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1. 发明授权

US07258574B2 Snap-fit electromagnetic shield 有权
标题翻译：卡扣电磁屏蔽
公开(公告)号：US07258574B2
公开(公告)日：2007-08-21
申请号：US10955046
申请日：2004-09-30
申请人： Dennis R. Barringer , Shawn Canfield , David C. Linnell , Robert L. Nicoletti , Harold M. Toffler
发明人： Dennis R. Barringer , Shawn Canfield , David C. Linnell , Robert L. Nicoletti , Harold M. Toffler
IPC分类号： H01R13/648
CPC分类号： H05K9/0058 , H01R13/6584 , H01R13/745 , Y10S439/939
摘要： A snap-fit shield is provided which fits securely within a frame opening, and which shields and grounds the opening while eliminating a need for a complementary connector portion. The shield has an insulative inner housing having a first base wall and a first pair of side walls and end walls extending therefrom defining a first cavity. The shield includes a conductive shell having a second base wall and a second pair of side walls and end walls extending therefrom defining a second cavity. The second pair of side walls and end walls have at least one outward bias positioned thereon. The shield also has an insulative outer housing having a third base wall and a third pair of side walls and end walls extending therefrom defining a third cavity. The outer housing is configured to snap-fit within an opening in a frame so as to shield circuitry internal thereto. The third cavity of the outer housing is configured to receive at least a portion of the conductive shield therein, while the second cavity of the conductive shield is configured to receive the inner housing therein.
摘要翻译：提供了一种卡扣式护罩，其牢固地配合在框架开口内，并且在不需要互补的连接器部分的情况下屏蔽和接合开口。屏蔽件具有绝缘内壳体，该绝缘内壳体具有第一底壁和从其限定第一腔的第一对侧壁和端壁。屏蔽包括具有第二底壁和第二对侧壁的导电外壳和从其延伸的端壁限定第二腔。第二对侧壁和端壁具有定位在其上的至少一个向外偏压。屏蔽还具有绝缘外壳，其具有第三底壁和第三对侧壁以及从其限定第三空腔的端壁。外壳被构造成卡扣配合在框架中的开口内，以便屏蔽内部的电路。外壳体的第三腔被配置为在其中容纳至少一部分导电屏蔽件，而导电屏蔽件的第二腔体构造成在其中容纳内壳体。

2. 发明授权

US07357675B2 Universal EMC gasket 失效
标题翻译：通用EMC垫片
公开(公告)号：US07357675B2
公开(公告)日：2008-04-15
申请号：US11463044
申请日：2006-08-08
申请人： Dennis R. Barringer , David C. Linnell , Andrew Rybak , Harold M. Toffler
发明人： Dennis R. Barringer , David C. Linnell , Andrew Rybak , Harold M. Toffler
IPC分类号： H01R13/648
CPC分类号： H01R13/6584 , H01R12/727 , Y10S439/939
摘要： An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.
摘要翻译：电磁垫圈包括导电壳体，导电壳体具有一对侧壁和从其延伸的端壁限定至少一个开口。一对侧壁和端壁具有至少一个向外偏压和至少一个位于其上的向内偏压，用于每个开口。外部偏置被配置为电连接到电气外壳的内部尾座。所述至少一个开口构造成在其中接收相应模块的连接器端口壳体。所述至少一个向内偏置将连接器端口壳体电连接到电气外壳的内部尾座。每个模块是电气模块或光学模块，并且所述至少一个向内偏置和向外偏压为相对于X，Y和Z中的至少一个具有可变尺寸的多个模块的多个连接器端口壳体提供EMC密封连接器端口外壳的轴线。

3. 发明申请

US20080038959A1 UNIVERSAL EMC GASKET 失效
标题翻译：通用EMC垫片
公开(公告)号：US20080038959A1
公开(公告)日：2008-02-14
申请号：US11463044
申请日：2006-08-08
申请人： Dennis R. Barringer , David C. Linnell , Andrew Rybak , Harold M. Toffler
发明人： Dennis R. Barringer , David C. Linnell , Andrew Rybak , Harold M. Toffler
IPC分类号： H01R13/648
CPC分类号： H01R13/6584 , H01R12/727 , Y10S439/939
摘要： An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.
摘要翻译：电磁垫圈包括导电壳体，导电壳体具有一对侧壁和从其延伸的端壁限定至少一个开口。一对侧壁和端壁具有至少一个向外偏压和至少一个位于其上的向内偏压，用于每个开口。外部偏置被配置为电连接到电气外壳的内部尾座。所述至少一个开口构造成在其中接收相应模块的连接器端口壳体。所述至少一个向内偏置将连接器端口壳体电连接到电气外壳的内部尾座。每个模块是电气模块或光学模块，并且所述至少一个向内偏置和向外偏压为相对于X，Y和Z中的至少一个具有可变尺寸的多个模块的多个连接器端口壳体提供EMC密封连接器端口外壳的轴线。

4. 发明授权

US07473139B2 Universal EMC gasket 失效
标题翻译：通用EMC垫片
公开(公告)号：US07473139B2
公开(公告)日：2009-01-06
申请号：US11939742
申请日：2007-11-14
申请人： Dennis R. Barringer , David C. Linnell , Andrew Rybak , Harold M. Toffler
发明人： Dennis R. Barringer , David C. Linnell , Andrew Rybak , Harold M. Toffler
IPC分类号： H01R13/648
CPC分类号： H01R13/6584 , H01R12/727 , Y10S439/939
摘要： An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.
摘要翻译：电磁垫圈包括导电壳体，导电壳体具有一对侧壁和从其延伸的端壁限定至少一个开口。一对侧壁和端壁具有至少一个向外偏压和至少一个位于其上的向内偏压，用于每个开口。外部偏置被配置为电连接到电气外壳的内部尾座。所述至少一个开口构造成在其中接收相应模块的连接器端口壳体。所述至少一个向内偏置将连接器端口壳体电连接到电气外壳的内部尾座。每个模块是电气模块或光学模块，并且所述至少一个向内偏置和向外偏压为相对于X，Y和Z中的至少一个具有可变尺寸的多个模块的多个连接器端口壳体提供EMC密封连接器端口外壳的轴线。

5. 发明授权

US5391036A Magnetic transfer device 失效
标题翻译：磁转移装置
公开(公告)号：US5391036A
公开(公告)日：1995-02-21
申请号：US31520
申请日：1993-03-15
申请人： Tibor L. Bauer , William A. Cavaliere , David K. Green , John P. Karidis , David C. Linnell
发明人： Tibor L. Bauer , William A. Cavaliere , David K. Green , John P. Karidis , David C. Linnell
IPC分类号： B65G47/90 , B28D5/00 , H01L21/677 , H01L21/687 , H05K13/02 , B25J15/06
CPC分类号： B28D5/0082 , H01L21/68707
摘要： A transfer device especially suitable for transferring a minute electronic component part from a first location and position to a second location and position, the component part having critical facet sides of high integrity and at least one non-critical side, is disclosed. The transfer device comprises a non-destructive engaging means, a control means, and a decoupling means, whereby the integrity of the essential facet sides of the component part is maintained.
摘要翻译：公开了一种特别适用于将微小电子部件从第一位置和位置传送到第二位置和位置的传送装置，所述部件具有高完整性和至少一个非关键侧的关键面侧。传送装置包括非破坏性接合装置，控制装置和解耦装置，从而保持部件的主要侧面的完整性。

6. 发明授权

US5366156A Nozzle apparatus for producing aerosol 失效
标题翻译：用于生产气溶胶的喷嘴装置
公开(公告)号：US5366156A
公开(公告)日：1994-11-22
申请号：US76053
申请日：1993-06-14
申请人： Tibor L. Bauer , William A. Cavaliere , David C. Linnell , Jin J. Wu
发明人： Tibor L. Bauer , William A. Cavaliere , David C. Linnell , Jin J. Wu
IPC分类号： B05B9/04 , B05B9/00 , B08B5/02 , B08B7/00 , B24C1/00 , B24C5/04 , H01L21/304 , B05B1/26 , F17C7/02
CPC分类号： B24C5/04 , B08B7/0092 , B24C1/003 , Y10S134/902
摘要： A nozzle apparatus for producing aerosol from a substance includes a delivery line having an inlet for receiving the substance at a first pressure. A nozzle is connected to the delivery line for receiving the substance from the delivery line. The nozzle has at least one exit opening which allows passing of the substance therethrough for expanding the substance from the first pressure to a second pressure which is lower than the first pressure for solidifying the substance and producing aerosol. Condensation preventing means is provided for preventing condensation from forming on the delivery line and/or on the nozzle.
摘要翻译：用于从物质生产气溶胶的喷嘴装置包括具有用于在第一压力下接收物质的入口的输送管线。喷嘴连接到输送管线，用于从输送管线接收物质。喷嘴具有至少一个出口，其允许物质通过其中以将物质从第一压力扩展到低于用于固化物质并产生气溶胶的第一压力的第二压力。提供防冷凝装置，用于防止在输送管线和/或喷嘴上形成冷凝。

7. 发明授权

US5964396A Enhanced ceramic ball grid array using in-situ solder stretch with clip 失效
标题翻译：增强型陶瓷球栅阵列使用原位焊料拉伸夹
公开(公告)号：US5964396A
公开(公告)日：1999-10-12
申请号：US909801
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： H01L23/12 , B23K3/06 , H01L21/60 , H05K3/34 , B23K31/02 , B23K37/04
CPC分类号： B23K3/0638 , H05K3/3436 , B23K2201/36 , H01L2924/00013 , H01L2924/0002 , H05K2203/0195 , H05K2203/0465 , H05K2203/306 , Y02P70/613
摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.
摘要翻译：提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

8. 发明授权

US06719188B2 Rework methods for lead BGA/CGA 有权
标题翻译：铅BGA / CGA的返工方法
公开(公告)号：US06719188B2
公开(公告)日：2004-04-13
申请号：US09912192
申请日：2001-07-24
申请人： Mukta G. Farooq , Raymond A. Jackson , David C. Linnell
发明人： Mukta G. Farooq , Raymond A. Jackson , David C. Linnell
IPC分类号： B23K1018
CPC分类号： B23K1/018 , B23K2101/40 , H01L24/98 , Y10T29/49815 , Y10T29/53274 , Y10T29/53283
摘要： A method and apparatus are provided for reworking electronic component assemblies where the components are joined by solder interconnections. A cutting device employing a heated wire, blade or other cutting element is forced against and through the solder interconnections to sever the interconnections. A preferred cutting device employs moving the cutting element transverse to the solder interconnections to also provide a sawing action to the solder interconnections. Another cutting device employs a water jet to provide a high pressure stream of water that cuts and severs the solder interconnections.
摘要翻译：提供了一种方法和装置，用于重新加工电子部件组件，其中部件通过焊料互连连接。使用加热的线，刀片或其他切割元件的切割装置被迫抵抗并穿过焊料互连以切断互连。优选的切割装置采用将切割元件横向于焊接互连件移动以向焊接互连提供锯切动作。另一切割装置采用水射流来提供高压水流，其切割和切断焊料互连。

9. 发明授权

US5553766A In-situ device removal for multi-chip modules 失效
标题翻译：多芯片模块的原位设备拆除
公开(公告)号：US5553766A
公开(公告)日：1996-09-10
申请号：US342563
申请日：1994-11-21
申请人： Raymond A. Jackson , Kathleen A. Lidestri , David C. Linnell , Raj N. Master
发明人： Raymond A. Jackson , Kathleen A. Lidestri , David C. Linnell , Raj N. Master
IPC分类号： B23K1/018 , H05K13/04 , H05K3/34 , B23K3/00
CPC分类号： H05K13/0486 , B23K1/018 , B23K2201/40
摘要： Deformation of a lifting ring of bimetallic structure or memory metal is matched to a solder softening or melting temperature to apply forces to lift a chip from a supporting structure, such as a substrate or multi-chip module, only when the solder connections between the chip and the supporting structure are softened or melted. The temperature of the chip, module and solder connections there between is achieved in a commercially available box oven or belt furnace or the like and results in much reduced internal chip temperatures and thermal gradients within the chip as compared to known hot chip removal processes. Tensile and/or shear forces at solder connections and chip and substrate contacts are much reduced in comparison with known cold chip removal processes. Accordingly, the process is repeatable at will without significant damage to or alteration of electrical characteristics of the chip or substrate.
摘要翻译：双金属结构或记忆金属的提升环的变形与焊料软化或熔化温度匹配，以施加力以从支撑结构（例如基板或多芯片模块）提升芯片，只有当芯片之间的焊料连接支撑结构软化或熔化。与市售的盒式炉或带式炉等相比，芯片，模块和焊料连接的温度是可以实现的，并且与已知的热切屑去除工艺相比，在芯片内的内部芯片温度和热梯度大大降低。与已知的冷芯片去除工艺相比，焊料连接和芯片和基板触点处的拉伸和/或剪切力大大降低。因此，该过程可以随意重复，而不会显着损坏或改变芯片或衬底的电特性。

10. 发明授权

US5400603A Heat exchanger 失效
标题翻译：热交换器
公开(公告)号：US5400603A
公开(公告)日：1995-03-28
申请号：US076051
申请日：1993-06-14
申请人： Tibor L. Bauer , William A. Cavaliere , Charles R. Dart, II , Timothy H. Freebern , David C. Linnell , James M. Miller , Jin J. Wu
发明人： Tibor L. Bauer , William A. Cavaliere , Charles R. Dart, II , Timothy H. Freebern , David C. Linnell , James M. Miller , Jin J. Wu
IPC分类号： B05C11/10 , B08B7/00 , B08B7/02 , F25B9/00 , F25J1/00 , F28D1/06 , F28D20/00 , H01L21/304 , F25B19/00
CPC分类号： F25J1/0276 , B08B7/0092 , B08B7/02 , F28D1/06 , F28D20/0056 , F25J2290/42 , F28D2021/0033 , Y02E60/142
摘要： A heat exchanger includes a housing, a reservoir comprising a solid material mounted within the housing, temperature control means for controlling the temperature of the reservoir, and energy exchange means for allowing thermal contact between the reservoir and a substance for effectuating transfer of energy from the reservoir to the substance for regulating the temperature of the substance.
摘要翻译：热交换器包括壳体，包括安装在壳体内的固体材料的储存器，用于控制储存器温度的温度控制装置和用于允许储存器和物质之间的热接触的能量交换装置，用于实现来自储存物质用于调节物质的温度。

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