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1. 发明授权

US08246846B1 Method for fabricating integrated MEMS switches and filters 有权
标题翻译：集成MEMS开关和滤波器的制造方法
公开(公告)号：US08246846B1
公开(公告)日：2012-08-21
申请号：US12889687
申请日：2010-09-24
申请人： David T. Chang , Tsung-Yuan Hsu
发明人： David T. Chang , Tsung-Yuan Hsu
IPC分类号： C23F3/00
CPC分类号： H03H9/462 , H01H59/0009 , H03H9/465 , H03H2009/241
摘要： A method for fabricating integrated MEMS switches and filters includes forming cavities in a silicon substrate, metalizing a first pattern on a quartz substrate to form first switch and filter elements, bonding the quartz substrate to the silicon substrate so that the first switch and filter elements are located within one of the cavities, thinning the quartz substrate, forming conductive vias in the quartz substrate, metalizing a second pattern on a second surface of the quartz substrate to form second switch and filter elements, etching the quartz substrate to separate MEMS switches from filters, forming protrusions on a host substrate, metalizing a third metal pattern on the host substrate to form metal anchors and third switch elements, compression bonding the metal anchors on the host substrate to second switch and filter elements, forming signal lines to integrate the MEMS switches and filters and removing the silicon substrate.
摘要翻译：一种用于制造集成的MEMS开关和滤波器的方法包括在硅衬底中形成空腔，将石英衬底上的第一图案金属化以形成第一开关和滤波器元件，将石英衬底接合到硅衬底，使得第一开关和滤波器元件位于一个空腔内，使石英衬底变薄，在石英衬底中形成导电通孔，在石英衬底的第二表面上金属化第二图案以形成第二开关和滤光元件，蚀刻石英衬底以将MEMS开关与过滤器分离在主机基板上形成突起，在主机基板上形成金属化第三金属图案以形成金属锚和第三开关元件，将主机基板上的金属锚固件压接到第二开关和滤波元件，形成信号线以集成MEMS开关并过滤并去除硅衬底。

2. 发明授权

US07253709B1 RF MEMS switch with spring-loaded latching mechanism 有权
标题翻译： RF MEMS开关带有弹簧锁定机构
公开(公告)号：US07253709B1
公开(公告)日：2007-08-07
申请号：US10961732
申请日：2004-10-07
申请人： David T. Chang , James H. Schaffner , Tsung-Yuan Hsu , Adele E. Schmitz
发明人： David T. Chang , James H. Schaffner , Tsung-Yuan Hsu , Adele E. Schmitz
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01H2001/0068 , Y10T29/49105 , Y10T29/49117 , Y10T29/49155 , Y10T29/49204
摘要： Apparatus for a micro-electro-mechanical switch that provides for latching switching action. The switch has a cantilever arm disposed on a substrate that can be moved in orthogonal directions for latching and unlatching. To latch the switch, the cantilever arm is moved back by a comb-drive actuator and then pulled down by electrodes disposed on the substrate and the cantilever arm. The comb-drive actuator switch is then released and the cantilever arm moves forward to be captured by a dove-tail structure on the substrate. When the voltage to the electrodes on the substrate and the cantilever arm is removed, the cantilever arm is held in place by the dove-tail structure. The switch is unlatched by actuating the comb-drive actuator to move the cantilever arm away from the dove-tail structure. The cantilever arm will then pop up once it is released from the dove-tail structure.
摘要翻译：用于微电机械开关的装置，其提供闭锁开关动作。开关具有设置在基板上的悬臂，该悬臂可以沿正交方向移动以锁定和解锁。为了锁定开关，悬臂由梳驱动致动器向后移动，然后由设置在基板和悬臂上的电极拉下。然后梳梳驱动致动器开关被释放，并且悬臂臂向前移动以通过基板上的鸽尾结构捕获。当去除基板和悬臂上的电极的电压时，悬臂通过尾尾结构保持在适当位置。通过启动梳齿驱动执行机构将悬臂移动离开鸽尾结构，开关被解锁。一旦从鸽尾结构中释放出来，悬臂就会弹出。

3. 发明授权

US08485417B1 Planar RF electromechanical switch 有权
标题翻译：平面RF机电开关
公开(公告)号：US08485417B1
公开(公告)日：2013-07-16
申请号：US13470082
申请日：2012-05-11
申请人： David T. Chang , Tsung-Yuan Hsu
发明人： David T. Chang , Tsung-Yuan Hsu
IPC分类号： B23K31/00 , B23K31/02
CPC分类号： H01H55/00
摘要： A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the bond pad, a first actuation electrode on the base substrate, and a second actuation electrode on the cantilever arm connected to the bond pad by way of the conductive via, positioned such that an actuation voltage applied between the first actuation electrode and the second actuation electrode will deform the cantilever arm, wherein the first actuation electrode is facing a side of the cantilever arm opposite the second actuation electrode.
摘要翻译：提供一种微加工开关，包括基底基板，基底基板上的接合焊盘，连接到接合焊盘的悬臂，悬臂臂具有来自接合焊盘的导电通孔，基底基板上的第一致动电极和悬臂上的第二致动电极通过导电通孔连接到接合焊盘，定位成使得施加在第一致动电极和第二致动电极之间的致动电压将使悬臂变形，其中第一致动电极面向悬臂的一侧与第二致动电极相对。

4. 发明授权

US07830227B1 Device having integrated MEMS switches and filters 有权
标题翻译：集成了MEMS开关和滤波器的器件
公开(公告)号：US07830227B1
公开(公告)日：2010-11-09
申请号：US12233232
申请日：2008-09-18
申请人： David T. Chang , Tsung-Yuan Hsu
发明人： David T. Chang , Tsung-Yuan Hsu
IPC分类号： H03H9/54 , H03H9/70 , H01P1/10
CPC分类号： H03H9/462 , H01H59/0009 , H03H9/465 , H03H2009/241
摘要： A method for fabricating integrated MEMS switches and filters includes forming cavities in a silicon substrate, metalizing a first pattern on a quartz substrate to form first switch and filter elements, bonding the quartz substrate to the silicon substrate so that the first switch and filter elements are located within one of the cavities, thinning the quartz substrate, forming conductive vias in the quartz substrate, metalizing a second pattern on a second surface of the quartz substrate to form second switch and filter elements, etching the quartz substrate to separate MEMS switches from filters, forming protrusions on a host substrate, metalizing a third metal pattern on the host substrate to form metal anchors and third switch elements, compression bonding the metal anchors on the host substrate to second switch and filter elements, forming signal lines to integrate the MEMS switches and filters and removing the silicon substrate.
摘要翻译：一种用于制造集成的MEMS开关和滤波器的方法包括在硅衬底中形成空腔，将石英衬底上的第一图案金属化以形成第一开关和滤波器元件，将石英衬底接合到硅衬底，使得第一开关和滤波器元件位于一个空腔内，使石英衬底变薄，在石英衬底中形成导电通孔，在石英衬底的第二表面上金属化第二图案以形成第二开关和滤光元件，蚀刻石英衬底以将MEMS开关与过滤器分离在主机基板上形成突起，在主机基板上形成金属化第三金属图案以形成金属锚和第三开关元件，将主机基板上的金属锚固件压接到第二开关和滤波元件，形成信号线以集成MEMS开关并过滤并去除硅衬底。

5. 发明授权

US07653985B1 Method of fabricating an RF MEMS switch with spring-loaded latching mechanism 有权
标题翻译：制造具有弹簧加载闭锁机构的RF MEMS开关的方法
公开(公告)号：US07653985B1
公开(公告)日：2010-02-02
申请号：US11823443
申请日：2007-06-27
申请人： David T. Chang , James H. Schaffner , Tsung-Yuan Hsu , Adele E. Schmitz
发明人： David T. Chang , James H. Schaffner , Tsung-Yuan Hsu , Adele E. Schmitz
IPC分类号： H01H11/00 , H01H65/00
CPC分类号： H01H59/0009 , H01H2001/0068 , Y10T29/49105 , Y10T29/49117 , Y10T29/49155 , Y10T29/49204
摘要： Disclosed are methods for fabricating a micro-electro-mechanical switch. The switch has a cantilever arm disposed on a substrate that can be moved in orthogonal directions for latching and unlatching. For latching, the cantilever arm is moved back by a comb-drive actuator and then pulled down by electrodes disposed on the substrate and the cantilever arm. The comb-drive actuator switch is then released and the cantilever arm moves forward to be captured by a dove-tail structure on the substrate. When the voltage is removed, the cantilever arm is held in place by the dove-tail structure. The switch is unlatched by actuating the comb-drive actuator to move the cantilever arm away from the dove-tail structure. The cantilever arm will then pop up once it is released from the dove-tail structure.
摘要翻译：公开了用于制造微机电开关的方法。开关具有设置在基板上的悬臂，该悬臂可以沿正交方向移动以锁定和解锁。为了锁定，悬臂由梳驱动致动器向后移动，然后由设置在基板和悬臂上的电极拉下。然后梳梳驱动致动器开关被释放，并且悬臂臂向前移动以通过基板上的鸽尾结构捕获。当电压被去除时，悬臂由鸠尾结构保持在适当位置。通过启动梳齿驱动执行机构将悬臂移动离开鸽尾结构，开关被解锁。一旦从鸽尾结构中释放出来，悬臂就会弹出。

6. 发明授权

US08912711B1 Thermal stress resistant resonator, and a method for fabricating same 有权
标题翻译：耐热应力谐振器及其制造方法
公开(公告)号：US08912711B1
公开(公告)日：2014-12-16
申请号：US12820761
申请日：2010-06-22
申请人： David T. Chang , Tsung-Yuan Hsu
发明人： David T. Chang , Tsung-Yuan Hsu
IPC分类号： H01L41/053 , H03H9/02
CPC分类号： H03H9/02102 , H01P1/127 , H01P7/082 , H03H9/02377 , H03H9/19
摘要： In an embodiment, a thermal stress resistant resonator is disclosed. The thermal stress resistant resonator may include or comprise a piezoelectric member having one or more non-linear piezoelectric support members extending there from.
摘要翻译：在一个实施例中，公开了一种耐热应力谐振器。耐热应力谐振器可以包括或包括具有从其延伸的一个或多个非线性压电支撑构件的压电构件。

7. 发明授权

US08242865B1 Planar RF electromechanical switch 有权
标题翻译：平面RF机电开关
公开(公告)号：US08242865B1
公开(公告)日：2012-08-14
申请号：US12352914
申请日：2009-01-13
申请人： David T. Chang , Tsung-Yuan Hsu
发明人： David T. Chang , Tsung-Yuan Hsu
IPC分类号： H01H51/22
CPC分类号： H01H55/00
摘要： A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the bond pad, a first actuation electrode on the base substrate, and a second actuation electrode on the cantilever arm connected to the bond pad by way of the conductive via, positioned such that an actuation voltage applied between the first actuation electrode and the second actuation electrode will deform the cantilever arm, wherein the first actuation electrode is facing a side of the cantilever arm opposite the second actuation electrode.
摘要翻译：提供一种微加工开关，包括基底基板，基底基板上的接合焊盘，连接到接合焊盘的悬臂，悬臂臂具有来自接合焊盘的导电通孔，基底基板上的第一致动电极和悬臂上的第二致动电极通过导电通孔连接到接合焊盘，定位成使得施加在第一致动电极和第二致动电极之间的致动电压将使悬臂变形，其中第一致动电极面向悬臂的一侧与第二致动电极相对。

8. 发明授权

US08769802B1 Method of fabrication an ultra-thin quartz resonator 有权
标题翻译：制造超薄石英谐振器的方法
公开(公告)号：US08769802B1
公开(公告)日：2014-07-08
申请号：US12831028
申请日：2010-07-06
申请人： David T. Chang , Randall L. Kubena , Pamela R. Patterson
发明人： David T. Chang , Randall L. Kubena , Pamela R. Patterson
IPC分类号： H04R31/00
CPC分类号： H03H9/172 , H03H3/04
摘要： A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.
摘要翻译：在本申请中提出了一种用于制造谐振器的方法。该方法包括提供处理衬底，提供主体衬底，提供包括与第二表面相对的第一表面的石英衬底，将中介层膜施加到石英衬底的第一表面，将石英衬底接合到处理衬底，其中插入膜设置在石英基板和手柄基板之间，使石英基板的第二表面变薄，去除一部分键合的石英基板以暴露中间层膜的一部分，将石英基板接合到主基板，并且移除手柄基板和内插膜，从而释放石英基板。

9. 发明授权

US08766745B1 Quartz-based disk resonator gyro with ultra-thin conductive outer electrodes and method of making same 有权
标题翻译：具有超薄导电外电极的基于石英的盘式谐振器陀螺仪及其制造方法
公开(公告)号：US08766745B1
公开(公告)日：2014-07-01
申请号：US12488784
申请日：2009-06-22
申请人： Randall L. Kubena , David T. Chang , Robert L. Larson
发明人： Randall L. Kubena , David T. Chang , Robert L. Larson
IPC分类号： H03H9/02 , G01C19/00 , H03H9/24
CPC分类号： G01P1/00 , G01C19/5684 , H03H3/0072 , H03H9/02244 , H03H9/0552 , H03H9/1057 , H03H9/2436 , H03H2009/02283 , H03H2009/02496
摘要： A disk resonator gyroscope includes a quartz base, a quartz resonator disk having a central pillar connected to the base, the quartz resonator disk having a surface facing the base and having plurality of circumferential slots in the surface of the quartz resonator disk around the central pillar, and an electrode comprised of quartz and connected to the base outside of an outer edge of the resonator disk.
摘要翻译：盘式谐振器陀螺仪包括石英基座，具有连接到基座的中心柱的石英谐振器盘，石英谐振器盘具有面向基座的表面，并且在石英谐振器盘周围的中心支柱的表面中具有多个周向槽以及由石英组成并且连接到谐振器盘的外边缘外部的基座的电极。

10. 发明授权

US08765615B1 Quartz-based MEMS resonators and methods of fabricating same 有权
标题翻译：基于石英的MEMS谐振器及其制造方法
公开(公告)号：US08765615B1
公开(公告)日：2014-07-01
申请号：US12816292
申请日：2010-06-15
申请人： David T. Chang , Frederic P. Stratton , Hung Nguyen , Randall L. Kubena
发明人： David T. Chang , Frederic P. Stratton , Hung Nguyen , Randall L. Kubena
IPC分类号： H01L21/302 , H01L21/311 , H01L21/3105
CPC分类号： H01L21/31111 , B81B2201/0271 , B81C1/00238 , B81C2201/0194 , B81C2203/036 , B81C2203/038 , H01L21/31056 , H03H3/0072 , H03H2009/02291
摘要： A quart resonator for use in lower frequency applications (typically lower than the higher end of the UHF spectrum) where relatively thick quartz members, having a thickness greater than ten microns, are called for. A method for fabricating same resonator includes providing a first quart substrate; thinning the first quartz substrate to a desired thickness; forming a metallic etch stop on a portion of a first major surface of the first quartz substrate; adhesively attaching the first major surface of the first quartz substrate with the metallic etch stop formed thereon to a second quartz substrate using a temporary adhesive; etching a via though the first quartz substrate to the etch stop; forming a metal electrode on a second major surface of the first quartz substrate, the metal electrode penetrating the via in the first quartz substrate to make ohmic contact with the metallic etch stop; bonding the metal electrode formed on the second major surface of the first quartz substrate to a pad formed on a substrate bearing oscillator drive circuitry to form a bond there between; and dissolving the temporary adhesive to thereby release the second quartz substrate from the substrate bearing oscillator drive circuitry and a portion of the first quartz substrate bonded thereto via the bond formed between the metal electrode formed on the second major surface of the first quartz substrate to and the pad formed on the substrate bearing oscillator drive circuitry.
摘要翻译：用于低频应用（通常低于UHF频谱的较高端）的夸特谐振器，其中厚度大于10微米的相对较厚的石英构件被要求。一种制造相同谐振器的方法包括提供第一夸脱基片; 将第一石英基板变薄至所需厚度; 在所述第一石英衬底的第一主表面的一部分上形成金属蚀刻停止件; 使用临时粘合剂将第一石英基板的第一主表面与其上形成的金属蚀刻停止粘合到第二石英基板上; 将通过第一石英衬底的通孔蚀刻到蚀刻停止部; 在所述第一石英衬底的第二主表面上形成金属电极，所述金属电极穿过所述第一石英衬底中的通孔以与所述金属蚀刻停止件欧姆接触; 将形成在第一石英衬底的第二主表面上的金属电极接合到形成在承载振荡器驱动电路的衬底上的焊盘，以在其之间形成结合; 并且将临时粘合剂溶解，从而从基板轴承振荡器驱动电路和第一石英基板的一部分经由形成在第一石英基板的第二主表面上的金属电极之间的键与第一石英基板接合的部分而释放第二石英基板衬垫形成在承载振荡器驱动电路的衬底上。

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