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1. 发明授权

US11713240B2 Cellular array electrostatic actuator 有权
公开(公告)号：US11713240B2
公开(公告)日：2023-08-01
申请号：US17116677
申请日：2020-12-09
申请人： Board of Regents, The University of Texas System
发明人： Siavash Pourkamali , Amin Abbasalipour , Prithviraj Palit
IPC分类号： B81C1/00 , H02N1/00 , B81B3/00 , H02N2/00
CPC分类号： B81C1/00166 , B81B3/0021 , B81C1/00214 , H02N1/008 , H02N2/0075 , B81B2201/033 , B81B2203/0136 , B81B2203/053
摘要： Illustrative embodiments provide an electrostatic actuator and methods of making and operating an electrostatic actuator. The electrostatic actuator comprises a framework and a plurality of electrodes. The framework comprises walls defining a plurality of cells forming an array of cells. The plurality of electrodes comprise an electrode in each cell in the plurality of cells. A gap separates the electrode in each cell from the walls of the cell. The framework is configured to contract in response to an electrical signal applied between the framework and the plurality of electrodes.

2. 发明授权

US11648374B2 Surface topography with ferromagnetic polymer pillars capable of movement in response to magnetic fields 有权
公开(公告)号：US11648374B2
公开(公告)日：2023-05-16
申请号：US16249532
申请日：2019-01-16
申请人： Dacheng Ren , Huan Gu
发明人： Dacheng Ren , Huan Gu
IPC分类号： A61M25/00 , B81C1/00 , A01N25/34 , A01N59/16 , B08B17/06 , B29C33/00 , B29C35/02 , B82Y5/00 , B82Y30/00 , B29K105/20
CPC分类号： A61M25/0043 , A01N25/34 , A01N59/16 , B08B17/065 , B29C33/0027 , B29C35/02 , B81C1/00206 , B81C1/00214 , A61M2025/006 , A61M2025/0019 , A61M2025/0058 , A61M2205/0272 , B29K2105/203 , B29K2995/0008 , B81B2207/053 , B82Y5/00 , B82Y30/00 , A01N59/16 , A01N25/10 , A01N25/34 , A01N25/34 , A01N25/10
摘要： An anti-fouling surface having micron scale pillars embedded with Fe3O4 nanoparticles is designed. The pillars may be repeatedly induced to move according to a predetermined frequency, such as one that mimic that of the beating movement of natural cilia, through the application of a magnetic field. When square-shaped pillars with a height of 10 μm, width of 2 μm, and inter-pattern distance of 5 μm actuated for three minutes, more than 99.9 percent of biofilm cells were detached and via gentle rinsing from the surface having the pillars. The anti-fouling surface enables effective prevention of biofilm formation and removal of established biofilms, and can be applied to a broad spectrum of polymers.

3. 发明授权

US10081536B2 Gasses for increasing yield and reliability of MEMS devices 有权
公开(公告)号：US10081536B2
公开(公告)日：2018-09-25
申请号：US15379401
申请日：2016-12-14
申请人： Texas Instruments Incorporated
发明人： Simon Joshua Jacobs , Molly Nelis Sing
IPC分类号： H01L29/12 , H01L29/84 , H01L23/10 , B81B7/00 , B81C1/00 , B81B7/02 , H01L23/20 , H01L21/56 , B29C65/48 , H01L21/67
CPC分类号： B81B7/0038 , B29C65/48 , B81B3/0016 , B81B7/02 , B81C1/00214 , H01L21/56 , H01L21/67 , H01L23/10 , H01L23/20 , H01L29/12 , H01L29/84
摘要： In described examples, a MEMS device is enclosed within a sealed package including nonmetal oxide gasses at levels greater than 1% by volume. In at least one example, the MEMS device is protected against premature failure from various causes, including charging, particle growth and stiction by moieties of the nonmetal oxide gasses reacting with various exposed surfaces within the package of the MEMS device and/or the adsorbed water layers on said surfaces.

4. 发明授权

US09421772B2 Method of manufacturing ink jet printheads including electrostatic actuators 有权
标题翻译：制造包括静电致动器的喷墨打印头的方法
公开(公告)号：US09421772B2
公开(公告)日：2016-08-23
申请号：US14561519
申请日：2014-12-05
申请人： Xerox Corporation
发明人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
IPC分类号： B41J2/16 , B41J2/14 , B81C1/00
CPC分类号： B41J2/1621 , B41J2/14233 , B41J2/1433 , B41J2/161 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1639 , B81B2201/052 , B81C1/00158 , B81C1/00214 , B81C1/00523 , B81C2201/0194 , Y10T29/49126 , Y10T29/49401 , Y10T29/49798
摘要： A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.
摘要翻译：一种用于形成用于静电致动喷墨打印头的多个静电致动器膜的方法。该方法可以包括在蚀刻停止层上形成覆盖层致动器膜层，其中蚀刻停止层插入在覆盖膜层和诸如半导体晶片的手柄层之间。图案化毯子致动器膜层以形成多个致动器膜。多个致动器膜附接到打印头驱动组件，打印头驱动组件包括用于致动多个致动器膜的电路。随后，去除手柄层和蚀刻停止层，从而使多个致动器膜附接到打印头驱动组件。

5. 发明申请

US20160159091A1 WAFER LEVEL FABRICATION AND BONDING OF MEMBRANES FOR ELECTROSTATIC PRINTHEADS 有权
标题翻译：用于静电喷涂的膜的制造和粘合
公开(公告)号：US20160159091A1
公开(公告)日：2016-06-09
申请号：US14561519
申请日：2014-12-05
申请人： Xerox Corporation
发明人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
IPC分类号： B41J2/14 , B81C1/00 , B41J2/16
CPC分类号： B41J2/1621 , B41J2/14233 , B41J2/1433 , B41J2/161 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1639 , B81B2201/052 , B81C1/00158 , B81C1/00214 , B81C1/00523 , B81C2201/0194 , Y10T29/49126 , Y10T29/49401 , Y10T29/49798
摘要： A method for forming a plurality of electrostatic actuator membranes for an electrostatically actuated ink jet printhead. The method can include forming a blanket actuator membrane layer on an etch stop layer, where the etch stop layer is interposed between the blanket membrane layer and a handle layer such as a semiconductor wafer. The blanket actuator membrane layer is patterned to form a plurality of actuator membranes. The plurality of actuator membranes is attached to a printhead drive assembly that includes circuitry for actuating the plurality of actuator membranes. Subsequently, the handle layer and etch stop layer are removed, thereby leaving the plurality of actuator membranes attached to the printhead drive assembly.
摘要翻译：一种用于形成用于静电致动喷墨打印头的多个静电致动器膜的方法。该方法可以包括在蚀刻停止层上形成覆盖层致动器膜层，其中蚀刻停止层插入在覆盖膜层和诸如半导体晶片的手柄层之间。图案化毯子致动器膜层以形成多个致动器膜。多个致动器膜附接到打印头驱动组件，打印头驱动组件包括用于致动多个致动器膜的电路。随后，去除手柄层和蚀刻停止层，从而使多个致动器膜附接到打印头驱动组件。

6. 发明授权

US08986596B2 Methods of forming nanoparticles using semiconductor manufacturing infrastructure 有权
标题翻译：使用半导体制造基础设施形成纳米颗粒的方法
公开(公告)号：US08986596B2
公开(公告)日：2015-03-24
申请号：US13680071
申请日：2012-11-18
申请人： International Business Machines Corporation
发明人： Joy Cheng , Daniel J. Coady , Matthew E. Colburn , Blake W. Davis , James L. Hedrick , Steven J. Holmes , Hareem T. Maune , Alshakim Nelson
IPC分类号： B81C1/00 , B29B9/16 , B82Y40/00
CPC分类号： B29B9/16 , B81C1/00214 , B82Y40/00
摘要： A method of preparing particles comprises forming by optical lithography a topographic template layer disposed on a surface of a substrate, which is suitable for spin casting. The template layer comprises a non-crosslinked template polymer having a pattern of independent wells therein for molding independent particles. Spin casting a particle-forming composition onto the template layer forms a composite layer comprising the template polymer and the particles disposed in the wells. The composite layer is removed from the substrate using a stripping agent that dissolves the template polymer without dissolving the particles. The particles are then isolated.
摘要翻译：制备颗粒的方法包括通过光刻法形成设置在基材表面上的适于旋转浇铸的地形模板层。模板层包含非交联模板聚合物，其具有用于模制独立颗粒的独立孔的图案。将颗粒形成组合物旋转到模板层上形成包含模板聚合物和设置在孔中的颗粒的复合层。使用溶解模板聚合物而不溶解颗粒的剥离剂从基材上除去复合层。然后分离颗粒。

7. 发明授权

US08941152B1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08941152B1
公开(公告)日：2015-01-27
申请号：US14105253
申请日：2013-12-13
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Chun-wen Cheng , Jung-Huei Peng , Shang-Ying Tsai , Hung-Chia Tsai , Yi-Chuan Teng
IPC分类号： H01L29/84 , B81B7/04 , B81B7/00 , B81C1/00
CPC分类号： B81B7/007 , B81B7/02 , B81B7/04 , B81C1/00214 , B81C1/0023 , B81C1/00333 , H01L2224/11
摘要： A method of forming a semiconductor device comprises forming a base wafer comprising a first chip package portion, a second chip package portion, and a third chip package portion. The method also comprises forming a capping wafer comprising a plurality of isolation trenches, each of the plurality of isolation trenches being configured to substantially align with one of the first chip package portion, the second chip package portion or the third chip package portion. The method further comprises eutectic bonding the capping wafer and the base wafer to form a wafer package. The method additionally comprises dicing the wafer package into a first chip package, a second chip package, and a third chip package. The method also comprises placing the first chip package, the second chip package, and the third chip package onto a substrate.
摘要翻译：形成半导体器件的方法包括形成包括第一芯片封装部分，第二芯片封装部分和第三芯片封装部分的基底晶片。该方法还包括形成包括多个隔离沟槽的封盖晶片，多个隔离沟槽中的每一个被配置为与第一芯片封装部分，第二芯片封装部分或第三芯片封装部分中的一个大致对准。该方法还包括共晶接合封盖晶片和基底晶片以形成晶片封装。该方法还包括将晶片封装切割成第一芯片封装，第二芯片封装和第三芯片封装。该方法还包括将第一芯片封装，第二芯片封装和第三芯片封装放置在基板上。

8. 发明申请

US20110086443A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20110086443A1
公开(公告)日：2011-04-14
申请号：US12999478
申请日：2009-06-05
申请人： Takashi Kobayashi , Shuntaro Machida , Kunio Hashiba
发明人： Takashi Kobayashi , Shuntaro Machida , Kunio Hashiba
IPC分类号： H01L21/82 , H01L21/66
CPC分类号： H04R31/00 , B81B2201/0257 , B81B2207/053 , B81C1/00214
摘要： A manufacturing yield of a semiconductor device (capacitive micromachined ultrasonic transducer) is increased. A plurality of first chips 1 in which a plurality of cells each having functions of transmitting and receiving ultrasonic waves are formed on a front surface of a first semiconductor wafer are manufactured, and each of the first chips 1 is judged as a superior/inferior product, and then, the first semiconductor wafer is sigulated into a plurality of first chips 1. Next, a plurality of second chips 2 in which a wiring layer is formed on a front surface of a second semiconductor wafer are manufactured, and each of the second chips 2 is judged as a superior/inferior product, and then, the second semiconductor wafer is sigulated into a plurality of second chips 2. Next, the plurality of first chips 1 judged as the superior product are adjacently arranged on the front surface of the second chip 2 judged as the superior product in plane in a Y direction so that lower electrodes 5 of the adjacent first chips 1 are electrically connected with each other via a through electrode 6, a bump 8, and a wiring layer 7.
摘要翻译：半导体器件（电容式微加工超声换能器）的制造产量增加。制造在第一半导体晶片的前表面上形成多个具有发送和接收超声波功能的多个单元的多个第一芯片1，并且将第一芯片1判断为上/下产品然后，第一半导体晶片被配置成多个第一芯片1.接着，制造在第二半导体晶片的前表面上形成有布线层的多个第二芯片2，将芯片2判断为优劣产品，然后将第二半导体晶片投入多个第二芯片2.接下来，判断为优质产品的多个第一芯片1相邻布置在第二芯片2在Y方向上被认为是平面上的优异产品，使得相邻的第一芯片1的下电极5经由通电极6，凸块8和布线层7。

9. 发明授权

US07671428B2 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates 有权
公开(公告)号：US07671428B2
公开(公告)日：2010-03-02
申请号：US11102186
申请日：2005-04-07
申请人： Satyadev R. Patel , Andrew G. Huibers , Steve S. Chiang
发明人： Satyadev R. Patel , Andrew G. Huibers , Steve S. Chiang
IPC分类号： H01L21/50
CPC分类号： B81C1/00214 , B81B7/0077 , B81B2201/042 , B81C1/00333 , B81C1/00896 , B81C1/00904 , B81C2203/0118 , B82Y30/00 , G02B26/0833 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01054 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

10. 发明申请

US20090242405A1 BOTTOM-UP ASSEMBLY OF STRUCTURES ON A SUBSTRATE 有权
标题翻译：底层结构的底部装配
公开(公告)号：US20090242405A1
公开(公告)日：2009-10-01
申请号：US12351509
申请日：2009-01-09
申请人： Theresa S. Mayer , Christine D. Keating , Mingwei Li , Thomas Morrow , Jaekyun Kim
发明人： Theresa S. Mayer , Christine D. Keating , Mingwei Li , Thomas Morrow , Jaekyun Kim
IPC分类号： G01N27/00 , H01L21/326 , B05D1/00 , H01L21/3205
CPC分类号： H01L29/0665 , B81B2203/0109 , B81B2207/056 , B81C1/00214 , B82Y10/00 , H01L29/0673 , H01L29/125 , H01L29/1606 , H01L29/772 , H01L29/7781 , H01L51/0037 , H01L51/0512
摘要： Examples of the present invention include methods of assembling structures, such as nanostructures, at predetermined locations on a substrate. A voltage between spaced-apart electrodes supported by substrate attracts the structures to the substrate, and positional registration can be provided the substrate using topographic features such as wells. Examples of the present invention also include devices, such as electronic and optoelectronic devices, prepared by such methods.
摘要翻译：本发明的实例包括在基底上的预定位置处组装诸如纳米结构的结构的方法。由衬底支撑的间隔开的电极之间的电压将结构吸引到衬底，并且可以使用诸如孔的地形特征为衬底提供位置配准。本发明的实例还包括通过这些方法制备的装置，例如电子和光电器件。

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