： H01R16627
CPC分类号： B81C3/008 , B81B2201/13 , F16B2/20 , Y10T24/45581 , Y10T403/602
摘要： A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a “squeeze” snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.
摘要翻译：公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

9. 发明授权

US07224035B1 Apparatus and fabrication methods for incorporating sub-millimeter, high-resistivity mechanical components with low-resistivity conductors while maintaining electrical isolation therebetween 失效
标题翻译：用于将亚毫米，高电阻率机械部件与低电阻率导体并入的装置和制造方法，同时保持其间的电隔离
公开(公告)号：US07224035B1
公开(公告)日：2007-05-29
申请号：US10266724
申请日：2002-10-07
申请人： George D. Skidmore , Gregory A. Magel , Charles G. Roberts
发明人： George D. Skidmore , Gregory A. Magel , Charles G. Roberts
IPC分类号： H01L27/12
CPC分类号： B81C1/00214 , H01L27/1203
摘要： Fabricating electrical isolation properties into a MEMS device is described. One embodiment comprises a main substrate layer of a high-resistivity semiconductor material, such as high-resistivity silicon. The high-resistivity substrate is then controllably doped to provide a region of high-conductivity in the main substrate. Electrical isolation is achieved in such an embodiment by patterning the high-conductivity region either by masking the main substrate during the doping or etching through the doped, high-conductivity region in order to form regions of high conductivity. Effective isolation results from confinement of electrical currents to the lowest-resistance path. An alternative embodiment employs the fabrication of pn junctions and the use of reverse biasing to enhance the electrical isolation. A further embodiment comprises a main substrate layer of low-resistivity semiconductor material with a layer of insulator deposited thereon. High-conductivity or low-resistivity material is then grown on top of the insulator to create electrically isolated conductors.
摘要翻译：描述了将电隔离特性制造到MEMS器件中。一个实施例包括诸如高电阻率硅的高电阻率半导体材料的主衬底层。然后可控地掺杂高电阻率衬底，以在主衬底中提供高导电率的区域。在这种实施例中，通过在掺杂或蚀刻通过掺杂的高电导率区域期间掩蔽主衬底以形成高导电率区域来形成高导电率区域来实现电隔离，以形成高导电率的区域。有效的隔离是由电流限制到最低电阻路径。替代实施例采用pn结的制造和反向偏置的使用来增强电隔离。另一实施例包括具有沉积在其上的绝缘层的低电阻率半导体材料的主衬底层。然后在绝缘体的顶部生长高导电性或低电阻率材料，以产生电隔离的导体。

10. 发明授权

US06678458B2 System and method for precise positioning of microcomponents 失效
标题翻译：微元件精确定位的系统和方法
公开(公告)号：US06678458B2
公开(公告)日：2004-01-13
申请号：US09932489
申请日：2001-08-17
申请人： Matthew D. Ellis , George D. Skidmore
发明人： Matthew D. Ellis , George D. Skidmore
IPC分类号： G02B600
CPC分类号： B81C3/008 , B81C99/002 , Y10S977/951
摘要： A system and method are disclosed that enable precise positioning of microcomponents. According to one embodiment, a system and method for positioning a microcomponent are disclosed, wherein a microcomponent is received into a microcomponent positioning device. A target position for the microcomponent may then be determined, and at least a portion of the microcomponent positioning device is controllably deformed to accurately fix, at least temporarily, the position of the microcomponent at the target position. In one embodiment, microactuators that are operable to move the microcomponent are controllably deformed to fix the position of the microcomponent at the target position. In another embodiment, support beams that support a microcomponent holder are controllably deformed to fix the position of the microcomponent at the target position.
摘要翻译：公开了能够精确定位微组件的系统和方法。根据一个实施例，公开了一种用于定位微组件的系统和方法，其中微组件被接收到微组件定位装置中。然后可以确定微组件的目标位置，并且微组件定位装置的至少一部分被可控地变形，以至少临时地精确地固定微组件在目标位置的位置。在一个实施例中，可操作以移动微组件的微致动器被可控地变形以将微组件的位置固定在目标位置。在另一个实施例中，支撑微组件支架的支撑梁可控地变形，以将微组件的位置固定在目标位置。

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