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    • 6. 发明授权
    • End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
    • 用于半导体晶片转移装置的末端执行器和用末端执行器移动晶片的方法
    • US06267423B1
    • 2001-07-31
    • US09578007
    • 2000-05-24
    • Dan A. MarohlKenny King-Tai Ngan
    • Dan A. MarohlKenny King-Tai Ngan
    • B65G4907
    • H01L21/68707Y10S414/141
    • An end effector for a transfer robot used in connection with the manufacture of semiconductor wafers is provided. The end effector is designed to handle very thin (0.005″-010″) semiconductor wafers which tend to bow during processing. The robot blade or end effector includes a deep pocket for receiving a bowed wafer. The depth of the pocket may be varied depending upon the degree of bowing in the wafers to be handled. Unlike ordinary wafer transfer devices, the present invention requires the wafer to be transferred with the surface bearing the devices facing down. The deep pocket allows the end effector to contact only the edges of the wafer, thus minimizing any defects across the wafer due to handling. The pocket opening is provided with arcuately shaped sloped wafer contact surfaces to prevent wafer sliding during robot movement.
    • 提供了一种用于与制造半导体晶片相关的传送机器人的端部执行器。 端部执行器被设计为处理在加工期间倾向于弯曲的非常薄(0.005“-101”)的半导体晶片。 机器人刀片或末端执行器包括用于接收弓形晶片的深口袋。 口袋的深度可以根据要处理的晶片的弯曲程度而变化。 不同于普通的晶片转移装置,本发明要求晶片被转移,其中表面将使装置面朝下。 深口袋允许端部执行器仅接触晶片的边缘,从而最小化由于处理而在晶片上的任何缺陷。 口袋开口设置有弧形倾斜的晶片接触表面,以防止机器人运动期间的晶片滑动。
    • 7. 发明授权
    • Magnetically coupled wafer extraction platform
    • 磁耦合晶圆提取平台
    • US5833426A
    • 1998-11-10
    • US763604
    • 1996-12-11
    • Dan A. Marohl
    • Dan A. Marohl
    • B65G49/07H01L21/677H01L21/687B65G65/02
    • H01L21/67748H01L21/67781H01L21/68707Y10S414/137Y10S414/139Y10S414/14
    • A wafer extraction platform that is compatible with a high vacuum transfer system includes magnetically coupled upper and lower assemblies. A vacuum to atmosphere seal on the platform is maintained with two O-rings. Two opposing arrays of spaced, parallel blades in the upper assembly define slots for receiving wafers from a cassette. The upper assembly moves in response to a magnetically coupled linear slide mounted on the lower assembly. The upper assembly moves outside the load lock, and the blades pick up and simultaneously extract the wafers from the cassette. The upper assembly retracts into the load lock, and the wafers are transferred to the process chamber. A linear motor mounted at atmospheric pressure inside the lower assembly permits the horizontal movement of the upper assembly while holding the blades parallel to the wafers. Level adjustment screws and a bellows are used to level the platform.
    • 与高真空传输系统兼容的晶片提取平台包括磁耦合的上部和下部组件。 使用两个O形环保持平台上的大气密封真空。 在上部组件中的两个相对的间隔开的平行叶片阵列限定用于从盒子接收晶片的狭槽。 上部组件响应于安装在下部组件上的磁耦合线性滑块而移动。 上部组件移动到装载锁定之外,并且叶片拾起并同时从盒中提取晶片。 上部组件缩回到负载锁定中,并且晶片被转移到处理室。 安装在下部组件内的大气压下的线性电动机允许上部组件的水平移动,同时保持叶片平行于晶片。 水平调节螺丝和波纹管用于平台平台。