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1. 发明申请

US20120153454A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120153454A1
公开(公告)日：2012-06-21
申请号：US13103107
申请日：2011-05-09
申请人： Chun-Kai Liu , John H. Lau , Ming-Ji Dai , Ra-Min Tain
发明人： Chun-Kai Liu , John H. Lau , Ming-Ji Dai , Ra-Min Tain
IPC分类号： H01L23/36
CPC分类号： H01L23/38 , H01L21/76898 , H01L23/481 , H01L23/53276 , H01L25/0657 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589
摘要： A semiconductor device including a silicon substrate, a plurality of silicon nanowire clusters, a first circuit layer and a second circuit layer. The silicon substrate has a first surface, a second surface opposite to the first surface and a plurality of through holes. The silicon nanowire clusters are disposed in the through holes of the silicon substrate, respectively. The first circuit layer is disposed on the first surface and connected to the silicon nanowire clusters. The second circuit layer is disposed on the second surface and connected to the silicon nanowire clusters.
摘要翻译：一种半导体器件，包括硅衬底，多个硅纳米线簇，第一电路层和第二电路层。硅衬底具有第一表面，与第一表面相对的第二表面和多个通孔。硅纳米线簇分别设置在硅衬底的通孔中。第一电路层设置在第一表面上并连接到硅纳米线簇。第二电路层设置在第二表面上并连接到硅纳米线簇。

2. 发明授权

US08674491B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08674491B2
公开(公告)日：2014-03-18
申请号：US13103107
申请日：2011-05-09
申请人： Chun-Kai Liu , John H. Lau , Ming-Ji Dai , Ra-Min Tain
发明人： Chun-Kai Liu , John H. Lau , Ming-Ji Dai , Ra-Min Tain
IPC分类号： H01L23/02
CPC分类号： H01L23/38 , H01L21/76898 , H01L23/481 , H01L23/53276 , H01L25/0657 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589
摘要： A semiconductor device including a silicon substrate, a plurality of silicon nanowire clusters, a first circuit layer and a second circuit layer. The silicon substrate has a first surface, a second surface opposite to the first surface and a plurality of through holes. The silicon nanowire clusters are disposed in the through holes of the silicon substrate, respectively. The first circuit layer is disposed on the first surface and connected to the silicon nanowire clusters. The second circuit layer is disposed on the second surface and connected to the silicon nanowire clusters.
摘要翻译：一种半导体器件，包括硅衬底，多个硅纳米线簇，第一电路层和第二电路层。硅衬底具有第一表面，与第一表面相对的第二表面和多个通孔。硅纳米线簇分别设置在硅衬底的通孔中。第一电路层设置在第一表面上并连接到硅纳米线簇。第二电路层设置在第二表面上并连接到硅纳米线簇。

3. 发明授权

US07952368B1 Apparatus and method for measuring diode chip 有权
标题翻译：二极管芯片测量装置及方法
公开(公告)号：US07952368B1
公开(公告)日：2011-05-31
申请号：US12876218
申请日：2010-09-06
申请人： Ming-Ji Dai , Sheng-Liang Li , Ra-Min Tain , Chun-Kai Liu , Chung-Yen Hsu , Ming-Te Lin , Kuang-Yu Tai
发明人： Ming-Ji Dai , Sheng-Liang Li , Ra-Min Tain , Chun-Kai Liu , Chung-Yen Hsu , Ming-Te Lin , Kuang-Yu Tai
IPC分类号： G01R31/00
CPC分类号： G01R31/2635
摘要： An apparatus and a method for measuring a diode chip are provided. The diode chip is placed on a thermal conductive element. The apparatus measures an instant starting current and a first temperature, which is associated with the instant starting current, of the thermal conductive element. After the diode chip operates, the apparatus adjusts the temperature of the thermal conductive element to a second temperature, such that the current of the diode chip is adjusted to be equal to the instant starting current. The apparatus calculates a property of the diode chip according to a real power of the diode chip and a difference between the first temperature and the second temperature.
摘要翻译：提供了一种用于测量二极管芯片的装置和方法。二极管芯片放置在导热元件上。该装置测量与导热元件的即时启动电流相关联的即时启动电流和第一温度。在二极管芯片工作之后，该装置将导热元件的温度调节到第二温度，使得二极管芯片的电流被调整为等于即时启动电流。该装置根据二极管芯片的实际功率和第一温度与第二温度之间的差来计算二极管芯片的特性。

4. 发明授权

US07517114B2 Lighting devices 失效
标题翻译：照明设备
公开(公告)号：US07517114B2
公开(公告)日：2009-04-14
申请号：US11769630
申请日：2007-06-27
申请人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
发明人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
IPC分类号： F21V29/00
CPC分类号： H01L33/645 , F21V29/00 , Y10S257/93 , Y10S362/80
摘要： Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.
摘要翻译：提供照明设备。照明装置包括第一基板，第二基板，光源和设置在第一和第二基板之间的热电冷却芯片组。第一基板包括芯，第一电路层和第二电路层，其中第一和第二电路层设置在芯的相对侧上。第二基板包括第三电路层。光源设置在第一基板上并电连接到第一电路层。热电冷却芯片组电连接到第二和第三电路层，以散发来自光源的热量。

5. 发明申请

US20080013320A1 LIGHTING DEVICES 失效
标题翻译：照明设备
公开(公告)号：US20080013320A1
公开(公告)日：2008-01-17
申请号：US11769630
申请日：2007-06-27
申请人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
发明人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
IPC分类号： F21V29/00 , F21V7/10
CPC分类号： H01L33/645 , F21V29/00 , Y10S257/93 , Y10S362/80
摘要： Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.
摘要翻译：提供照明设备。照明装置包括第一基板，第二基板，光源和设置在第一和第二基板之间的热电冷却芯片组。第一基板包括芯，第一电路层和第二电路层，其中第一和第二电路层设置在芯的相对侧上。第二基板包括第三电路层。光源设置在第一基板上并电连接到第一电路层。热电冷却芯片组电连接到第二和第三电路层，以散发来自光源的热量。

6. 发明授权

US08546924B2 Package structures for integrating thermoelectric components with stacking chips 有权
标题翻译：用于将热电元件与堆叠芯片集成的封装结构
公开(公告)号：US08546924B2
公开(公告)日：2013-10-01
申请号：US12849774
申请日：2010-08-03
申请人： Chih-Kuang Yu , Chun-Kai Liu , Ra-Min Tain
发明人： Chih-Kuang Yu , Chun-Kai Liu , Ra-Min Tain
IPC分类号： H01L23/02
CPC分类号： H01L35/32 , H01L2224/16225
摘要： Package structures for integrating thermoelectric components with stacking chips are presented. The package structures include a chip with a pair of conductive through vias. Conductive elements are disposed one side of the chip contacting the pair of conductive through vias. Thermoelectric components are disposed on the other side of the chip, wherein the thermoelectric component includes a first type conductive thermoelectric element and a second type conductive thermoelectric element respectively corresponding to and electrically connecting to the pair of conductive through vias. A substrate is disposed on the thermoelectric component, wherein the thermoelectric component, the pair of conductive through vias and the conductive element form a thermoelectric current path. Therefore, heat generated from the chip is transferred outward through a thermoelectric path formed from the thermoelectric components, the conductive through vias and the conductive elements.
摘要翻译：介绍了将热电元件与堆叠芯片集成的封装结构。封装结构包括具有一对导电通孔的芯片。导电元件设置在与一对导电通孔相接触的芯片的一侧。热电元件设置在芯片的另一侧，其中热电元件包括分别对应于并电连接到一对导电通孔的第一类型的导电热电元件和第二型导电热电元件。基板设置在热电元件上，其中热电元件，一对导电通孔和导电元件形成热电电流路径。因此，从芯片产生的热量通过由热电组件，导电通孔和导电元件形成的热电路径向外转移。

7. 发明申请

US20070012938A1 Light-emitting-diode packaging structure having thermal-electric element 审中-公开
标题翻译：具有热电元件的发光二极管封装结构
公开(公告)号：US20070012938A1
公开(公告)日：2007-01-18
申请号：US11255915
申请日：2005-10-24
申请人： Chih-Kuang Yu , Chun-Kai Liu , Ra-Min Tain , Jen-Hau Cheng
发明人： Chih-Kuang Yu , Chun-Kai Liu , Ra-Min Tain , Jen-Hau Cheng
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/62 , H01L33/645 , H01L2224/05147 , H01L2224/05171 , H01L2224/05567 , H01L2224/05573 , H01L2224/05644 , H01L2224/16 , H01L2224/48091 , H01L2924/00012 , H01L2924/00014
摘要： A light-emitting-diode packaging structure having thermoelectric device, which is applied to the LED unit packaged using the flip chip technology. This is realized by directly building the thermoelectric elements into the solder bump layer of the light-emitting-diode packaging structure to replace a part of the solder bumps, as such raising the heat dissipation efficiency of the light emitting diode unit, enhancing the stability and reliability of light emission of the LED unit, and reducing the difficulties and complexity of the integration of the LED package.
摘要翻译：一种具有热电装置的发光二极管封装结构，其应用于使用倒装芯片技术封装的LED单元。这是通过将热电元件直接构建到发光二极管封装结构的焊料凸块层中来实现的，以替代部分焊料凸块，从而提高发光二极管单元的散热效率，增强了稳定性和 LED单元发光的可靠性，降低了LED封装的集成难度和复杂性。

8. 发明申请

US20120227684A1 HYDROGEN/OXYGEN GAS GENERATING APPARATUS AND INTERNAL COMBUSTION ENGINE SYSTEM HAVING THE SAME 审中-公开
标题翻译：氢气/氧气发生装置及内燃机系统
公开(公告)号：US20120227684A1
公开(公告)日：2012-09-13
申请号：US13476034
申请日：2012-05-21
申请人： Ra-Min Tain , Yao-Shun Chen , Wei-Kuo Han , Chun-Kai Liu
发明人： Ra-Min Tain , Yao-Shun Chen , Wei-Kuo Han , Chun-Kai Liu
IPC分类号： F02B43/08 , C25B1/04 , C25B15/00 , F01N5/02 , C25B9/00
CPC分类号： C25B1/04 , C25B9/00 , F01K27/00 , F01N5/025 , F02B43/08 , F02B43/10 , F02B2043/106 , F02G2260/00 , H02K7/1823 , Y02E60/366 , Y02T10/16 , Y02T10/166 , Y02T10/32
摘要： An internal combustion engine system including an electric power generating device, a container, a set of positive and negative electrodes and an internal combustion engine is provided. The container contains an electrolytic solution and has a gas outlet. The set of positive and negative electrodes are disposed within the electrolytic solution in the container, wherein the set of positive and negative electrodes are electrically connected to a first power output end and a second power output end of the electric power generating device, respectively. The internal combustion engine is connected to the gas outlet, wherein a gas product directed from the gas outlet is used as a fuel of the internal combustion engine. Further, the electric power generating device can be applied on a hydrogen/oxygen gas generating apparatus and integrated into the internal combustion engine system of a motor vehicle.
摘要翻译：提供一种包括发电装置，容器，一组正极和负极以及内燃机的内燃机系统。容器包含电解液并具有气体出口。正极和负极的一组设置在容器内的电解液中，其中正极和负极的组分别电连接到发电装置的第一电力输出端和第二电力输出端。内燃机连接到气体出口，其中从气体出口引导的气体产物用作内燃机的燃料。此外，发电装置可以应用于氢气/氧气发生装置并且集成到机动车辆的内燃机系统中。

9. 发明申请

US20110042805A1 PACKAGE STRUCTURES FOR INTEGRATING THERMOELECTRIC COMPONENTS WITH STACKING CHIPS 有权
标题翻译：用堆叠芯片集成热电组件的封装结构
公开(公告)号：US20110042805A1
公开(公告)日：2011-02-24
申请号：US12849774
申请日：2010-08-03
申请人： Chih-Kuang Yu , Chun-Kai Liu , Ra-Min Tain
发明人： Chih-Kuang Yu , Chun-Kai Liu , Ra-Min Tain
IPC分类号： H01L23/498
CPC分类号： H01L35/32 , H01L2224/16225
摘要： Package structures for integrating thermoelectric components with stacking chips are presented. The package structures include a chip with a pair of conductive through vias. Conductive elements are disposed one side of the chip contacting the pair of conductive through vias. Thermoelectric components are disposed on the other side of the chip, wherein the thermoelectric component includes a first type conductive thermoelectric element and a second type conductive thermoelectric element respectively corresponding to and electrically connecting to the pair of conductive through vias. A substrate is disposed on the thermoelectric component, wherein the thermoelectric component, the pair of conductive through vias and the conductive element form a thermoelectric current path. Therefore, heat generated from the chip is transferred outward through a thermoelectric path formed from the thermoelectric components, the conductive through vias and the conductive elements.
摘要翻译：介绍了将热电元件与堆叠芯片集成的封装结构。封装结构包括具有一对导电通孔的芯片。导电元件设置在与一对导电通孔相接触的芯片的一侧。热电元件设置在芯片的另一侧，其中热电元件包括分别对应于并电连接到一对导电通孔的第一类型的导电热电元件和第二型导电热电元件。基板设置在热电元件上，其中热电元件，一对导电通孔和导电元件形成热电电流路径。因此，从芯片产生的热量通过由热电组件，导电通孔和导电元件形成的热电路径向外转移。

10. 发明授权

US08310037B2 Light emitting apparatus and fabrication method thereof 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08310037B2
公开(公告)日：2012-11-13
申请号：US12545862
申请日：2009-08-24
申请人： Chun-Kai Liu , Yu-Lin Chao , Ming-Ji Dai
发明人： Chun-Kai Liu , Yu-Lin Chao , Ming-Ji Dai
IPC分类号： H01L23/02
CPC分类号： H01S5/4025 , H01L23/34 , H01L25/167 , H01L33/64 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A light emitting apparatus comprising a substrate, a first functional chip and a first light emitting component is provided. The substrate, the first functional chip, and the first light emitting component have a plurality of first bumps. In addition, the first functional chip has a plurality of first vias. The first light emitting component and the first functional chip are stacked on the substrate. Hence, the first light emitting component is electrically connected to the first functional chip and the substrate by the first vias and the first bumps.
摘要翻译：提供了包括基板，第一功能芯片和第一发光部件的发光装置。基板，第一功能芯片和第一发光部件具有多个第一凸块。此外，第一功能芯片具有多个第一通孔。第一发光部件和第一功能芯片堆叠在基板上。因此，第一发光部件通过第一通孔和第一凸块与第一功能芯片和基板电连接。

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