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    • 1. 发明授权
    • Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities
    • 宽带屏蔽同轴微带正交发射器使用分布式不连续性
    • US06236287B1
    • 2001-05-22
    • US09310525
    • 1999-05-12
    • Clifton QuanEdward L. RobertsonRosie M. JorgensonMark Y. HashimotoDavid E. Roberts
    • Clifton QuanEdward L. RobertsonRosie M. JorgensonMark Y. HashimotoDavid E. Roberts
    • H01P104
    • H01P5/085
    • A coaxial-to-microstrip vertical transition includes a dielectric substrate having formed on a first surface thereof a primary microstrip conductor trace, and on a second surface a secondary microstrip conductor trace. A first conductive via extends through the dielectric substrate and electrically connects the primary conductor trace to the secondary conductor trace. A second conductive via is spaced from the first conductive via and extends through the dielectric substrate to electrically connect the secondary conductor trace to the coaxial center conductor. A bottom microstrip ground plane layer is defined on the second substrate surface. A conductive base plate structure has a cavity formed therein, the substrate positioned such that the base plate structure is in contact with the bottom ground plane layer, and the secondary conductor trace is positioned over the cavity. The substrate is positioned between a cover structure and the base plate structure, the cover structure disposed in spaced relation with respect to the first surface of the substrate. A coaxial transmission line structure includes an outer shield and a coaxial center conductor structure disposed within the outer conductor and transverse to the substrate, the center conductor passed through an opening in the cover structure to contact the second via. A conductive plate structure is positioned between the plane of the cover structure and the substrate, providing shielding surrounding the center conductor between the cover and the substrate.
    • 同轴对微带垂直转变包括在其第一表面上形成有初级微带导体迹线的介质基片,在第二表面上形成次级微带导体迹线。 第一导电通孔延伸穿过电介质基板并将初级导体迹线电连接到次级导体迹线。 第二导电通孔与第一导电通孔间隔开并延伸穿过电介质基板,以将次导体迹线电连接到同轴中心导体。 底部微带接地平面层限定在第二基板表面上。 导电基板结构具有形成在其中的空腔,基板被定位成使得底板结构与底部接地平面层接触,并且次级导体迹线位于空腔上方。 基板位于盖结构和基板结构之间,盖结构相对于基板的第一表面间隔开设置。 同轴传输线结构包括外屏蔽和同轴中心导体结构,其设置在外导体内且横向于衬底,中心导体穿过盖结构中的开口以接触第二通孔。 导电板结构位于盖结构的平面和基板之间,提供围绕盖和基板之间的中心导体的屏蔽。
    • 2. 发明授权
    • Microstrip to coax vertical launcher using fuzz button and solderless
interconnects
    • 微带线使用模糊按钮和无焊接互连同轴电缆垂直发射器
    • US5886590A
    • 1999-03-23
    • US923314
    • 1997-09-04
    • Clifton QuanSteven W. DrostMark Y. HashimotoRosie M. Jorgenson
    • Clifton QuanSteven W. DrostMark Y. HashimotoRosie M. Jorgenson
    • H01P5/08H01P1/04
    • H01P5/085
    • Coax to microstrip orthogonal launchers that use a compressible fuzz button center conductor as a solderless interconnect. The launcher comprises a coaxial connector having a center conductor that contacts a compressible fuzz button interconnect. In certain embodiments, the fuzz button interconnect directly contacts one end of a microstrip line. In another embodiment, the microstrip line is formed on a curved microstrip circuit board, and the fuzz button interconnect contacts a pin that has a thin metal tab that is adhesively secured to the one end of the microstrip line. In all embodiments, a second coaxial connector has a center conductor that contacts the opposite end of the microstrip conductor line. The present invention eliminates need for precise soldering by using the fuzz button interconnect to create a solderless compression contact between the coaxial connector and the microstrip line. The present invention provides a simple way to vertically launch an RF signal onto microstrip transmission line from a coaxial cable and operates at frequencies up to 18 GHz.
    • 与微带正交发射器同轴,使用可压缩的绒毛按钮中心导体作为无焊接互连。 发射器包括具有接触可压缩绒毛按钮互连的中心导体的同轴连接器。 在某些实施例中,毛绒按钮互连直接接触微带线的一端。 在另一个实施例中,微带线形成在弯曲的微带电路板上,并且绒毛按钮互连件接触具有粘合地固定到微带线的一端的薄金属片的销。 在所有实施例中,第二同轴连接器具有接触微带线导线的相对端的中心导体。 本发明通过使用毛绒按钮互连来消除在同轴连接器和微带线之间产生无焊压缩接触的精确焊接的需要。 本发明提供了一种从同轴电缆将RF信号垂直发射到微带传输线上并在高达18GHz的频率下操作的简单方法。