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1. 发明授权

US06915566B2 Method of fabricating flexible circuits for integrated circuit interconnections 有权
标题翻译：制造用于集成电路互连的柔性电路的方法
公开(公告)号：US06915566B2
公开(公告)日：2005-07-12
申请号：US09514762
申请日：2000-02-28
申请人： Donald C. Abbott , John E. Cotugno , Robert M. Fritzsche , Robert A. Sabo , Christopher M. Sullivan , David W. West
发明人： Donald C. Abbott , John E. Cotugno , Robert M. Fritzsche , Robert A. Sabo , Christopher M. Sullivan , David W. West
IPC分类号： H01L21/60 , H01L23/498 , H05K1/00 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/20 , H05K3/40 , H01K3/10
CPC分类号： H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H05K1/0393 , H05K3/005 , H05K3/064 , H05K3/102 , H05K3/20 , H05K3/205 , H05K3/207 , H05K3/4038 , H05K2201/09563 , H05K2201/09981 , H05K2203/0108 , H05K2203/0195 , H05K2203/033 , H05K2203/0338 , H05K2203/0369 , H05K2203/0522 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for the fabrication of a double-sided electrical interconnection flexible circuit (200) particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs (203) is pressed through a dielectric film (201) having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.
摘要翻译：一种用于制造特别可用作面阵列集成电路封装的衬底的双面电互连柔性电路（200）的方法。具有螺柱（203）的铜基体通过在相对表面上具有铜层的电介质膜（201）被挤压，从而在一步法中形成具有自对准固体铜通孔的柔性电路的中间结构。通过用铜层镀覆两个表面来增强触点，并且使用常规工艺来完成电路图案化。

2. 发明授权

US6153518A Method of making chip size package substrate 有权
标题翻译：制造芯片尺寸封装基板的方法
公开(公告)号：US6153518A
公开(公告)日：2000-11-28
申请号：US301533
申请日：1999-04-28
申请人： Donald C. Abbott , David W. West
发明人： Donald C. Abbott , David W. West
IPC分类号： H01L23/12 , H01L21/48 , H05K3/06 , H05K3/40 , H01L21/44
CPC分类号： H05K3/4038 , H01L21/4853 , H01L21/486 , H05K2201/09563 , H05K2203/1189 , H05K3/06
摘要： A method of fabricating an electrically conductive via in a substrate which includes providing an electrically insulating substrate having first and second opposing surfaces and forming a first layer of electrically conductive material on the first of the opposing surfaces and forming a second layer of electrically conductive material on the second of the opposing surface. In accordance with one embodiment, the second layer has a thickness greater than the electrically insulating layer and no greater than the sum of the thicknesses of the electrically insulating layer and the first layer. In accordance with a second embodiment, the second layer has a thickness greater than the electrically insulating layer and no greater than the sum of the thicknesses of the electrically insulating layer and the first layer. A hole is formed in the first layer having sidewalls. A stud is formed in the second layer aligned with the hole in the first layer. The stud is forced through the substrate and into contact with the sidewalls of the hole. The stud preferably has a cross section to provide a friction fit with the sidewalls of the hole. In accordance with the second embodiment, the stud will extend beyond the bottom side of the polyimide layer to provide the effect of a ball from a ball grid array. The substrate can be heated to a thermoplastic state prior to forcing the stud through the substrate, if necessary. The substrate is preferably a polyimide and the electrically conductive material is preferably taken from the class consisting of copper and copper-based materials.
摘要翻译：一种在衬底中制造导电通孔的方法，其包括提供具有第一和第二相对表面的电绝缘衬底，并且在第一相对表面上形成第一导电材料层，并在第二层导电材料上形成第二层导电材料对面的第二个表面。根据一个实施例，第二层具有大于电绝缘层的厚度，不大于电绝缘层和第一层的厚度之和。根据第二实施例，第二层的厚度大于电绝缘层，不大于电绝缘层和第一层的厚度之和。在具有侧壁的第一层中形成有孔。在与第一层中的孔对准的第二层中形成螺柱。螺柱被迫穿过基板并与孔的侧壁接触。螺柱优选地具有横截面以提供与孔的侧壁的摩擦配合。根据第二实施例，螺柱将延伸超出聚酰亚胺层的底侧，以提供来自球栅阵列的球的作用。如果需要，可以在将螺柱穿过基底之前将基底加热至热塑性状态。基板优选为聚酰亚胺，导电材料优选为由铜和铜基材料构成的类型。

3. 发明授权

US5480519A Electrochemical etch system and method 失效
标题翻译：电化学蚀刻系统及方法
公开(公告)号：US5480519A
公开(公告)日：1996-01-02
申请号：US384041
申请日：1995-02-06
申请人： Donald C. Abbott , George A. Dainis, III , David W. West
发明人： Donald C. Abbott , George A. Dainis, III , David W. West
IPC分类号： C25F3/14 , C25F3/02 , C25F7/00
CPC分类号： C25F3/14
摘要： A method and apparatus for forming lead frames and eliminating irregularities in the edge (22) of openings etched in the sheet metal from which the lead frame is formed. In a first process, a photo resist coated metal sheet (36) is first etched by a photo chemical process to define the lead frame, and then the lead frame metal sheet (36) is etched in an electrochemical process to remove edge irregularities. In a second process, the entire lead frame is formed in an electrochemical process.
摘要翻译：一种用于形成引线框架并消除在形成引线框架的金属片中蚀刻的开口的边缘（22）中的不规则性的方法和装置。在第一工艺中，首先通过光化学工艺蚀刻光致抗蚀剂涂覆金属片（36）以限定引线框架，然后在电化学过程中蚀刻引线框架金属片（36）以消除边缘不规则。在第二过程中，整个引线框架以电化学过程形成。

4. 发明授权

US07591955B2 Method for forming an etched soft edge metal foil and the product thereof 有权
标题翻译：蚀刻软边金属箔的形成方法及其制品
公开(公告)号：US07591955B2
公开(公告)日：2009-09-22
申请号：US11457369
申请日：2006-07-13
申请人： Raymond A. Frechette , David W. West , Christopher Machado , Christopher M. Sullivan
发明人： Raymond A. Frechette , David W. West , Christopher Machado , Christopher M. Sullivan
IPC分类号： C23F1/00 , B44C1/22
CPC分类号： B26B19/384 , C23F1/02 , C25F3/14
摘要： A metal processing method includes etching to remove material from a thin metal part. A pattern of etch resistant material is used to prevent etching of the metal in desired locations. The etch resistant material is intentionally applied to unclean surfaces so that an adhesion between the etch resistant material and the metal will fail during the etching process. An edge is formed during etching at the boundaries of the pattern of the etch resistant material. These edges are rounded where the adhesion fails. A shaver foil is produced using the described metal processing method including a face side, a cutter side and a plurality of whisker holes. A face edge is formed where an etched profile of the whisker hole meets the face side and a cutter edge is formed where the etched profile of the whisker hole meets the cutter side. The face edge is rounded using the aforementioned process and the cutter edge is sharp using a conventional etch resistant material application method.
摘要翻译：金属加工方法包括蚀刻以从薄金属部件去除材料。使用耐腐蚀材料的图案来防止金属在所需位置的蚀刻。耐蚀刻材料被有意地施加到不洁表面，使得在蚀刻工艺期间，耐蚀刻材料和金属之间的粘合将失效。在蚀刻期间在耐蚀刻材料的图案的边界处形成边缘。这些边缘在附着失败的地方是圆形的。使用包括正面，切割面和多个晶须孔的所述金属加工方法制造剃须刀箔。形成面边缘，其中晶须孔的蚀刻轮廓与表面侧相交，并且形成切割刃，其中晶须孔的蚀刻轮廓与切割器侧相交。使用上述工艺使面边缘变圆，并且使用常规的耐蚀刻材料施加方法使切割刃锋利。

5. 发明授权

US07959113B2 Network cable bundling tool 有权
标题翻译：网络电缆捆绑工具
公开(公告)号：US07959113B2
公开(公告)日：2011-06-14
申请号：US12551032
申请日：2009-08-31
申请人： Michael J. Vermeer , Richard A. Marcus , Robert J. Krisel , David W. West
发明人： Michael J. Vermeer , Richard A. Marcus , Robert J. Krisel , David W. West
IPC分类号： F16L3/00
CPC分类号： H02G1/14
摘要： A network cable bundling tool is disclosed, comprising an inner fitting retained within an outer jacket assembly. The outer jacket assembly comprises a first outer jacket half coupled to a substantially identical second outer jacket half, securing the inner fitting therein. The outer jacket assembly comprises a cylindrical housing, an intake orifice defined within the intake housing, and a plurality of funneling projections coupled to the cylindrical housing wherein the plurality of funneling projections form an array assuming the general shape of a truncated faceted cone. In operation, network cable wires are inserted into the inner fitting, and the inner fitting is then secured within the outer jacket assembly. The network cable bundling tool is then displaced in the desired direction of combing, arranging the network cables into an organized and space-efficient shape.
摘要翻译：公开了一种网线捆绑工具，其包括保持在外护套组件内的内配件。外护套组件包括连接到基本相同的第二外护套半部的第一外护套，将内部配件固定在其中。外护套组件包括圆柱形壳体，限定在进气壳体内的进气孔，以及联接到圆柱形壳体的多个漏斗突起，其中多个漏斗突起形成假设呈截锥形锥体的总体形状的阵列。在操作中，将网络电缆线插入到内部配件中，然后将内部配件固定在外部套管组件内。网络电缆捆绑工具然后沿所需的梳理方向移动，将网络电缆布置成有组织且节省空间的形状。

6. 发明申请

US20110072623A1 Elastomeric Releasable Cable Tie 有权
标题翻译：弹性可释放电缆束带
公开(公告)号：US20110072623A1
公开(公告)日：2011-03-31
申请号：US12962330
申请日：2010-12-07
申请人： Michael J. Vermeer , Robert J. Krisel , David W. West
发明人： Michael J. Vermeer , Robert J. Krisel , David W. West
IPC分类号： B65D63/14
CPC分类号： B65D63/1072 , B65D2563/103 , B65D2563/107 , Y10T24/1498 , Y10T24/15 , Y10T24/153
摘要： The present invention is directed toward an elastomeric releasable cable tie having a head and a strap extending from the head. The head includes an end wall, an inner wall and sidewalls. The end wall, inner wall and sidewalls define a channel that extends from an entrance end to an exit end of the head. The head also includes a hingeless wedge extending from the end wall into the channel for engaging the strap.
摘要翻译：本发明涉及一种具有头部和从头部延伸的带的弹性体可释放的电缆扎带。头部包括端壁，内壁和侧壁。端壁，内壁和侧壁限定从头部的入口端到出口端延伸的通道。头部还包括从端壁延伸到用于接合带的通道的无铰链楔块。

7. 发明授权

US07722380B1 Plug retention device 有权
标题翻译：插头保持装置
公开(公告)号：US07722380B1
公开(公告)日：2010-05-25
申请号：US12412520
申请日：2009-03-27
申请人： David W. West , Thomas G. Stanford , Veselko J. Sladin
发明人： David W. West , Thomas G. Stanford , Veselko J. Sladin
IPC分类号： H01R13/62
CPC分类号： H01R13/6395
摘要： Certain embodiments of the present invention provide an apparatus for retaining a plug in an outlet. The apparatus includes a body and a pair of arms slidably connected to the body. The arms are secured to the outlet. The body slides along the arms in a first direction to retain the plug in the outlet.
摘要翻译：本发明的某些实施例提供一种用于将插头保持在出口中的装置。该装置包括主体和可滑动地连接到主体的一对臂。臂被固定到出口。主体沿着第一方向沿着臂滑动以将插头保持在插座中。

8. 发明授权

US5422313A Integrated circuit device and manufacturing method using photoresist lead covering 失效
标题翻译：集成电路器件及其制造方法
公开(公告)号：US5422313A
公开(公告)日：1995-06-06
申请号：US237576
申请日：1994-05-03
申请人： David W. West
发明人： David W. West
IPC分类号： H01L21/56 , H01L23/04 , H01L23/057 , H01L23/433 , H01L23/495 , H01L21/60
CPC分类号： H01L24/32 , H01L21/565 , H01L23/04 , H01L23/057 , H01L23/433 , H01L23/49513 , H01L23/49558 , H01L23/49579 , H01L23/49582 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L24/45 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , Y10T29/49121
摘要： A method of making an integrated circuit (IC) device comprises the steps of providing (300) at least one lead frame (10) comprising a plurality of leads (14), laminating (302) the lead frame (10) with a photoresist, exposing (304) a portion of the photoresist to impose a pattern on the photoresist (10), and developing (306) the photoresist on lead frame (10), such that the photoresist produces a pair of strips and forms non-electrically conductive bonds (30, 32) between leads (14). Further, an IC device comprises a plurality of leads (14) extending from a lead frame (10). The leads (14) comprise an inner lead portion (26), a middle lead portion (27) and an outer lead portion (28). A photoresist is overlaid onto the leads (14). The photoresist comprises an inner strip (30) disposed across the plurality of leads (14) between the inner lead portion (26) and the middle lead portion (27) and an outer strip (32 ) disposed across the plurality of leads (14) between the outer lead portion (28) and the middle lead portion (27). The photoresist inhibits cavity molding (42) plastic from seeping onto inner lead portion (26) or outer lead portion (28) and creates a non-electrically conductive bond between the leads (14).
摘要翻译：一种制造集成电路（IC）装置的方法包括以下步骤：提供（300）包括多个引线（14）的至少一个引线框架（10），用引线框层压（302）引线框架（10）曝光（304）光致抗蚀剂的一部分以在光致抗蚀剂（10）上施加图案，并且在引线框架（10）上显影（306）光致抗蚀剂，使得光致抗蚀剂产生一对条并形成非导电键（30,32）之间。此外，IC器件包括从引线框架（10）延伸的多个引线（14）。引线（14）包括内引线部分（26），中引线部分（27）和外引线部分（28）。将光致抗蚀剂覆盖在引线（14）上。光致抗蚀剂包括跨过内引线部分（26）和中引线部分（27）之间的多个引线（14）设置的内条（30）和横跨多个引线（14）设置的外条（32）在外引线部分（28）和中引线部分（27）之间。光致抗蚀剂抑制空腔模塑（42）塑料渗透到内引线部分（26）或外引线部分（28）上，并在引线（14）之间产生非导电结合。

9. 发明申请

US20090293236A1 Hook and Loop Tie with a Non-Slip Area 失效
标题翻译：钩环与非滑动区域
公开(公告)号：US20090293236A1
公开(公告)日：2009-12-03
申请号：US12470921
申请日：2009-05-22
申请人： Jack E. Caveney , David W. West
发明人： Jack E. Caveney , David W. West
IPC分类号： B65D63/14 , B23P11/00
CPC分类号： A44B18/008 , B65D63/1018 , B65D2313/02 , Y10T24/14 , Y10T24/2733 , Y10T29/49826
摘要： Certain embodiments of the present invention provide a hook and loop tie for securing a bundle of cables. The hook and loop tie comprises a loop component, a hook component, and a non-slip component. The loop component has a first end, a second end opposite the first end, and a plurality of loop fastening elements. The hook component is affixed to the loop component, extends from the first end of the loop component toward the second end of the loop component, and has a plurality of hook fastening elements. The non-slip component is affixed to the loop component, extends from the second end of the loop component toward the first end of the loop component, and overlaps at least a portion of the hook component.
摘要翻译：本发明的某些实施例提供了一种用于固定一束电缆的钩环系统。钩和环带包括环部件，钩部件和防滑部件。环部件具有第一端，与第一端相对的第二端和多个环紧固元件。钩部件固定到环部件上，从环部件的第一端朝向环部件的第二端延伸，并且具有多个钩紧固元件。防滑部件固定到环部件上，从环部件的第二端朝向环部件的第一端延伸，并且与挂钩部件的至少一部分重叠。

10. 发明申请

US20090126165A1 Microhook Fastener Apparatus 失效
标题翻译：微型紧固件装置
公开(公告)号：US20090126165A1
公开(公告)日：2009-05-21
申请号：US12262376
申请日：2008-10-31
申请人： David W. West
发明人： David W. West
IPC分类号： A44B18/00
CPC分类号： A44B18/0065 , A44B18/0046 , A44B18/0084 , Y10T24/2767 , Y10T24/2775 , Y10T24/2792
摘要： A microhook and loop fastening and detaching assembly comprising a web including a plurality of malleable loops formed integral with one surface of the web, and a plurality of hooks attached to another surface of the web, wherein the loops are adapted to removably engage the hooks. The hooks are equidistantly-arrayed in a plurality of linear rows on the hook side of the web in a staggered manner across the width of the web, such that each hook in a given row is located between two hooks of an adjacent row. The centerline distance between hooks in adjacent rows in the machine direction of the web is greater than the equidistant centerline dimension between adjacent hooks in the same cross-web row. Each hook includes a pedestal attached to the hook side of the web, and a head portion forming part of the pedestal. The head portion extends in a radial direction beyond the radial extent of the pedestal, and the head portion comprises a flat horizontal underside, or a slightly canted underside extending from a radiused connection between the head portion and the pedestal to a rim of the head portion.
摘要翻译：一种微钩和紧固和分离组件，其包括一个腹板，该腹板包括与所述腹板的一个表面一体形成的多个可延展的环，以及连接到所述腹板的另一个表面的多个钩，其中所述环适于可拆卸地接合所述钩。这些钩子以纤维网的宽度方向以交错的方式等距地排列成多个线形排，这样一来，给定行中的每个钩位于相邻行的两个钩之间。在相邻行的钩之间的中心线距离在幅材的机器方向上大于相同交叉排中相邻钩之间的等距中心线尺寸。每个钩包括附接到幅材的钩侧的基座和形成基座的一部分的头部。头部沿径向方向延伸超过基座的径向范围，并且头部包括平坦的水平下侧或从头部和基座之间的圆弧形连接延伸到头部的边缘的稍微倾斜的下侧。

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