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1. 发明授权

US5519177A Adhesives, adhesive layers for electroless plating and printed circuit boards 失效
标题翻译：粘合剂，无电镀层和印刷电路板的粘合层
公开(公告)号：US5519177A
公开(公告)日：1996-05-21
申请号：US243172
申请日：1994-05-16
申请人： Dong D. Wang , Motoo Asai
发明人： Dong D. Wang , Motoo Asai
IPC分类号： C08J3/00 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/20 , H05K3/00 , H05K3/18 , H05K3/46 , H05K1/02
CPC分类号： H05K3/4661 , C08J3/005 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K3/0023 , H05K3/181
摘要： An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
摘要翻译：通过将可溶于酸或氧化剂的固化的耐热树脂粉末分散在难溶于酸或氧化剂的未固化的耐热树脂基体中，形成印刷电路板形成中的无电镀的粘合剂。其中耐热树脂基质是热塑性树脂和未固化的热固性树脂或未固化的感光树脂的混合物的固化处理。

2. 发明授权

US08830691B2 Printed circuit board and method of manufacturing printed circuit board 有权
标题翻译：印刷电路板及制造印刷电路板的方法
公开(公告)号：US08830691B2
公开(公告)日：2014-09-09
申请号：US12784634
申请日：2010-05-21
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternately laminated on the core substrate, solder bumps formed on an outer surface of the printed circuit board, a first capacitor formed in the opening of the second resin substrate, a conductive pad formed on the first resin substrate and connected to an electrode of the first capacitor, a via hole formed in the first resin substrate and directly connected to the conductive pad and a conductive circuit on the core substrate, and a second capacitor mounted on a surface of the printed circuit board.
摘要翻译：一种印刷电路板，包括具有第一树脂基板的芯基板，具有开口的第二树脂基板和第三树脂基板，同时插入在芯基板上交替层叠的接合板，绝缘层和导电电路层，焊料凸块形成在所述印刷电路板的外表面上的第一电容器，形成在所述第二树脂基板的开口中的第一电容器，形成在所述第一树脂基板上并连接到所述第一电容器的电极的导电焊盘，树脂基板，并且直接连接到导电焊盘和芯基板上的导电电路，以及安装在印刷电路板的表面上的第二电容器。

3. 发明授权

US08780573B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08780573B2
公开(公告)日：2014-07-15
申请号：US13665325
申请日：2012-10-31
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/16
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.
摘要翻译：印刷电路板包括容纳层，容纳层中容纳的片状电容器器件，以及形成在容纳层上的堆积结构，使得堆积结构覆盖容纳层中的片状电容器器件。积层结构具有安装导体结构，其被定位成将IC芯片装置安装在积层结构的表面上，使得IC芯片装置直接安装在芯片电容器装置上，每个芯片电容器装置具有电介质体，所述积聚结构，形成在所述电介质体上且在所述电介质体的表面上延伸的第一电极，以及形成在所述电介质体上并在所述电介质体的表面上延伸的第二电极，并且所述电介质体介于所述第一电极电极和第二电极。

4. 发明授权

US08745863B2 Method of manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US08745863B2
公开(公告)日：2014-06-10
申请号：US13169674
申请日：2011-06-27
申请人： Motoo Asai , Dongdong Wang , Takahiro Mori
发明人： Motoo Asai , Dongdong Wang , Takahiro Mori
IPC分类号： H01K3/10
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate.
摘要翻译：制造多层印刷电路板的方法包括以下步骤（A）和（B）。（A）提供穿透开口，其形成为通孔，并且每个具有用于芯基板的小直径，以及（B）提供形成为具有用于芯基板的大直径的通孔的穿透开口。

5. 发明授权

US08331102B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US08331102B2
公开(公告)日：2012-12-11
申请号：US12034504
申请日：2008-02-20
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/16
CPC分类号： H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： Chip capacitors are provided in a printed circuit board. In this manner, the distance between the IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
摘要翻译：片状电容器设置在印刷电路板中。以这种方式，IC芯片和每个芯片电容器之间的距离缩短，并且环路电感减小。此外，芯片电容器容纳在具有大厚度的芯基板中。因此，印刷电路板的厚度不会变大。

6. 再颁专利

USRE43509E1 Printed wiring board and method for manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：USRE43509E1
公开(公告)日：2012-07-17
申请号：US11595000
申请日：1997-12-18
申请人： Motoo Asai , Yasuji Hiramatsu , Yoshinori Wakihara , Kazuhito Yamada
发明人： Motoo Asai , Yasuji Hiramatsu , Yoshinori Wakihara , Kazuhito Yamada
IPC分类号： H05K1/03
CPC分类号： H05K3/108 , H05K1/0269 , H05K3/067 , H05K3/244 , H05K3/3452 , H05K3/382 , H05K3/384 , H05K3/4661 , H05K2201/0989 , H05K2201/09918 , H05K2203/0307 , H05K2203/072 , Y10S428/901 , Y10T29/49002 , Y10T29/49156 , Y10T29/49167 , Y10T156/1056 , Y10T428/24917
摘要： A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
摘要翻译：印刷电路板是通过在基板的导体电路上层叠层间绝缘层而形成的，其中导体电路由无电解电镀膜和电解电镀膜构成，并且在至少一部分上形成有粗糙层导体电路的表面。

7. 发明授权

US08115111B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US08115111B2
公开(公告)日：2012-02-14
申请号：US12646517
申请日：2009-12-23
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H05K1/11
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer.
摘要翻译：多层印刷线路板包括具有导体电路层和层间绝缘层的多层结构，所述层间绝缘层包括最外层间绝缘层，所述导体电路层包括形成在最外层间绝缘体上的最外导体电路层，填充通孔形成在最外层间绝缘层中并且具有一个或多个金属电镀填充物并且完全闭合通过最外层间绝缘层形成的孔，使得填充通孔的金属镀层延伸出孔并形成基本平坦的表面，并且焊料凸点包括形成在填充通孔的基本上平坦的表面上的第一焊料凸块和形成在最外导体电路层的表面部分上的第二焊料凸点。填充通孔的基本上平坦的表面基本上与最外面的导体电路层的表面部分的高度平齐。

8. 发明申请

US20110253306A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110253306A1
公开(公告)日：2011-10-20
申请号：US13169736
申请日：2011-06-27
申请人： Motoo Asai , Dongdong Wang , Takahiro Mori
发明人： Motoo Asai , Dongdong Wang , Takahiro Mori
IPC分类号： H05K3/00 , B32B38/04
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.
摘要翻译：制造印刷电路板的方法包括以下步骤（A）至（D）。（A）在芯部件的两侧各自层叠树脂绝缘层，形成芯基板，（B）通过施加激光而在芯基板上形成贯通孔，（C）在芯基板上形成粗糙面，和（D）为每个穿透孔提供金属膜以形成通孔。

9. 发明授权

US07910836B2 Multilayered printed circuit board, solder resist composition, and semiconductor device 有权
标题翻译：多层印刷电路板，阻焊剂组合物和半导体器件
公开(公告)号：US07910836B2
公开(公告)日：2011-03-22
申请号：US11838365
申请日：2007-08-14
申请人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
发明人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
IPC分类号： H05K1/03
CPC分类号： H05K3/285 , H01L2924/15311 , H01L2924/15312 , H05K3/4602
摘要： The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
摘要翻译：本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和串联形成在所述多层印刷电路板上的树脂绝缘层基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含无机填料。

10. 发明授权

US07881069B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US07881069B2
公开(公告)日：2011-02-01
申请号：US11778139
申请日：2007-07-16
申请人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
发明人： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A chip capacitor is provided in a core substrate of a printed circuit board. This makes it possible to shorten a distance between an IC chip and the chip capacitor and to reduce loop inductance. Since the core substrate is constituted by provided a first resin substrate, a second resin substrate and a third resin substrate in a multilayer manner, the core substrate can obtain sufficient strength.
摘要翻译：在印刷电路板的芯基板中设置片状电容器。这使得可以缩短IC芯片和芯片电容器之间的距离并减小环路电感。由于通过以多层方式设置第一树脂基板，第二树脂基板和第三树脂基板来构成芯基板，所以能够获得足够的强度。

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