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1. 发明授权

US08573784B2 Imaging apparatus having an optical sensor 有权
标题翻译：具有光学传感器的成像设备
公开(公告)号：US08573784B2
公开(公告)日：2013-11-05
申请号：US13212212
申请日：2011-08-18
申请人： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
发明人： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
IPC分类号： G03B21/16
CPC分类号： H04N9/315 , G03B21/005 , H01L27/156 , H01L33/504 , H01L33/60 , H01L2933/0083
摘要： A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.
摘要翻译：提供投影装置。投影装置包括发光单元阵列，光学传感器和控制单元。发光单元阵列用于发射图像束。光学传感器用于检测电磁波以产生信号。控制单元电耦合到发光单元阵列和光学传感器，用于根据来自光学传感器的信号控制发光单元阵列的发射。

2. 发明授权

US07952368B1 Apparatus and method for measuring diode chip 有权
标题翻译：二极管芯片测量装置及方法
公开(公告)号：US07952368B1
公开(公告)日：2011-05-31
申请号：US12876218
申请日：2010-09-06
申请人： Ming-Ji Dai , Sheng-Liang Li , Ra-Min Tain , Chun-Kai Liu , Chung-Yen Hsu , Ming-Te Lin , Kuang-Yu Tai
发明人： Ming-Ji Dai , Sheng-Liang Li , Ra-Min Tain , Chun-Kai Liu , Chung-Yen Hsu , Ming-Te Lin , Kuang-Yu Tai
IPC分类号： G01R31/00
CPC分类号： G01R31/2635
摘要： An apparatus and a method for measuring a diode chip are provided. The diode chip is placed on a thermal conductive element. The apparatus measures an instant starting current and a first temperature, which is associated with the instant starting current, of the thermal conductive element. After the diode chip operates, the apparatus adjusts the temperature of the thermal conductive element to a second temperature, such that the current of the diode chip is adjusted to be equal to the instant starting current. The apparatus calculates a property of the diode chip according to a real power of the diode chip and a difference between the first temperature and the second temperature.
摘要翻译：提供了一种用于测量二极管芯片的装置和方法。二极管芯片放置在导热元件上。该装置测量与导热元件的即时启动电流相关联的即时启动电流和第一温度。在二极管芯片工作之后，该装置将导热元件的温度调节到第二温度，使得二极管芯片的电流被调整为等于即时启动电流。该装置根据二极管芯片的实际功率和第一温度与第二温度之间的差来计算二极管芯片的特性。

3. 发明授权

US08497560B2 LED package and method of assembling the same 有权
标题翻译： LED封装及其组装方法
公开(公告)号：US08497560B2
公开(公告)日：2013-07-30
申请号：US12714371
申请日：2010-02-26
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L31/0203
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.
摘要翻译：提供LED封装。 LED封装包括载体，LED芯片，导电结构，第一密封剂，透镜和散热器。托架是杯形的并且包括底部和侧壁。 LED芯片被容纳在载体中并且设置在底部。导电结构电连接到LED芯片。第一密封剂被容纳在载体中并固定载体和导电结构。镜头对应于LED芯片。载体被嵌入散热器中，并且由LED芯片产生的热量经由载体的底部和侧壁传递到散热器。

4. 发明授权

US08125126B2 Multi-facet light emitting lamp 有权
标题翻译：多面发光灯
公开(公告)号：US08125126B2
公开(公告)日：2012-02-28
申请号：US12970961
申请日：2010-12-17
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01J1/02
CPC分类号： F21V23/0435 , F21K9/232 , F21V29/83 , F21Y2107/40 , F21Y2115/10
摘要： A multi-facet light emitting lamp including a first light source plate, a second light source plate, and a plurality of airflow channels is provided. The first light source plate has at least one first connecting terminal. The second light source plate has at least one second connecting terminal. The first connecting terminal is connected with the second connecting terminal, and an inner space is formed between the first light source plate and the second light source plate. The inner space and a space outside the multi-facet light emitting lamp are connected by the airflow channels.
摘要翻译：提供了包括第一光源板，第二光源板和多个气流通道的多面发光灯。第一光源板具有至少一个第一连接端子。第二光源板具有至少一个第二连接端子。第一连接端子与第二连接端子连接，并且在第一光源板和第二光源板之间形成内部空间。内部空间和多面发光灯外部的空间通过气流通道连接。

5. 发明申请

US20110297975A1 LIGHT-EMITTING UNIT ARRAY 审中-公开
标题翻译：发光单元阵列
公开(公告)号：US20110297975A1
公开(公告)日：2011-12-08
申请号：US13212208
申请日：2011-08-18
申请人： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
发明人： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
IPC分类号： H01L27/15
CPC分类号： H04N9/315 , G03B21/005 , H01L27/156 , H01L33/504 , H01L33/60 , H01L2933/0083
摘要： A light-emitting unit array includes a plurality of light-emitting units arranged and integrated monolithically in an array, and each of the light-emitting units includes a first doped type layer, a second doped type layer, a light-emission layer, and a photonic crystal structure. The light emission layer is disposed between the first doped type layer and the second doped type layer, wherein the second doped type layer has a surface facing away from the light emission layer. The photonic crystal structure is disposed on the surface of the second doped type layer.
摘要翻译：发光单元阵列包括以阵列的方式排列并集成的多个发光单元，并且每个发光单元包括第一掺杂型层，第二掺杂型层，发光层和光子晶体结构。发光层设置在第一掺杂型层和第二掺杂型层之间，其中第二掺杂型层具有背离发光层的表面。光子晶体结构设置在第二掺杂型层的表面上。

6. 发明申请

US20110284879A1 LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE 有权
标题翻译：发光二极管封装和发光二极管模块
公开(公告)号：US20110284879A1
公开(公告)日：2011-11-24
申请号：US12980358
申请日：2010-12-29
申请人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Sheng-Chieh Tai , Chih-Hsuan Liu , Kuang-Yu Tai
IPC分类号： H01L33/08 , H01L33/60
CPC分类号： F21V3/00 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/70 , F21Y2107/40 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.
摘要翻译：提供了包括载体，LED芯片，透镜和荧光体层的发光二极管（LED）封装。设置在载体上的LED芯片。封装LED芯片的透镜具有围绕LED芯片的多个翅片和圆锥形凹口。翅片径向向后延伸LED芯片。每个翅片具有至少一个发光表面和邻近发光表面的至少一个反射表面。锥形凹陷的底面作为全反射面。荧光体层设置在透镜的发光面上。还提供LED封装和LED模块。

7. 发明申请

US20080063738A1 Light-emitting diode packaging apparatus, mold base and supporting member thereof 有权
标题翻译：发光二极管封装装置，模具基座及其支撑部件
公开(公告)号：US20080063738A1
公开(公告)日：2008-03-13
申请号：US11802883
申请日：2007-05-25
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： B29C41/20
CPC分类号： B29C41/20 , B29L2011/0016
摘要： A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.
摘要翻译：公开了一种发光二极管封装装置，其用于具有插入其中的多个支撑件用于随后的模制和包装操作的支撑构件，包括用于支撑构件的多个支撑件的模座插入其中，以及控制器，用于插入到模具基座中并定位支撑构件。本发明的特征在于，在每个支撑件的至少一个电极销的周边处形成定位脚，并且还在模座的模具杯上形成相应的第一定位孔，用于支撑件的定位。本发明还提供了一种用于发光二极管封装装置的模具基座和支撑件。

8. 发明申请

US20070222381A1 LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20070222381A1
公开(公告)日：2007-09-27
申请号：US11468333
申请日：2006-08-30
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Ming-Hung Chen
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai , Ming-Hung Chen
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/62 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting device and the method for producing the same are disclosed. The light emitting device has at least a light emitting unit with a first electrode and a second electrode for generating a light source when powered on, a conductive element electrically coupled to the first electrode of the light emitting unit and a substrate having a carrier portion for carrying the light emitting unit and a heat dissipating portion extending from the carrier portion and electrically coupled to the second electrode of the light emitting unit, in which the conductive element is disposed on a side of a planar face of the heat dissipating portion, thereby allowing large contact area to be established between the heat dissipating portion and a sub-heat-dissipating system or air so as to achieve good heat dissipation.
摘要翻译：公开了一种发光器件及其制造方法。发光器件至少具有发光单元，其具有第一电极和用于在通电时产生光源的第二电极，电耦合到发光单元的第一电极的导电元件和具有用于携带发光单元和从载体部分延伸并电耦合到发光单元的第二电极的散热部分，其中导电元件设置在散热部分的平面的一侧，从而允许在散热部和副散热系统或空气之间建立大的接触面积，以实现良好的散热。

9. 发明申请

US20110299044A1 PROJECTION APPARATUS 有权
标题翻译：投影设备
公开(公告)号：US20110299044A1
公开(公告)日：2011-12-08
申请号：US13212212
申请日：2011-08-18
申请人： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
发明人： Wen-Yung Yeh , Chia-Hsin Chao , Yu-Hung Chuang , Chia-Ling Li , Chun-Feng Lai , Hsi-Hsuan Yen , Sheng-Chieh Tai , Kuang-Yu Tai , Tse-Peng Chen
IPC分类号： G03B21/16 , G03B21/14
CPC分类号： H04N9/315 , G03B21/005 , H01L27/156 , H01L33/504 , H01L33/60 , H01L2933/0083
摘要： A projection apparatus is provided. The projection apparatus includes a light-emitting unit array, an optical sensor, and a control unit. The light-emitting unit array is for emitting an image beam. The optical sensor is for detecting electromagnetic waves so as to generate a signal. The control unit is electrically coupled to the light-emitting unit array and the optical sensor for controlling emission of the light-emitting unit array according to the signal from the optical sensor.
摘要翻译：提供投影装置。投影装置包括发光单元阵列，光学传感器和控制单元。发光单元阵列用于发射图像束。光学传感器用于检测电磁波以产生信号。控制单元电耦合到发光单元阵列和光学传感器，用于根据来自光学传感器的信号控制发光单元阵列的发射。

10. 发明授权

US07775784B2 Light-emitting diode packaging apparatus, mold base and supporting member thereof 有权
标题翻译：发光二极管封装装置，模具基座及其支撑部件
公开(公告)号：US07775784B2
公开(公告)日：2010-08-17
申请号：US11802883
申请日：2007-05-25
申请人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
发明人： Ming-Te Lin , Ming-Yao Lin , Kuang-Yu Tai
IPC分类号： H01L21/56
CPC分类号： B29C41/20 , B29L2011/0016
摘要： A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.
摘要翻译：公开了一种发光二极管封装装置，其用于具有插入其中的多个支撑件用于随后的模制和包装操作的支撑构件，包括用于支撑构件的多个支撑件的模座插入其中，以及控制器，用于插入到模具基座中并定位支撑构件。本发明的特征在于，在每个支撑件的至少一个电极销的周边处形成定位脚，并且还在模座的模具杯上形成相应的第一定位孔，用于支撑件的定位。本发明还提供了一种用于发光二极管封装装置的模具基座和支撑件。

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