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1. 发明授权

US09671123B2 Air conditioner 有权
公开(公告)号：US09671123B2
公开(公告)日：2017-06-06
申请号：US13598073
申请日：2012-08-29
申请人： Dong Gyu Lee , Ho Yoon , Jae Hun Choi , Tae Ha Jun
发明人： Dong Gyu Lee , Ho Yoon , Jae Hun Choi , Tae Ha Jun
IPC分类号： B23K9/10 , A61L9/22 , F24F11/00
CPC分类号： F24F11/006 , F24F11/30 , F24F11/46 , F24F11/49 , F24F11/61 , F24F11/62 , F24F11/63 , F24F11/66 , F24F11/88
摘要： An air conditioner having an indoor unit and an outdoor unit, at least one of which includes a communication unit, a switching unit turned on when communication lines are connected to the communication unit, turned off in a standby mode, and turned on when the standby mode is released, a voltage distribution unit distributing voltage applied to the communication unit when the switching unit is turned off, a voltage adjustment unit adjusting the voltage applied to the communication unit and transmitting the adjusted voltage to the communication unit, and a control unit turning the switching unit on when driving voltage is input to the control unit, turning the switching unit off when the at least one of the indoor unit and the outdoor unit enters the standby mode, and turning the switching unit on based on the voltage distributed by the voltage distribution unit in the standby mode.

2. 发明申请

US20130067941A1 AIR CONDITIONER 有权
标题翻译：冷气机
公开(公告)号：US20130067941A1
公开(公告)日：2013-03-21
申请号：US13598073
申请日：2012-08-29
申请人： Dong Gyu Lee , Ho Yoon , Jae Hun Choi , Tae Ha Jun
发明人： Dong Gyu Lee , Ho Yoon , Jae Hun Choi , Tae Ha Jun
IPC分类号： F25B49/00
CPC分类号： F24F11/006 , F24F11/30 , F24F11/46 , F24F11/49 , F24F11/61 , F24F11/62 , F24F11/63 , F24F11/66 , F24F11/88
摘要： An air conditioner having an indoor unit and an outdoor unit, at least one of which includes a communication unit, a switching unit turned on when communication lines are connected to the communication unit, turned off in a standby mode, and turned on when the standby mode is released, a voltage distribution unit distributing voltage applied to the communication unit when the switching unit is turned off, a voltage adjustment unit adjusting the voltage applied to the communication unit and transmitting the adjusted voltage to the communication unit, and a control unit turning the switching unit on when driving voltage is input to the control unit, turning the switching unit off when the at least one of the indoor unit and the outdoor unit enters the standby mode, and turning the switching unit on based on the voltage distributed by the voltage distribution unit in the standby mode.
摘要翻译：一种具有室内单元和室外单元的空调器，其中至少一个包括通信单元，当通信线路连接到通信单元时接通的切换单元在待机模式下被关闭，并且当待机模式被释放，电压分配单元，当开关单元断开时分配施加到通信单元的电压;电压调节单元，调节施加到通信单元的电压并将调整的电压传送到通信单元;以及控制单元，当驱动电压被输入到控制单元时，开关单元接通，当室内单元和室外单元中的至少一个进入待机模式时关闭开关单元，并且基于由电压分配单元处于待机模式。

3. 发明授权

US08145443B2 Fourier transform-based phasor estimation method and apparatus capable of eliminating influence of exponentially decaying DC offsets 有权
标题翻译：能够消除指数衰减DC偏移影响的基于傅立叶变换的相量估计方法和装置
公开(公告)号：US08145443B2
公开(公告)日：2012-03-27
申请号：US12423223
申请日：2009-04-14
申请人： Sang Hee Kang , Dong Gyu Lee
发明人： Sang Hee Kang , Dong Gyu Lee
IPC分类号： G01R23/16
CPC分类号： G01R19/0015 , G01R15/18 , G01R31/024
摘要： Disclosed herein is a Fourier transform-based phasor estimation method and apparatus capable of eliminating the influence of exponentially decaying DC offsets. According to a Fourier transform-based phasor estimation method according to an embodiment of the present invention, an input signal is sampled, and samples of one-cycle data of the input signal are separated into at least two sample groups. A Discrete Fourier Transform (DFT) is performed on each of the sample groups. A DC offset included in the input signal is calculated on a basis of results of the DFT on each of the sample groups, and an error caused by the DC offset is calculated using the calculated DC offset. A phasor of a fundamental frequency component included in the input signal is estimated by eliminating the calculated error, caused by the DC offset, from the results of the DFT on the input signal.
摘要翻译：本文公开了一种能够消除指数衰减DC偏移影响的基于傅立叶变换的相量估计方法和装置。根据本发明实施例的基于傅里叶变换的相量估计方法，对输入信号进行采样，将输入信号的一周期数据的采样分成至少两个采样组。对每个样本组执行离散傅里叶变换（DFT）。基于每个样本组上的DFT的结果计算输入信号中包括的DC偏移，并且使用计算的DC偏移计算由DC偏移引起的误差。通过从输入信号的DFT的结果中消除由DC偏移引起的计算出的误差来估计包括在输入信号中的基频分量的相量。

4. 发明申请

US20110186991A1 Package substrate and method of fabricating the same 有权
标题翻译：封装基板及其制造方法
公开(公告)号：US20110186991A1
公开(公告)日：2011-08-04
申请号：US12926314
申请日：2010-11-09
申请人： Dong Gyu Lee , Dae Young Lee , Tae Joon Chung , Seon Jae Mun , Jin Won Choi
发明人： Dong Gyu Lee , Dae Young Lee , Tae Joon Chung , Seon Jae Mun , Jin Won Choi
IPC分类号： H01L23/485 , H01L21/441
CPC分类号： H01L21/4853 , H01L21/441 , H01L23/485 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0346 , H01L2224/0347 , H01L2224/05572 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082
摘要： There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.
摘要翻译：提供一种能够通过改善后端子的组成和形成来控制其翘曲程度的封装基板及其制造方法。封装衬底包括具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 隔离层，设置在所述开口内的所述导电垫上，并形成为比所述绝缘层的所述侧壁的上表面高; 设置在分离阻挡层上的柱状端子; 以及设置在柱端子上的焊料凸块。

5. 发明授权

US08822841B2 Package substrate and fabricating method thereof 有权
标题翻译：封装基板及其制造方法
公开(公告)号：US08822841B2
公开(公告)日：2014-09-02
申请号：US13411168
申请日：2012-03-02
申请人： Dong Gyu Lee , Jin Won Choi , Sung Won Jeong , Dae Young Lee , Gi Sub Lee , Jin Ho Kim
发明人： Dong Gyu Lee , Jin Won Choi , Sung Won Jeong , Dae Young Lee , Gi Sub Lee , Jin Ho Kim
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0346 , H01L2224/0347 , H01L2224/0401 , H01L2224/05572 , H01L2224/05647 , H01L2224/10145 , H01L2224/1146 , H01L2224/11849 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , Y10T29/49165 , H01L2924/00012 , H01L2924/01028 , H01L2924/01046 , H01L2924/01083 , H01L2224/05552
摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.
摘要翻译：这里公开了一种封装基板及其制造方法。封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层，绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。

6. 发明授权

US08704928B2 Pixel, pixel array, image sensor including the same and method for operating the image sensor 有权
标题翻译：像素像素阵列，图像传感器包括与图像传感器相同的操作方法
公开(公告)号：US08704928B2
公开(公告)日：2014-04-22
申请号：US13097681
申请日：2011-04-29
申请人： Seung Hoon Sa , Woon Il Choi , Seong Hyung Park , Chun Hee Jeong , Dong Hyuk Park , Cheong Yong Park , Jung Chan Kyoung , Jung Wan Jeong , Dong Gyu Lee , Jong Min You , Hyun Jong Ji
发明人： Seung Hoon Sa , Woon Il Choi , Seong Hyung Park , Chun Hee Jeong , Dong Hyuk Park , Cheong Yong Park , Jung Chan Kyoung , Jung Wan Jeong , Dong Gyu Lee , Jong Min You , Hyun Jong Ji
IPC分类号： H04N5/335
CPC分类号： H04N5/355 , H04N5/35536 , H04N5/37457
摘要： Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a capacitor for storing charges converted by the photo-electro conversion unit; an output switching device for outputting an electric potential of the capacitor; and a removal unit for removing a part of the charges converted by the photo-electro conversion unit.
摘要翻译：公开了像素，像素阵列，包括像素阵列的图像传感器和用于操作图像传感器的方法。像素包括光电转换单元; 用于存储由光电转换单元转换的电荷的电容器; 用于输出电容器的电位的输出开关装置; 以及去除由光电转换单元转换的电荷的一部分的去除单元。

7. 发明授权

US09287304B2 Image sensor including a pixel array each pixel comprising a variable capacitor and a capacitor 有权
标题翻译：图像传感器包括像素阵列，每个像素包括可变电容器和电容器
公开(公告)号：US09287304B2
公开(公告)日：2016-03-15
申请号：US13098030
申请日：2011-04-29
申请人： Seong Hyung Park , Woon Il Choi , Seung Hoon Sa , Cheong Yong Park , Dong Gyu Lee , Hyun Jong Ji
发明人： Seong Hyung Park , Woon Il Choi , Seung Hoon Sa , Cheong Yong Park , Dong Gyu Lee , Hyun Jong Ji
IPC分类号： H01J40/14 , H01L27/00 , H01L27/146 , H04N5/355
CPC分类号： H01L27/14609 , H01L27/14641 , H04N5/3559
摘要： Provided are a pixel, a pixel array, and an image sensor including the pixel array. The pixel includes a photoelectric converter, a capacitor, a variable capacitor, and a switching element. The capacitor accumulates electric charges converted by the photoelectric converter. The variable capacitor is connected to the capacitor, and has capacitance varied according to a potential of the capacitor. The switching element outputs the potential of the capacitor.
摘要翻译：提供了像素，像素阵列和包括像素阵列的图像传感器。像素包括光电转换器，电容器，可变电容器和开关元件。电容器累积由光电转换器转换的电荷。可变电容器连接到电容器，并且具有根据电容器的电位而变化的电容。开关元件输出电容器的电位。

8. 发明申请

US20120261549A1 PIXEL, PIXEL ARRAY, AND IMAGE SENSOR INCLUDING PIXEL ARRAY 有权
标题翻译：像素，像素阵列和包含像素阵列的图像传感器
公开(公告)号：US20120261549A1
公开(公告)日：2012-10-18
申请号：US13098030
申请日：2011-04-29
申请人： SEONG HYUNG PARK , Woon II Choi , Seung Hoon Sa , Cheong Yong Park , Dong Gyu Lee , Hyun Jong Ji
发明人： SEONG HYUNG PARK , Woon II Choi , Seung Hoon Sa , Cheong Yong Park , Dong Gyu Lee , Hyun Jong Ji
IPC分类号： H01L27/146 , H01L31/02
CPC分类号： H01L27/14609 , H01L27/14641 , H04N5/3559
摘要： Provided are a pixel, a pixel array, and an image sensor including the pixel array. The pixel includes a photoelectric converter, a capacitor, a variable capacitor, and a switching element. The capacitor accumulates electric charges converted by the photoelectric converter. The variable capacitor is connected to the capacitor, and has capacitance varied according to a potential of the capacitor. The switching element outputs the potential of the capacitor.
摘要翻译：提供了像素，像素阵列和包括像素阵列的图像传感器。像素包括光电转换器，电容器，可变电容器和开关元件。电容器累积由光电转换器转换的电荷。可变电容器连接到电容器，并且具有根据电容器的电位而变化的电容。开关元件输出电容器的电位。

9. 发明申请

US20120257093A1 PIXEL, PIXEL ARRAY, IMAGE SENSOR INCLUDING THE SAME AND METHOD FOR OPERATING THE IMAGE SENSOR 有权
标题翻译：像素，像素阵列，包括它们的图像传感器和操作图像传感器的方法
公开(公告)号：US20120257093A1
公开(公告)日：2012-10-11
申请号：US13097704
申请日：2011-04-29
申请人： Seung Hoon Sa , Woon Il Choi , Seong Hyung Park , Chun Hee Jeong , Dong Hyuk Park , Cheong Yong Park , Jung Chan Kyoung , Jung Wan Jeong , Dong Gyu Lee , Jong Min You , Hyun Jong Ji
发明人： Seung Hoon Sa , Woon Il Choi , Seong Hyung Park , Chun Hee Jeong , Dong Hyuk Park , Cheong Yong Park , Jung Chan Kyoung , Jung Wan Jeong , Dong Gyu Lee , Jong Min You , Hyun Jong Ji
IPC分类号： H04N5/335
CPC分类号： H01L27/14609 , H01L27/14641 , H04N5/3559 , H04N5/37452
摘要： Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a first capacitor for storing a first quantity of charges of the photo-electro conversion unit; a second capacitor for storing a second quantity of charges of the photo-electro conversion unit; and an output unit to output the first and second quantities of the charges.
摘要翻译：公开了像素，像素阵列，包括像素阵列的图像传感器和用于操作图像传感器的方法。像素包括光电转换单元; 用于存储光电转换单元的第一电荷量的第一电容器; 用于存储光电转换单元的第二数量的电荷的第二电容器; 以及输出单元，用于输出第一和第二数量的电荷。

10. 发明授权

US08142240B2 Lead pin for package substrate 失效
标题翻译：封装基板引脚
公开(公告)号：US08142240B2
公开(公告)日：2012-03-27
申请号：US12805214
申请日：2010-07-19
申请人： Heung Jae Oh , Ki Taek Lee , Dong Gyu Lee , Sung Won Jeong , Jin Won Choi
发明人： Heung Jae Oh , Ki Taek Lee , Dong Gyu Lee , Sung Won Jeong , Jin Won Choi
IPC分类号： H01R4/02
CPC分类号： H05K3/3426 , H01L2924/15312 , H05K2201/10318 , H05K2201/10772 , Y02P70/613
摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.
摘要翻译：这里公开了一种用于封装衬底的引脚。用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染，以在连接插座时改善诸如短缺陷等的接触缺陷。

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