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1. 发明授权

US08093690B2 Chip package and manufacturing method thereof 有权
标题翻译：芯片封装及其制造方法
公开(公告)号：US08093690B2
公开(公告)日：2012-01-10
申请号：US12414996
申请日：2009-03-31
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译：提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。

2. 发明授权

US08592958B2 Chip package and manufacturing method thereof 有权
标题翻译：芯片封装及其制造方法
公开(公告)号：US08592958B2
公开(公告)日：2013-11-26
申请号：US13315039
申请日：2011-12-08
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译：提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。

3. 发明申请

US20120098109A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装及其制造方法
公开(公告)号：US20120098109A1
公开(公告)日：2012-04-26
申请号：US13315039
申请日：2011-12-08
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译：提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。

4. 发明申请

US20100110656A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：芯片包装及其制造方法
公开(公告)号：US20100110656A1
公开(公告)日：2010-05-06
申请号：US12388771
申请日：2009-02-19
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H05K9/00 , B29D31/00
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.
摘要翻译：提供了包括多个导电体和用于更好的电磁干扰屏蔽的屏蔽层的芯片封装。模制化合物上的屏蔽层与设置在基板上的导电体接触，并且屏蔽层和导电体用作EMI屏蔽。屏蔽层通过连接到层叠基板的导电体和基板的接地平面进行电接地。

5. 发明申请

US20100109132A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片包装及其制造方法
公开(公告)号：US20100109132A1
公开(公告)日：2010-05-06
申请号：US12414996
申请日：2009-03-31
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译：提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。

6. 发明授权

US07884131B2 Oxylipins from long chain polyunsaturated fatty acids and methods of making and using the same 失效
标题翻译：来自长链多不饱和脂肪酸的牛痘素及其制备和使用方法
公开(公告)号：US07884131B2
公开(公告)日：2011-02-08
申请号：US11284790
申请日：2005-11-21
申请人： Linda Arterburn , William Barclay , Bindi Dangi , James Flatt , Jung Lee , Mary Van Elswyk
发明人： Linda Arterburn , William Barclay , Bindi Dangi , James Flatt , Jung Lee , Mary Van Elswyk
IPC分类号： A61K31/22 , C07C59/00 , C07C57/00
CPC分类号： C12P7/6472 , C07C59/42 , C07D303/38 , C12P7/6427
摘要： Disclosed are novel oxylipins, referred to herein as docosanoids, that are derived from C22 polyunsaturated fatty acids, and method of making and using such oxylipins. Also disclosed is the use of docosapentaenoic acid (C22:5n-6) (DPAn-6), docosapentaenoic acid (C22:5n-3) (DPAn-3), and docosatetraenoic acid (DTAn-6: C22:4n-6) as substrates for the production of novel oxylipins, and to the oxylipins produced thereby. Also disclosed is the use of DPAn-6, DPAn-3, DTAn-6, and/or the oxylipins derived therefrom, and/or novel docosanoids derived from the structures of C22 fatty acids, in therapeutic and nutritional or cosmetic applications, and particularly as anti-inflammatory or anti-neurodegenerative compounds. The invention also relates to novel ways of producing long chain polyunsaturated acid (LCPUFA)-rich oils and compositions that contain enhanced and effective amounts of LCPUFA-derived oxylipins, and particularly, docosanoids.
摘要翻译：公开了衍生自C22多不饱和脂肪酸的新型oxylipin，本文称为多糖类，以及制备和使用这种oxylipin的方法。还公开了二十二碳五烯酸（C22：5n-6）（DPAn-6），二十二碳五烯酸（C22：5n-3）（DPAn-3）和二十二碳四烯酸（DTAn-6：C22：4n-6）作为生产新型oxylipins的底物，以及由此产生的oxylipin。还公开了在治疗和营养或化妆品应用中使用DPAn-6，DPAn-3，DTAn-6和/或衍生自其的oxylipin，和/或衍生自C22脂肪酸结构的新型二十二烷酸，特别是作为抗炎或抗神经变性化合物。本发明还涉及生产长链多不饱和酸（LCPUFA）的油和组合物的新方法，其含有增强和有效量的LCPUFA衍生的草甘膦脂类，尤其是二十二烷酸。

7. 发明申请

US20070248586A1 OXYLIPINS FROM STEARIDONIC ACID AND GAMMA-LINOLENIC ACID AND METHODS OF MAKING AND USING THE SAME 失效
标题翻译：来自硬脂酸和γ-亚麻酸的氧化剂及其制备和使用方法
公开(公告)号：US20070248586A1
公开(公告)日：2007-10-25
申请号：US11669730
申请日：2007-01-31
申请人： Linda Arterburn , William Barclay , Bindi Dangi , James Flatt , Jung Lee , Dutt Vinjamoori
发明人： Linda Arterburn , William Barclay , Bindi Dangi , James Flatt , Jung Lee , Dutt Vinjamoori
IPC分类号： A61K31/19 , A61K31/35 , A61K38/43 , A61P25/28 , A61P29/00 , C07C53/00 , C07C63/04 , C07D315/00 , C12P7/00
CPC分类号： C12N15/8247 , C07C59/42 , C07D303/38 , C12P7/6427 , C12P7/6472
摘要： Disclosed are novel oxylipins that are derived from γ-linolenic acid (GLA; 18:3n-6) and stearidonic acid (STA or SDA; 18:4n-3), and methods of making and using such oxylipins. Also disclosed is the use of such oxylipins in therapeutic and nutritional or cosmetic applications, and particularly as anti-inflammatory or anti-neurodegenerative compounds. Also disclosed are The invention novel ways of producing long chain polyunsaturated acid (LCPUFA)-rich oils and compositions that contain enhanced and effective amounts of SDA- and/or GLA-derived oxylipins.
摘要翻译：公开了衍生自γ-亚麻酸（GLA; 18：3n-6）和十八碳四烯酸（STA或SDA; 18：4n-3）的新型oxylipin，以及制备和使用这些oxylipin的方法。还公开了在治疗和营养或化妆品应用中使用这种oxylipin，特别是作为抗炎或抗神经变性化合物。还公开了本发明新颖的生产长链多不饱和酸（LCPUFA）的油和组合物的新方法，其含有增强和有效量的SDA和/或GLA衍生的草甘膦。

8. 发明申请

US20070238449A1 Service restriction apparatus and method for portable communication device 审中-公开
标题翻译：用于便携式通信设备的服务限制装置和方法
公开(公告)号：US20070238449A1
公开(公告)日：2007-10-11
申请号：US11729432
申请日：2007-03-28
申请人： Jeon Park , Kyu Choi , Jung Lee
发明人： Jeon Park , Kyu Choi , Jung Lee
IPC分类号： H04M3/42
CPC分类号： H04W48/02 , H04L63/0236 , H04L63/083 , H04M1/663 , H04M1/667 , H04M1/72577 , H04W4/00 , H04W8/26 , H04W12/00514 , H04W12/06 , H04W12/08 , H04W76/10
摘要： A service restriction apparatus and method for a portable phone. A utilization restriction method for a portable communication device includes determining whether a service restriction function is activated when an incoming or outgoing call request is detected; determining whether a phone number of the incoming or outgoing call is registered in a communication-allowed phone number list if a service restriction function is activated; attempting to process the incoming or outgoing call if the phone number is registered in the communication-allowed phone number list; and blocking the incoming or outgoing call if the phone number is not registered in the communication-allowed phone number list.
摘要翻译：一种用于便携式电话的服务限制装置和方法。一种用于便携式通信设备的利用限制方法包括：当检测到呼入或呼出呼叫请求时确定服务限制功能是否被激活; 如果启用了服务限制功能，则确定在通话允许的电话号码列表中是否登记了呼入或呼出电话的电话号码; 如果电话号码注册在通信允许的电话号码列表中，则尝试处理来电或去电; 如果电话号码没有注册在允许通信的电话号码列表中，则阻止呼入或拨出呼叫。

9. 发明申请

US20070177565A1 Method of controlling data rate for a forward data service in a cdma 2000-1x system 审中-公开
标题翻译：在cdma 2000-1x系统中控制正向数据服务的数据速率的方法
公开(公告)号：US20070177565A1
公开(公告)日：2007-08-02
申请号：US10569041
申请日：2004-09-24
申请人： Jung Lee
发明人： Jung Lee
IPC分类号： H04B7/216 , H04Q7/00
CPC分类号： H04B7/2628
摘要： The present invention relates to a method for controlling a data rate for a forward data service in a CDMA 2000-1x system. Conventionally, the data rate from a base station to a mobile station is constant regardless of the wireless environment of the mobile station. As such, resources used in the base station for communication with the mobile station may be wasted if the data throughput is low due to the poor wireless environment. The present invention, however, resolves this problem by varying the data rate according to Energy of Carriers/Interference of Others' (Ec/Io) of the data, which indicates the wireless environment of the mobile station. With the present invention, the resources in a base station, which would be wasted for communication with a mobile station in a poor wireless environment, can be used for other mobile stations. Thus, the resources of the overall CDMA 2000-1x system can be used efficiently.
摘要翻译：本发明涉及一种用于在CDMA 2000-1x系统中控制正向数据业务的数据速率的方法。通常，无论移动台的无线环境如何，从基站到移动台的数据速率是恒定的。因此，如果由于差的无线环境导致的数据吞吐量低，则用于与移动台通信的基站中使用的资源可能被浪费。然而，本发明通过根据指示移动台的无线环境的数据的数据的“携带者/能力的干扰”（Ec / Io）改变数据速率来解决这个问题。利用本发明，在较差的无线环境中将被浪费用于与移动台通信的基站中的资源可以用于其他移动台。因此，可以有效地利用整个CDMA 2000-1x系统的资源。

10. 发明申请

US20070121774A1 Phase-locked loop for stably adjusting frequency-band of voltage-controlled oscillator and phase locking method 有权
标题翻译：用于稳压调压振荡器频带的锁相环和锁相方法
公开(公告)号：US20070121774A1
公开(公告)日：2007-05-31
申请号：US11595887
申请日：2006-11-13
申请人： Jung Lee , Chung Suh , Hoon Kim
发明人： Jung Lee , Chung Suh , Hoon Kim
IPC分类号： H03D3/24
CPC分类号： H03L7/10 , Y10S331/02
摘要： A phase-locked loop (PLL) for stably adjusting a frequency band of a voltage-controlled oscillator and a phase locking method. In the PLL, a frequency band controller alters the frequency band selection digital value in response to an input clock signal and an oscillation control signal generated from an LPF of a basic PLL circuit, and thus a voltage-controlled oscillator of the basic PLL circuit alters the frequency of an output clock signal in response to the oscillation control signal and the frequency band selection digital value. The output clock signal is rapidly and stably phase-locked at a target frequency depending on the frequency band selection digital value.
摘要翻译：用于稳定地调节压控振荡器的频带的锁相环（PLL）和相位锁定方法。在PLL中，频带控制器响应于从基本PLL电路的LPF产生的输入时钟信号和振荡控制信号来改变频带选择数字值，因此基本PLL电路的压控振荡器改变响应于振荡控制信号和频带选择数字值的输出时钟信号的频率。根据频带选择数字值，输出时钟信号以目标频率快速稳定地相位锁定。

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