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    • 5. 发明授权
    • Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby
    • 制造具有多栅极绝缘层的半导体器件和由此制造的半导体器件的方法
    • US07508048B2
    • 2009-03-24
    • US10758802
    • 2004-01-15
    • Dae-Woong KangHong-Soo KimJung-Dal ChoiKyu-Charn ParkSeong-Soon ChoYong-Sik YimSung-Nam Chang
    • Dae-Woong KangHong-Soo KimJung-Dal ChoiKyu-Charn ParkSeong-Soon ChoYong-Sik YimSung-Nam Chang
    • H01L29/00
    • H01L27/11521H01L27/115H01L27/11526H01L27/11543
    • Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby are provided. The method includes forming a pad insulation layer and an initial high voltage gate insulation layer on a first region and a second region of a semiconductor substrate respectively. The initial high voltage gate insulation layer is formed to be thicker than the pad insulation layer. A first isolation layer that penetrates the pad insulation layer and is buried in the semiconductor substrate is formed to define a first active region in the first region, and a second isolation layer that penetrates the initial high voltage gate insulation layer and is buried in the semiconductor substrate is formed to define a second active region in the second region. The pad insulation layer is then removed to expose the first active region. A low voltage gate insulation layer is formed on the exposed first active region. Accordingly, it can minimize a depth of recessed regions (dent regions) to be formed at edge regions of the first isolation layer during removal of the pad insulation layer, and it can prevent dent regions from being formed at edge regions of the second isolation layer.
    • 提供了制造具有多栅极绝缘层的半导体器件和由此制造的半导体器件的方法。 该方法包括分别在半导体衬底的第一区域和第二区域上形成衬垫绝缘层和初始高电压栅极绝缘层。 初始高压栅绝缘层形成为比焊垫绝缘层厚。 形成穿过焊盘绝缘层并被埋在半导体衬底中的第一隔离层,以限定第一区域中的第一有源区和穿过初始高电压栅极绝缘层并被埋在半导体中的第二隔离层 形成衬底以限定第二区域中的第二有源区。 然后去除焊盘绝缘层以露出第一有源区。 在暴露的第一有源区上形成低压栅极绝缘层。 因此,能够最大限度地减少在去除焊盘绝缘层期间在第一隔离层的边缘区域形成的凹陷区域(凹陷区域)的深度,并且可以防止凹陷区域形成在第二隔离层的边缘区域 。