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    • 4. 发明申请
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US20080105889A1
    • 2008-05-08
    • US11976791
    • 2007-10-29
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • H01L33/00
    • H01L33/0079H01L33/22H01L33/32
    • There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.
    • 提供了一种制造氮化物半导体发光器件的方法和通过该方法制造的氮化物半导体发光器件,该方法包括:通过依次生长第一导电氮化物层,有源层和第二导电性来形成发光结构 在氮化物单晶生长的预备衬底上形成氮化物层; 根据最终发光器件的尺寸分离发光结构; 在所述发光结构上形成导电基板; 抛光初步衬底的底面以减小初步衬底的厚度; 通过机加工初步底材形成不均匀的表面结构; 选择性地去除所述初步衬底以暴露所述第一导电型氮化物层的部分; 以及通过选择性地去除所述预备衬底而在所述第一导电型氮化物层的部分上形成电极。
    • 6. 发明授权
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US08124997B2
    • 2012-02-28
    • US12756528
    • 2010-04-08
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • Tae Jun KimSu Yeol LeeDong Woo KimHyun Ju ParkHyoun Soo ShinIn Joon Pyeon
    • H01L31/0232
    • H01L33/0079H01L33/22H01L33/32
    • There are provided a method of manufacturing a nitride semiconductor light emitting device and the nitride semiconductor light emitting device manufactured by the method, the method including: forming a light emitting structure by sequentially growing a first conductivity nitride layer, an active layer and a second conductivity type nitride layer on a preliminary substrate for nitride single crystal growth; separating the light emitting structure in accordance with a size of final light emitting device; forming a conductive substrate on the light emitting structure; polishing a bottom surface of the preliminary substrate to reduce a thickness of the preliminary substrate; forming uneven surface structures by machining the preliminary substrate; selectively removing the preliminary substrate to expose portions of the first conductivity type nitride layer; and forming electrodes on the portions of the first conductivity type nitride layer exposed by selectively removing the preliminary substrate.
    • 提供了一种制造氮化物半导体发光器件的方法和通过该方法制造的氮化物半导体发光器件,该方法包括:通过依次生长第一导电氮化物层,有源层和第二导电性来形成发光结构 在氮化物单晶生长的预备衬底上形成氮化物层; 根据最终发光器件的尺寸分离发光结构; 在所述发光结构上形成导电基板; 抛光初步衬底的底面以减小初步衬底的厚度; 通过机加工初步底材形成不均匀的表面结构; 选择性地去除所述初步衬底以暴露所述第一导电型氮化物层的部分; 以及通过选择性地去除所述预备衬底而在所述第一导电型氮化物层的部分上形成电极。
    • 10. 发明授权
    • Chip on board package for optical mice and lens cover for the same
    • 光电鼠标芯片封装和镜头盖相同
    • US06653724B1
    • 2003-11-25
    • US10198982
    • 2002-07-22
    • Tae Jun KimYoo Sun Song
    • Tae Jun KimYoo Sun Song
    • H01L2306
    • G06F3/0317H01L2224/32225H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/00014H01L2924/00
    • Disclosed herein is a chip on board lead package for optical mice and lens cover for the same. A semiconductor chip on board package for optical mice has a board, a semiconductor chip, at least one circuit pattern, at least one bonding wire, and a lens cover. The board has top and bottom surfaces, and a pair of via holes. The semiconductor chip is attached to a center portion on the top surface of the board and provided with a plurality of electrode terminals. The circuit pattern is formed on the top surface of the board. The bonding wire electrically connects the electrode terminals of the semiconductor chip with the circuit pattern. The lens cover encloses the top surface of the board and has a lens disposed on the same axis as that of the semiconductor chip, a plurality of electrode pins formed at positions of the lens cover corresponding to the positions of the via holes in the board to be integrated with the lens cover, and an opening formed in a center portion within the lens cover.
    • 这里公开了用于光学鼠标的芯片上的铅封装和用于其的透镜盖。 用于光学鼠标的半导体芯片板上封装具有板,半导体芯片,至少一个电路图案,至少一个接合线和透镜盖。 该板具有顶面和底面,以及一对通孔。 半导体芯片安装在板的顶表面上的中心部分并且设置有多个电极端子。 电路图案形成在板的顶表面上。 接合线将半导体芯片的电极端子与电路图形电连接。 透镜盖包围板的上表面,并且具有与半导体芯片相同的轴上设置的透镜,形成在透镜盖的位置上的多个电极引脚对应于板中的通孔的位置到 与透镜盖一体化,以及形成在透镜盖内的中心部分的开口。