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    • 1. 发明授权
    • Method and apparatus for use of porous implants
    • 使用多孔植入物的方法和装置
    • US08197550B2
    • 2012-06-12
    • US12559230
    • 2009-09-14
    • David R. BrownJason D. MeridewRobert M. RonkTroy W. Hershberger
    • David R. BrownJason D. MeridewRobert M. RonkTroy W. Hershberger
    • A61F2/32
    • A61F2/34A61F2/4609A61F2002/30535A61F2250/0058
    • An orthopedic prosthesis for implantation into a bone of a patient includes a porous metal shell adapted to be affixed within the bone. The porous metal shell includes an outer surface adapted to receive bone ingrowth and an inner surface adapted to engage a liner. The porous metal shell is porous from the outer surface to the inner surface. A non-porous member may be affixed to the porous metal shell. The non-porous member may include a piercing member extending from the outer surface, the piercing member adapted to penetrate the bone in an implanted position. The non-porous member may include spikes or fins. In one example, the piercing member may define a reduced material cross section at an interface with the outer surface of the porous metal shell. The piercing member may be adapted to be broken at the reduced material cross section and removed from the porous metal shell.
    • 用于植入患者骨骼的矫形假体包括适于固定在骨中的多孔金属壳。 多孔金属壳包括适于接收骨向内生长的外表面和适于接合衬垫的内表面。 多孔金属壳从外表面到内表面是多孔的。 无孔构件可以固定到多孔金属壳上。 无孔构件可以包括从外表面延伸的刺穿构件,刺穿构件适于在植入位置穿透骨骼。 无孔构件可以包括尖钉或翅片。 在一个示例中,刺穿构件可以在与多孔金属壳的外表面的界面处限定减小的材料横截面。 刺穿构件可以适于在减小的材料横截面处断裂并从多孔金属壳体移除。
    • 2. 发明申请
    • METHOD AND APPARATUS FOR USE OF POROUS IMPLANTS
    • 使用多孔植入物的方法和装置
    • US20100004754A1
    • 2010-01-07
    • US12559230
    • 2009-09-14
    • David R. BrownJason D. MeridewRobert M. RonkTroy W. Hershberger
    • David R. BrownJason D. MeridewRobert M. RonkTroy W. Hershberger
    • A61F2/32
    • A61F2/34A61F2/4609A61F2002/30535A61F2250/0058
    • An orthopedic prosthesis for implantation into a bone of a patient includes a porous metal shell adapted to be affixed within the bone. The porous metal shell includes an outer surface adapted to receive bone ingrowth and an inner surface adapted to engage a liner. The porous metal shell is porous from the outer surface to the inner surface. A non-porous member may be affixed to the porous metal shell. The non-porous member may include a piercing member extending from the outer surface, the piercing member adapted to penetrate the bone in an implanted position. The non-porous member may include spikes or fins. In one example, the piercing member may define a reduced material cross section at an interface with the outer surface of the porous metal shell. The piercing member may be adapted to be broken at the reduced material cross section and removed from the porous metal shell.
    • 用于植入患者骨骼的矫形假体包括适于固定在骨中的多孔金属壳。 多孔金属壳包括适于接收骨向内生长的外表面和适于接合衬垫的内表面。 多孔金属壳从外表面到内表面是多孔的。 无孔构件可以固定到多孔金属壳上。 无孔构件可以包括从外表面延伸的刺穿构件,刺穿构件适于在植入位置穿透骨骼。 无孔构件可以包括尖钉或翅片。 在一个示例中,刺穿构件可以在与多孔金属壳的外表面的界面处限定减小的材料横截面。 刺穿构件可以适于在减小的材料横截面处断裂并从多孔金属壳体移除。
    • 8. 发明申请
    • METHODS FOR COATING IMPLANTS
    • 涂层的方法
    • US20110143127A1
    • 2011-06-16
    • US12636379
    • 2009-12-11
    • Gautam GuptaMukesh KumarRobert M. Ronk
    • Gautam GuptaMukesh KumarRobert M. Ronk
    • B32B15/04C23C28/00B05D1/08C23C4/08C23C16/00
    • A61L27/32A61L27/30A61L27/306A61L27/3604A61L27/365A61L27/54A61L2420/02A61L2420/08Y10T428/265
    • An implant and method for applying an osteoconductive coating on a non-conductive surface of an implant. The method includes depositing an electroconductive interlayer on at least a portion of a non-conductive implant surface. A secondary process is applied to the interlayer and an osteoconductive coating is thereby formed on the implant. In various embodiments, the electroconductive interlayer is deposited as a non-structural film and comprises a dense, non-porous metal such as titanium, titanium alloys, cobalt, cobalt alloys, chromium, chromium alloys, tantalum, tantalum alloys, iron alloys, stainless steel, and mixtures thereof. The osteoconductive coating may include a metal, a porous metal, or calcium phosphate. The osteoconductive coating may include additional agents, such as bone product, growth factor, bioactive agent, antibiotic, or combinations thereof.
    • 用于在植入物的非导电表面上施加骨传导性涂层的植入物和方法。 该方法包括在非导电植入物表面的至少一部分上沉积导电中间层。 将二次方法应用于中间层,由此在植入物上形成骨传导性涂层。 在各种实施方案中,导电中间层作为非结构膜沉积并且包含致密的非多孔金属如钛,钛合金,钴,钴合金,铬,铬合金,钽,钽合金,铁合金,不锈钢 钢及其混合物。 骨传导性涂层可以包括金属,多孔金属或磷酸钙。 骨传导性涂层可以包括另外的试剂,例如骨产品,生长因子,生物活性剂,抗生素或其组合。