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1. 发明授权

US07622183B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US07622183B2
公开(公告)日：2009-11-24
申请号：US11385904
申请日：2006-03-22
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： B32B3/00
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
摘要翻译：本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。导体电路层的厚度小于通孔直径的一半，小于25μm。形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。在包括无电镀层的孔中填充电镀层以形成通孔。层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

2. 发明申请

US20100101852A1 MULTILAYER PRINTED WIRING BOARD WITH FILLED VIAHOLE STRUCTURE 有权
标题翻译：多层印刷线路板，具有填充的结构
公开(公告)号：US20100101852A1
公开(公告)日：2010-04-29
申请号：US12646517
申请日：2009-12-23
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H05K1/11
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
摘要翻译：本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。导体电路层的厚度小于通孔直径的一半，小于25μm。形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。在包括无电镀层的孔中填充电镀层以形成通孔。层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

3. 发明申请

US20050100720A1 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US20050100720A1
公开(公告)日：2005-05-12
申请号：US11020035
申请日：2004-12-23
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H05K3/10 , H05K3/38 , H05K3/42 , H05K3/46 , B32B15/00 , B32B3/00
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
摘要翻译：本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。导体电路层的厚度小于通孔直径的一半，小于25μm。形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。在包括无电镀层的孔中填充电镀层以形成通孔。层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

4. 发明授权

US06365843B1 Multilayer printed wiring board 有权
标题翻译：多层印刷线路板
公开(公告)号：US06365843B1
公开(公告)日：2002-04-02
申请号：US09582665
申请日：2000-06-29
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H01R1204
CPC分类号： H05K3/4644 , H05K1/113 , H05K1/115 , H05K3/184 , H05K3/3452 , H05K3/3457 , H05K3/381 , H05K3/384 , H05K3/423 , H05K3/4602 , H05K3/4661 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , H05K2201/099
摘要： A filled-via structure multilayer printed wiring board is provided which exhibits excellent reliability of the connection between via holes. An opening 42 formed in a lower interlaminer resin insulating layer 40 is filled with plated metal 48 so that a lower via hole 50 having a flat surface is formed. An opening 62 is formed in an interlaminer resin insulating layer 60 above the lower via hole 50 so that an upper via hole 70 is formed. Since the lower via hole 50 has a flat surface and resin is not residual on the surface, the reliability of the connection between the lower via hole 50 and the upper via hole 70 can be maintained. Since the lower via hole 50 has a flat surface, the smoothness and flatness of the surface of the multilayer printed wiring board can be maintained even if the upper via hole 70 is superimposed on the lower via hole 50.
摘要翻译：提供了一种填充通孔结构的多层印刷线路板，其显示了通孔之间的连接的良好的可靠性。形成在下部层间树脂绝缘层40中的开口42填充有电镀金属48，从而形成具有平坦表面的下通孔50。在下通孔50上方的层间树脂绝缘层60中形成开口62，从而形成上通孔70。由于下通孔50具有平坦表面，树脂在表面上不残留，因此可以保持下通孔50和上通孔70之间的连接的可靠性。由于下通孔50具有平坦的表面，所以即使上通孔70重叠在下通孔50上，也可以保持多层印刷电路板的表面的平滑度和平坦度。

5. 发明授权

US08115111B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US08115111B2
公开(公告)日：2012-02-14
申请号：US12646517
申请日：2009-12-23
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H05K1/11
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer.
摘要翻译：多层印刷线路板包括具有导体电路层和层间绝缘层的多层结构，所述层间绝缘层包括最外层间绝缘层，所述导体电路层包括形成在最外层间绝缘体上的最外导体电路层，填充通孔形成在最外层间绝缘层中并且具有一个或多个金属电镀填充物并且完全闭合通过最外层间绝缘层形成的孔，使得填充通孔的金属镀层延伸出孔并形成基本平坦的表面，并且焊料凸点包括形成在填充通孔的基本上平坦的表面上的第一焊料凸块和形成在最外导体电路层的表面部分上的第二焊料凸点。填充通孔的基本上平坦的表面基本上与最外面的导体电路层的表面部分的高度平齐。

6. 发明授权

US07071424B1 Multilayer printed wiring board having filled-via structure 有权
标题翻译：具有填充通孔结构的多层印刷线路板
公开(公告)号：US07071424B1
公开(公告)日：2006-07-04
申请号：US09600890
申请日：1999-02-05
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
摘要翻译：本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层构成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。导体电路层的厚度小于通孔直径的一半，小于25μm。形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。在包括无电镀层的孔中填充电镀层以形成通孔。层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

7. 发明授权

US08987603B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US08987603B2
公开(公告)日：2015-03-24
申请号：US13348708
申请日：2012-01-12
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H05K1/03 , H05K3/46 , H05K3/42 , H05K3/10 , H05K3/38
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer.
摘要翻译：多层印刷线路板包括具有导体电路层和层间绝缘层的多层结构，所述层间绝缘层包括最外层间绝缘层，所述导体电路层包括形成在最外层间绝缘体上的最外导体电路层，填充通孔形成在最外层间绝缘层中并且具有一个或多个金属电镀填充物并且完全闭合通过最外层间绝缘层形成的孔，使得填充通孔的金属镀层延伸出孔并形成基本平坦的表面，并且焊料凸点包括形成在填充通孔的基本上平坦的表面上的第一焊料凸块和形成在最外导体电路层的表面部分上的第二焊料凸点。填充通孔的基本上平坦的表面基本上与最外面的导体电路层的表面部分的高度平齐。

8. 发明授权

US07737366B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US07737366B2
公开(公告)日：2010-06-15
申请号：US12164710
申请日：2008-06-30
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： A multilayer printed wiring board having a multilayered structure including multiple conductor circuit layers and multiple interlaminar insulative layers, the conductor layers having one or more conductor circuit portions, the interlaminar insulative resin layers including the outermost interlaminar insulative resin layer forming the outermost layer of the multilayered structure, a filled-viahole formed in the outermost interlaminar insulative resin layer and made of one or more metal plating filling and completely closing a hole formed through the outermost interlaminar insulative resin layer, the metal plating of the filled-viahole extending out of the hole and having a substantially flat surface, the filled-viahole electrically connected to the conductor circuit portion in the conductor circuit layers, and a solder bump formed on the substantially flat surface of the filled-viahole.
摘要翻译：一种多层印刷线路板，具有包括多个导体电路层和多个层间绝缘层的多层结构，所述导体层具有一个或多个导体电路部分，所述层间绝缘树脂层包括形成所述多层的最外层的最外层间绝缘树脂层结构，形成在最外层间绝缘树脂层中的填充通孔，并由一个或多个金属电镀填充并且完全闭合通过最外层间绝缘树脂层形成的孔，填充通孔延伸出孔的金属电镀并且具有基本上平坦的表面，电连接到导体电路层中的导体电路部分的填充通孔以及形成在填充通孔的基本上平坦表面上的焊料凸块。

9. 发明授权

US07390974B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US07390974B2
公开(公告)日：2008-06-24
申请号：US11020035
申请日：2004-12-23
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H01R12/04
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.
摘要翻译：本发明提供了一种多层印刷线路板，其具有有利地用于在其上形成精细电路图案的填充通孔结构，并且在热冲击下或由于热循环具有优异的抗开裂性。多层印刷布线板由交替地彼此堆叠的导体电路层和层间绝缘树脂层组成，层间绝缘树脂层各自形成有各自填充有镀层的孔，以形成通孔。露出用于通孔的孔的镀层的表面形成为基本上平坦，并且位于与布置在层间绝缘树脂层中的导体电路的表面基本相同的水平。导体电路层的厚度小于通孔直径的一半，小于25μm。形成在层间绝缘树脂层中的孔的内壁变粗糙，并且在粗糙化表面上沉积化学镀层。在包括无电镀层的孔中填充电镀层以形成通孔。层间绝缘树脂层由显示高断裂韧性的氟树脂和耐热性热塑性树脂，氟树脂和热固性树脂的复合物或热固性和热塑性树脂的复合材料的复合材料形成。

10. 发明申请

US20060159885A1 Multilayer printed wiring board with filled viahole structure 有权
公开(公告)号：US20060159885A1
公开(公告)日：2006-07-20
申请号：US11385904
申请日：2006-03-22
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： B32B3/10 , B32B3/00
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 μm. The inner wall of the hole formed in the interlaminar insulative resin layer is roughened and an electroless plating layer is deposited on the roughened surface. An electroplating layer is filled in the hole including the electroless plating layer to form the viahole. The interlaminar insulative resin layer is formed from a composite of a fluororesin showing a high fracture toughness and a heat-resistant thermoplastic resin, a composite of fluororesin and thermosetting resin or a composite of thermosetting and thermoplastic resins.

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