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    • 7. 发明申请
    • Using trap routines in a RISC microprocessor architecture
    • 在RISC微处理器架构中使用陷阱程序
    • US20080071991A1
    • 2008-03-20
    • US11981482
    • 2007-10-31
    • George ShawMartin McClurgBradley JensenRussell FishCharles Moore
    • George ShawMartin McClurgBradley JensenRussell FishCharles Moore
    • G06F12/08
    • G06F12/0875G06F9/30014G06F9/3005G06F9/30134G06F9/30145G06F9/30167G06F9/322G06F9/3824G06F9/3861G06F9/3877G06F9/3879G09G5/363G09G5/393G09G2360/121G09G2360/126
    • A microprocessor executes at 100 native MIPS peak performance with a 100-MHz internal clock frequency. Central processing unit (CPU) instruction sets are hardwired, allowing most instructions to execute in a single cycle. A “flow-through” design allows the next instruction to start before the prior instruction completes, thus increasing performance. A microprocessing unit (MPU) contains 52 general-purpose registers, including 16 global data registers, an index register, a count register, a 16-deep addressable register/return stack, and an 18-deep operand stack. Both stacks contain an index register in the top elements, are cached on chip, and when required, automatically spill to and refill from external memory. The stacks minimize the data movement and also minimize memory access during procedure calls, parameter passing, and variable assignments. Additionally, the MPU contains a mode/status register and 41 locally addressed registers for I/O, control, configuration, and status. The CPU contains both a high-performance, zero-operand, dual-stack architecture MPU, and an input-output processor (IOP) that executes instructions to transfer data, count events, measure time, and perform other timing-dependent functions. A zero-operand stack architecture eliminates operand bits. Stacks also minimize register saves and loads within and across procedures, thus allowing shorter instruction sequences and faster-running code. Instructions are simple to decode and execute, allowing the MPU and IOP to issue and complete instructions in a single clock cycle—each at 100 native MIPS peak execution. Using 8-bit opcodes, the CPU obtains up to four instructions from memory each time an instruction fetch or pre-fetch is performed. These instructions can be repeated without rereading them from memory. This maintains high performance when connected directly to DRAM, without a cache.
    • 微处理器以100 MHz内部时钟频率执行100个本机MIPS峰值性能。 中央处理单元(CPU)指令集是硬连线的,允许大多数指令在一个周期内执行。 “流通”设计允许下一条指令在先前指令完成之前启动,从而提高性能。 微处理单元(MPU)包含52个通用寄存器,包括16个全局数据寄存器,一个索引寄存器,一个计数寄存器,一个16深可寻址寄存器/返回堆栈以及一个18深操作数堆栈。 两个堆栈都包含顶部元素中的索引寄存器,缓存在芯片上,并在需要时自动溢出并从外部存储器中重新填充。 堆栈最小化数据移动,并在过程调用,参数传递和变量赋值期间最小化存储器访问。 此外,MPU还包含一个模式/状态寄存器和41个用于I / O,控制,配置和状态的本地寻址寄存器。 CPU包含高性能零操作数双堆栈架构MPU和执行指令传输数据,计数事件,测量时间和执行其他与时序相关的功能的输入输出处理器(IOP)。 零操作数堆栈架构消除了操作数位。 堆栈还可以在过程内和跨过程中最小化寄存器保存和加载,从而允许较短的指令序列和更快的运行代码。 指令简单易于解码和执行,允许MPU和IOP在单个时钟周期内发出和完成指令,每个时钟周期为100个本机MIPS峰值执行。 每次执行指令提取或预取时,CPU使用8位操作码,最多可从内存中获取四条指令。 这些指令可以重复,而不会从内存重新读取。 当直接连接到DRAM而没有高速缓存时,这将保持高性能。
    • 8. 发明授权
    • Electrostatic discharge protection circuitry
    • 静电放电保护电路
    • US08878296B1
    • 2014-11-04
    • US12910416
    • 2010-10-22
    • Bradley JensenCharles Y. Chu
    • Bradley JensenCharles Y. Chu
    • H01L23/62
    • H01L23/60H01L2924/0002H01L2924/00
    • Integrated circuits with electrostatic discharge (ESD) protection circuitry are provided. The ESD protection circuitry does not include polysilicon resistors. The ESD protection circuitry may include n-channel transistors coupled in parallel between an output node that is connected to an input/output pin and a ground terminal. The n-channel transistors may each have a drain terminal that is coupled to the output node through first metal paths and a source terminal that is coupled to the ground terminal through second metal paths. The first and second metal paths may be routed over gate terminals of the respective n-channel transistors to provide sufficient resistance. The first and second metal paths may provide desired pull-down resistance in the ESD protection circuitry so that the ESD protection circuitry can sink sufficient current through each of the n-channel transistors to protect internal circuitry from damage in an ESD event.
    • 提供具有静电放电(ESD)保护电路的集成电路。 ESD保护电路不包括多晶硅电阻。 ESD保护电路可以包括并联连接在连接到输入/输出引脚和接地端子的输出节点之间的n沟道晶体管。 n沟道晶体管可以各自具有通过第一金属路径耦合到输出节点的漏极端子和通过第二金属路径耦合到接地端子的源极端子。 第一和第二金属路径可以在相应的n沟道晶体管的栅极端子上布线以提供足够的电阻。 第一和第二金属路径可以在ESD保护电路中提供期望的下拉电阻,使得ESD保护电路可以吸收通过每个n沟道晶体管的足够电流,以保护内部电路免于ESD事件中的损坏。
    • 9. 发明申请
    • INTEGRATED CIRCUIT GUARD RINGS
    • 集成电路保护环
    • US20120083094A1
    • 2012-04-05
    • US13316241
    • 2011-12-09
    • Bradley JensenCharles Y. Chu
    • Bradley JensenCharles Y. Chu
    • H01L21/762H01L21/76
    • H01L21/76229H01L21/31053
    • Integrated circuits with guard rings are provided. Integrated circuits may include internal circuitry that is sensitive to external noise sources. A guard ring may surround the functional circuitry to isolate the circuitry from the noise sources. The guard ring may include first, second, and third regions. The first and third regions may include p-wells. The second region may include an n-well. Stripes of diffusion regions may be formed at the surface of a substrate in the three regions. Areas in the guard ring that are not occupied by the diffusion regions are occupied by shallow trench isolation (STI) structures. Stripes of dummy structures may be formed over respective STI structures and may not overlap the diffusion regions. The diffusion regions in the first and third regions may be biased to a ground voltage. The diffusion regions in the second section may be biased to a positive power supply voltage.
    • 提供带保护环的集成电路。 集成电路可以包括对外部噪声源敏感的内部电路。 保护环可以围绕功能电路以将电路与噪声源隔离。 保护环可以包括第一,第二和第三区域。 第一和第三区域可以包括p阱。 第二区域可以包括n阱。 扩散区域的条纹可以​​形成在三个区域中的基板的表面。 保护环中未被扩散区占据的区域被浅沟槽隔离(STI)结构所占据。 虚设结构的条纹可以​​形成在相应的STI结构上,并且可能不与扩散区重叠。 第一和第三区域中的扩散区域可被偏压到接地电压。 第二部分中的扩散区域可以被偏置到正电源电压。
    • 10. 发明授权
    • Integrated circuit guard rings
    • 集成电路保护环
    • US08097925B2
    • 2012-01-17
    • US12748300
    • 2010-03-26
    • Bradley JensenCharles Y. Chu
    • Bradley JensenCharles Y. Chu
    • H01L29/66H01L29/02
    • H01L21/76229H01L21/31053
    • Integrated circuits with guard rings are provided. Integrated circuits may include internal circuitry that is sensitive to external noise sources. A guard ring may surround the functional circuitry to isolate the circuitry from the noise sources. The guard ring may include first, second, and third regions. The first and third regions may include p-wells. The second region may include an n-well. Stripes of diffusion regions may be formed at the surface of a substrate in the three regions. Areas in the guard ring that are not occupied by the diffusion regions are occupied by shallow trench isolation (STI) structures. Stripes of dummy structures may be formed over respective STI structures and may not overlap the diffusion regions. The diffusion regions in the first and third regions may be biased to a ground voltage. The diffusion regions in the second section may be biased to a positive power supply voltage.
    • 提供带保护环的集成电路。 集成电路可以包括对外部噪声源敏感的内部电路。 保护环可以围绕功能电路以将电路与噪声源隔离。 保护环可以包括第一,第二和第三区域。 第一和第三区域可以包括p阱。 第二区域可以包括n阱。 扩散区域的条纹可以​​形成在三个区域中的基板的表面。 保护环中未被扩散区占据的区域被浅沟槽隔离(STI)结构所占据。 虚设结构的条纹可以​​形成在相应的STI结构上,并且可能不与扩散区重叠。 第一和第三区域中的扩散区域可被偏压到接地电压。 第二部分中的扩散区域可以被偏置到正电源电压。