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1. 发明授权

US07799132B2 Patterned atomic layer epitaxy 有权
标题翻译：图案原子层外延
公开(公告)号：US07799132B2
公开(公告)日：2010-09-21
申请号：US11955845
申请日：2007-12-13
申请人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup , Robert J. Folaron
发明人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup , Robert J. Folaron
IPC分类号： C30B25/04
CPC分类号： C30B25/14 , C30B25/04
摘要： A patterned layer is formed by removing nanoscale passivating particle from a first plurality of nanoscale structural particles or by adding nanoscale passivating particles to the first plurality of nanoscale structural particles. Each of a second plurality of nanoscale structural particles is deposited on each of corresponding ones of the first plurality of nanoscale structural particles that is not passivated by one of the plurality of nanoscale passivating particles.
摘要翻译：通过从第一多个纳米尺度结构颗粒中去除纳米尺度钝化颗粒或通过将纳米尺度钝化颗粒添加到第一多个纳米尺度结构颗粒中而形成图案层。第二多个纳米尺度结构颗粒中的每一个沉积在第一多个纳米尺度结构颗粒中的相应的一个纳米级结构颗粒中，其不被多个纳米级钝化颗粒之一钝化。

2. 发明申请

US20090140147A1 PIXEL STRUCTURE HAVING AN UMBRELLA TYPE ABSORBER WITH ONE OR MORE RECESSES OR CHANNELS SIZED TO INCREASE RADIATION ABSORPTION 有权
标题翻译：具有UMBRELLA型吸收体的像素结构，具有一个或更多的凹槽或通道，以增加放射吸收
公开(公告)号：US20090140147A1
公开(公告)日：2009-06-04
申请号：US11949367
申请日：2007-12-03
申请人： George D. Skidmore , Christopher G. Howard
发明人： George D. Skidmore , Christopher G. Howard
IPC分类号： H01L31/00
CPC分类号： H01L27/14669 , G01J5/0225 , G01J5/046 , G01J5/0853 , G01J5/20 , H01L27/14601 , H01L27/14625
摘要： A pixel structure for use in an infrared imager is provided. The pixel structure includes a substrate and a bolometer. The bolometer includes a transducer that has a spaced apart relationship with respect to the substrate and has an electrical resistance that varies in response to changes in the temperature of the transducer. The bolometer also includes an absorber that has a spaced apart relationship with respect to the transducer and has a thermal connection to the transducer permitting radiation absorbed by the absorber to heat the transducer. The absorber has a top side defining a recess or channel in the absorber. The recess or channel is adapted to effect the propagation path of a portion of radiation received by the absorber such that the radiation portion is absorbed by the absorber rather than exiting the absorber. The recess or channel also decreases the thermal mass of the bolometer.
摘要翻译：提供了一种用于红外成像仪的像素结构。像素结构包括基板和测辐射热计。测辐射热计包括一个与衬底具有间隔开关系的换能器，并具有响应换能器温度变化而变化的电阻。测辐射热计还包括与换能器具有间隔开的关系的吸收器，并且具有与换能器的热连接，允许由吸收器吸收的辐射来加热换能器。吸收器具有限定吸收器中的凹部或通道的顶侧。凹部或通道适于影响由吸收体接收的辐射的一部分的传播路径，使得辐射部分被吸收体吸收而不是离开吸收体。凹槽或通道也会降低测辐射热计的热质。

3. 发明授权

US07326293B2 Patterned atomic layer epitaxy 有权
标题翻译：图案原子层外延
公开(公告)号：US07326293B2
公开(公告)日：2008-02-05
申请号：US11089814
申请日：2005-03-25
申请人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup, II , Robert J. Folaron
发明人： John N. Randall , Jingping Peng , Jun-Fu Liu , George D. Skidmore , Christof Baur , Richard E. Stallcup, II , Robert J. Folaron
IPC分类号： C30B19/08
CPC分类号： C30B25/14 , C30B25/04
摘要： A patterned layer is formed by removing nanoscale passivating particle from a first plurality of nanoscale structural particles or by adding nanoscale passivating particles to the first plurality of nanoscale structural particles. Each of a second plurality of nanoscale structural particles is deposited on each of corresponding ones of the first plurality of nanoscale structural particles that is not passivated by one of the plurality of nanoscale passivating particles.
摘要翻译：通过从第一多个纳米尺度结构颗粒中去除纳米尺度钝化颗粒或通过将纳米尺度钝化颗粒添加到第一多个纳米尺度结构颗粒中而形成图案层。第二多个纳米尺度结构颗粒中的每一个沉积在第一多个纳米尺度结构颗粒中的相应的一个纳米级结构颗粒中，其不被多个纳米级钝化颗粒之一钝化。

4. 发明授权

US07240420B1 System and method for post-fabrication reduction of minimum feature size spacing of microcomponents 失效
标题翻译：微元件最小特征尺寸间距后制造的系统和方法
公开(公告)号：US07240420B1
公开(公告)日：2007-07-10
申请号：US09884205
申请日：2001-06-19
申请人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
发明人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
IPC分类号： B81B5/00
CPC分类号： B81B3/0054 , B81B2201/037 , Y10T29/5313
摘要： A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation space therebetween. At least one of the microcomponents includes an extension part that is operable to reduce the separation space. Such an extension part may include an extension member that is movably extendable away from its associated microcomponent to reduce the separation space between its associated microcomponent and another microcomponent. The extension part may be latched at a desired position by a latching mechanism. The extension part may be implemented such that the extension member eliminates the separation space, thereby resulting in such extension member engaging another microcomponent. Such engagement may be achieved without requiring power to be applied to the microcomponents. Certain embodiments are insensitive to etching inaccuracy encountered during fabrication.
摘要翻译：公开了一种系统和方法，其使后期制造减少了微型部件的最小特征尺寸间距。提供了一种用于制造微组件组件的方法，其中制造了至少两个在其间具有分隔空间的微组件。微组件中的至少一个包括可操作以减小分离空间的延伸部分。这种延伸部分可以包括可移动地延伸远离其相关联的微型部件的延伸部件，以减小其相关的微型部件和另一微型部件之间的分离空间。延伸部分可以通过闭锁机构锁定在期望的位置。延伸部件可以被实现为使得延伸部件消除分离空间，从而导致这种延伸部件与另一个微型部件接合。可以在不需要将功率施加到微型部件的情况下实现这种接合。某些实施例对制造期间遇到的蚀刻不精确性不敏感。

5. 发明授权

US06677225B1 System and method for constraining totally released microcomponents 失效
标题翻译：限制全部释放微量元件的系统和方法
公开(公告)号：US06677225B1
公开(公告)日：2004-01-13
申请号：US09616500
申请日：2000-07-14
申请人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
发明人： Matthew D. Ellis , Eric G. Parker , George D. Skidmore
IPC分类号： H01L2144
CPC分类号： B81B3/0051 , B81B2203/053 , B81B2203/055
摘要： A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a “pallet” having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.
摘要翻译：公开了限制从基板完全释放以处理这种完全释放的微型部件的微组件的系统和方法。优选的实施方案提供了将完全释放的微量组分约束到碱（例如另一微量组分或底物）的系统和方法。例如，优选的实施方案提供了限制构件，其用于将微组件约束至基底，因为微量组分完全从这种基底释放。因此，这样的约束构件可以在制造期间从其衬底释放这种微组件期间有助于保护微组件与其衬底。此外，优选实施例提供了约束构件，其适用于将完全释放的微组件约束到基座以用于微组件的后制造处理。为了进一步帮助完全释放的微型部件的后制造处理，优选实施例可以被实现为具有一个或多个微部件约束的“托盘”。此外，优选实施例的约束构件使得当需要时可以从完全释放的微组件从这种约束中移除，但是防止完全释放的微元件不经意地逃避这样的约束。例如，在一个实施例中，约束构件被实现为可移动的构件，其可以被移动以从其底部不受约束的完全释放的微元件。

6. 发明授权

US06672795B1 System and method for coupling microcomponents 失效
标题翻译：用于耦合微元件的系统和方法
公开(公告)号：US06672795B1
公开(公告)日：2004-01-06
申请号：US09570170
申请日：2000-05-11
申请人： Matthew D. Ellis , George D. Skidmore
发明人： Matthew D. Ellis , George D. Skidmore
IPC分类号： H01R16627
CPC分类号： B81C3/008 , B81B2201/13 , F16B2/20 , Y10T24/45581 , Y10T403/602
摘要： A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a “squeeze” snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.
摘要翻译：公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

7. 发明授权

US07622717B2 Pixel structure having an umbrella type absorber with one or more recesses or channels sized to increase radiation absorption 有权
标题翻译：像素结构具有具有一个或多个凹槽或通道的伞形吸收体，其尺寸设置成增加辐射吸收
公开(公告)号：US07622717B2
公开(公告)日：2009-11-24
申请号：US11949367
申请日：2007-12-03
申请人： George D. Skidmore , Christopher G. Howard
发明人： George D. Skidmore , Christopher G. Howard
IPC分类号： H01L31/00
CPC分类号： H01L27/14669 , G01J5/0225 , G01J5/046 , G01J5/0853 , G01J5/20 , H01L27/14601 , H01L27/14625
摘要： A pixel structure for use in an infrared imager is provided. The pixel structure includes a substrate and a bolometer. The bolometer includes a transducer that has a spaced apart relationship with respect to the substrate and has an electrical resistance that varies in response to changes in the temperature of the transducer. The bolometer also includes an absorber that has a spaced apart relationship with respect to the transducer and has a thermal connection to the transducer permitting radiation absorbed by the absorber to heat the transducer. The absorber has a top side defining a recess or channel in the absorber. The recess or channel is adapted to effect the propagation path of a portion of radiation received by the absorber such that the radiation portion is absorbed by the absorber rather than exiting the absorber. The recess or channel also decreases the thermal mass of the bolometer.
摘要翻译：提供了一种用于红外成像仪的像素结构。像素结构包括基板和测辐射热计。测辐射热计包括一个与衬底具有间隔开关系的换能器，并具有响应换能器温度变化而变化的电阻。测辐射热计还包括与换能器具有间隔开的关系的吸收器，并且具有与换能器的热连接，允许由吸收器吸收的辐射来加热换能器。吸收器具有限定吸收器中的凹部或通道的顶侧。凹部或通道适于影响由吸收体接收的辐射的一部分的传播路径，使得辐射部分被吸收体吸收而不是离开吸收体。凹槽或通道也会降低测辐射热计的热质。

8. 发明授权

US07096568B1 Method of manufacturing a microcomponent assembly 有权
标题翻译：微型组件的制造方法
公开(公告)号：US07096568B1
公开(公告)日：2006-08-29
申请号：US10616735
申请日：2003-07-10
申请人： Erik Nilsen , Matthew D. Ellis , Charles L. Goldsmith , Jeong Bong Lee , Xiaojun Huang , Arun Kumar Nallani , Kabseog Kim , George D. Skidmore
发明人： Erik Nilsen , Matthew D. Ellis , Charles L. Goldsmith , Jeong Bong Lee , Xiaojun Huang , Arun Kumar Nallani , Kabseog Kim , George D. Skidmore
IPC分类号： H05B3/00
CPC分类号： B81C3/008 , B81B2201/13 , B81B2207/07 , Y10S977/724 , Y10T29/49083 , Y10T29/49144 , Y10T29/49155
摘要： A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.
摘要翻译：用于使用组装后激活的连接化合物的微组件互连的新工艺和结构。在一个实施例中，提供具有相应的第一和第二接触区域的第一和第二微型部件。在第一接触区域和第二接触区域中的一个上形成接合化合物，并且第一接触区域和第二接触区域在接合化合物的相对侧上彼此相邻地定位。然后结合化合物被激活以偶联第一和第二微量组分。

9. 发明授权

US06879016B1 Microcomponent having intra-layer electrical isolation with mechanical robustness 失效
标题翻译：微型组件具有机械稳健性的层内电隔离
公开(公告)号：US06879016B1
公开(公告)日：2005-04-12
申请号：US10266726
申请日：2002-10-07
申请人： George D. Skidmore , Aaron Geisberger , Matthew D. Ellis
发明人： George D. Skidmore , Aaron Geisberger , Matthew D. Ellis
IPC分类号： B81B3/00 , B81B7/02 , B81C1/00 , H01L21/762 , H01L29/00 , H01L29/06
CPC分类号： B81C1/00246 , B81B3/0035 , H01L21/76232
摘要： A system and method is disclosed that strengthens the structural integrity of trench-fill electrical isolation techniques. One embodiment provides for etching a series of interlocking geometric trenches into a device layer and filling the trenches with a non-conductive dielectric material. The dielectric material establishes electrical isolation while the interlocking geometric trenches strengthen the structural integrity of the separation by providing at least one surface on the interlocking separation that experiences a compression force for each direction that the electrically isolated MEMS component is moved.
摘要翻译：公开了一种加强沟槽填充电气隔离技术的结构完整性的系统和方法。一个实施例提供了将一系列互锁几何沟槽蚀刻到器件层中并用非导电介电材料填充沟槽。电介质材料建立电隔离，而互锁几何沟槽通过在互锁分离上提供至少一个表面，从而经受电动隔离MEMS组件移动的每个方向的压缩力，从而增强了分离的结构完整性。

10. 发明授权

US06762116B1 System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon 失效
标题翻译：在其上具有预制电子电路的基板上制造微元件的系统和方法
公开(公告)号：US06762116B1
公开(公告)日：2004-07-13
申请号：US10167939
申请日：2002-06-12
申请人： George D. Skidmore
发明人： George D. Skidmore
IPC分类号： H01L2144
CPC分类号： B81C1/00246 , B81C2203/0735
摘要： A system and method is described for fabricating microcomponents onto pre-existing integrated electronics. One embodiment of the present invention provides additional process steps after completion of all electronics fabrication that may etch trough the oxide of any passivation layer that may be there to the single crystal silicon (SCS) of a silicon on insulator (SOI) integrated circuit. Once at the SCS level of the existing wafer, any number of microcomponents, such as connectors, receptacles, handles, tethers, and the like may preferably be fabricated onto the chip using relatively low temperature and inexpensive processing; thus, preferably preserving the integrity of the preexisting electronics.
摘要翻译：描述了将微组件制造到预先存在的集成电子装置上的系统和方法。本发明的一个实施例在完成所有电子器件制造之后提供额外的工艺步骤，其可蚀刻通过绝缘体（SOI）集成电路的单晶硅（SCS）的任何钝化层的氧化物。一旦在现有晶片的SCS水平，可以使用相对较低的温度和便宜的处理，优选地将任何数量的微型部件（例如连接器，插座，手柄，系绳等）制造到芯片上; 因此，优选地保持预先存在的电子器件的完整性。

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