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    • 7. 发明申请
    • Non-volatile memory devices and methods of fabricating the same
    • 非易失性存储器件及其制造方法
    • US20050164457A1
    • 2005-07-28
    • US11086161
    • 2005-03-21
    • Dong-Chan KimSung-Nam Chang
    • Dong-Chan KimSung-Nam Chang
    • H01L21/8247H01L27/115H01L29/788H01L21/336H01L21/3205
    • H01L27/115H01L27/11521
    • Non-volatile memory devices and fabrication methods thereof are provided. The device includes a plurality of isolation layers formed at a semiconductor device, a plurality of stacked gates crossing over an active region between the isolation layers, and an oxidation barrier layer covering the stacked gate. Each of the stacked gates has a control gate electrode crossing over the active region, a floating gate interposed between the control gate electrode and the active region, and an inter-gate dielectric layer interposed between the control gate electrode and the floating gate. Also, the inter-gate dielectric layer has a bottom dielectric layer, an intermediate dielectric layer and a top dielectric layer which are sequentially stacked. The oxidation barrier layer is formed prior to a subsequent thermal oxidation process for curing etch damage that occurs during formation of the stacked gates.
    • 提供非易失性存储器件及其制造方法。 该器件包括形成在半导体器件上的多个隔离层,跨过隔离层之间的有源区域的多个层叠栅极和覆盖堆叠栅极的氧化阻挡层。 层叠栅极中的每一个具有跨越有源区域的控制栅极电极,插入在控制栅电极和有源区域之间的浮置栅极以及介于控制栅极电极和浮置栅极之间的栅极间电介质层。 此外,栅极间电介质层具有依次层叠的底部电介质层,中间电介质层和顶部电介质层。 在随后的热氧化过程之前形成氧化阻挡层,用于固化在层叠栅极形成期间发生的蚀刻损伤。