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1. 发明授权

US08310037B2 Light emitting apparatus and fabrication method thereof 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08310037B2
公开(公告)日：2012-11-13
申请号：US12545862
申请日：2009-08-24
申请人： Chun-Kai Liu , Yu-Lin Chao , Ming-Ji Dai
发明人： Chun-Kai Liu , Yu-Lin Chao , Ming-Ji Dai
IPC分类号： H01L23/02
CPC分类号： H01S5/4025 , H01L23/34 , H01L25/167 , H01L33/64 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A light emitting apparatus comprising a substrate, a first functional chip and a first light emitting component is provided. The substrate, the first functional chip, and the first light emitting component have a plurality of first bumps. In addition, the first functional chip has a plurality of first vias. The first light emitting component and the first functional chip are stacked on the substrate. Hence, the first light emitting component is electrically connected to the first functional chip and the substrate by the first vias and the first bumps.
摘要翻译：提供了包括基板，第一功能芯片和第一发光部件的发光装置。基板，第一功能芯片和第一发光部件具有多个第一凸块。此外，第一功能芯片具有多个第一通孔。第一发光部件和第一功能芯片堆叠在基板上。因此，第一发光部件通过第一通孔和第一凸块与第一功能芯片和基板电连接。

2. 发明申请

US20100267176A1 LIGHT EMITTING APPARATUS AND FABRICATION METHOD THEREOF 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100267176A1
公开(公告)日：2010-10-21
申请号：US12545862
申请日：2009-08-24
申请人： Chun-Kai Liu , Yu-Lin Chao , Ming-Ji Dai
发明人： Chun-Kai Liu , Yu-Lin Chao , Ming-Ji Dai
IPC分类号： H01L33/00 , H01L23/34 , H01S3/042
CPC分类号： H01S5/4025 , H01L23/34 , H01L25/167 , H01L33/64 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/16 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A light emitting apparatus comprising a substrate, a first functional chip and a first light emitting component is provided. The substrate, the first functional chip, and the first light emitting component have a plurality of first bumps. In addition, the first functional chip has a plurality of first vias. The first light emitting component and the first functional chip are stacked on the substrate. Hence, the first light emitting component is electrically connected to the first functional chip and the substrate by the first vias and the first bumps.
摘要翻译：提供了包括基板，第一功能芯片和第一发光部件的发光装置。基板，第一功能芯片和第一发光部件具有多个第一凸块。此外，第一功能芯片具有多个第一通孔。第一发光部件和第一功能芯片堆叠在基板上。因此，第一发光部件通过第一通孔和第一凸块与第一功能芯片和基板电连接。

3. 发明申请

US20070194465A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF 失效
标题翻译：发光二极管封装结构及其制造方法
公开(公告)号：US20070194465A1
公开(公告)日：2007-08-23
申请号：US11309041
申请日：2006-06-13
申请人： Ming-Ji Dai , Chun-Kai Liu , Chih-Kuang Yu
发明人： Ming-Ji Dai , Chun-Kai Liu , Chih-Kuang Yu
IPC分类号： H01L23/29
CPC分类号： H01L33/645 , F21K9/00 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.
摘要翻译：提供了包括第一基板，LED芯片，第二基板和热电冷却装置的发光二极管（LED）封装结构。第一基板具有第一表面和相应的第二表面。适于发光的LED芯片布置在第一基板的第一表面上，并与第一基板电连接。第二基板在第一基板的下面，并且具有第三表面和相应的第四表面。第三表面面向第二表面。热电冷却装置设置在第一基板的第二表面和第二基板的第三表面之间，用于在操作期间传导由LED芯片产生的热量。

4. 发明授权

US08222728B2 Active solid heatsink device and fabricating method thereof 有权
标题翻译：主动固体散热装置及其制造方法
公开(公告)号：US08222728B2
公开(公告)日：2012-07-17
申请号：US12336320
申请日：2008-12-16
申请人： Chih-Kuang Yu , Chun-Kai Liu , Ming-Ji Dai , Chih-Yuan Cheng
发明人： Chih-Kuang Yu , Chun-Kai Liu , Ming-Ji Dai , Chih-Yuan Cheng
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L27/16 , H01L23/38 , H01L2924/0002 , H01S3/04 , H01S5/024 , H01S5/02476 , H01L2924/00
摘要： An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.
摘要翻译：一种活性固体散热装置及其制造方法涉及一种高效固体冷却装置，其中由具有小面积和高发热密度的热源产生的热量使用热的热传导特性扩散到整个基板热电子（TI）结构的电子和热电子（TI）结构和热电（TE）结构共享热扩散到的衬底。此外，共用衬底用作TE结构的冷端，并且向共享衬底的扩散的热量被泵送到TE结构的热端的另一个TE结构的衬底。

5. 发明申请

US20120153454A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120153454A1
公开(公告)日：2012-06-21
申请号：US13103107
申请日：2011-05-09
申请人： Chun-Kai Liu , John H. Lau , Ming-Ji Dai , Ra-Min Tain
发明人： Chun-Kai Liu , John H. Lau , Ming-Ji Dai , Ra-Min Tain
IPC分类号： H01L23/36
CPC分类号： H01L23/38 , H01L21/76898 , H01L23/481 , H01L23/53276 , H01L25/0657 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589
摘要： A semiconductor device including a silicon substrate, a plurality of silicon nanowire clusters, a first circuit layer and a second circuit layer. The silicon substrate has a first surface, a second surface opposite to the first surface and a plurality of through holes. The silicon nanowire clusters are disposed in the through holes of the silicon substrate, respectively. The first circuit layer is disposed on the first surface and connected to the silicon nanowire clusters. The second circuit layer is disposed on the second surface and connected to the silicon nanowire clusters.
摘要翻译：一种半导体器件，包括硅衬底，多个硅纳米线簇，第一电路层和第二电路层。硅衬底具有第一表面，与第一表面相对的第二表面和多个通孔。硅纳米线簇分别设置在硅衬底的通孔中。第一电路层设置在第一表面上并连接到硅纳米线簇。第二电路层设置在第二表面上并连接到硅纳米线簇。

6. 发明授权

US07517114B2 Lighting devices 失效
标题翻译：照明设备
公开(公告)号：US07517114B2
公开(公告)日：2009-04-14
申请号：US11769630
申请日：2007-06-27
申请人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
发明人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
IPC分类号： F21V29/00
CPC分类号： H01L33/645 , F21V29/00 , Y10S257/93 , Y10S362/80
摘要： Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.
摘要翻译：提供照明设备。照明装置包括第一基板，第二基板，光源和设置在第一和第二基板之间的热电冷却芯片组。第一基板包括芯，第一电路层和第二电路层，其中第一和第二电路层设置在芯的相对侧上。第二基板包括第三电路层。光源设置在第一基板上并电连接到第一电路层。热电冷却芯片组电连接到第二和第三电路层，以散发来自光源的热量。

7. 发明申请

US20080013320A1 LIGHTING DEVICES 失效
标题翻译：照明设备
公开(公告)号：US20080013320A1
公开(公告)日：2008-01-17
申请号：US11769630
申请日：2007-06-27
申请人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
发明人： Ra-Min Tain , Shyi-Ching Liau , Chun-Kai Liu , Ming-Ji Dai , Chih-Kuang Yu , Wei-Kuo Han
IPC分类号： F21V29/00 , F21V7/10
CPC分类号： H01L33/645 , F21V29/00 , Y10S257/93 , Y10S362/80
摘要： Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.
摘要翻译：提供照明设备。照明装置包括第一基板，第二基板，光源和设置在第一和第二基板之间的热电冷却芯片组。第一基板包括芯，第一电路层和第二电路层，其中第一和第二电路层设置在芯的相对侧上。第二基板包括第三电路层。光源设置在第一基板上并电连接到第一电路层。热电冷却芯片组电连接到第二和第三电路层，以散发来自光源的热量。

8. 发明申请

US20070187815A1 Encapsulation and methods thereof 有权
标题翻译：封装及其方法
公开(公告)号：US20070187815A1
公开(公告)日：2007-08-16
申请号：US11392721
申请日：2006-03-30
申请人： Ming-Ji Dai , Chun-Kai Liu , Chih-Kuang Yu , Shih-Hsien Wu
发明人： Ming-Ji Dai , Chun-Kai Liu , Chih-Kuang Yu , Shih-Hsien Wu
IPC分类号： H01L23/34
CPC分类号： H01L25/167 , H01L33/645 , H01L35/32 , H01L35/34 , H01L2224/48091 , H01L2224/85385 , H05K1/0203 , H01L2924/00014
摘要： The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.
摘要翻译：本发明公开了一种包括金属基底，金属基底上的PCB，PCB中和/或PCB上的热电元件以及热电元件上的LED的封装。封装方法也由本发明提供。

9. 发明申请

US20130302935A1 SELF-ASSEMBLY APPARATUS, DEVICE SELF-ASSEMBLING METHOD, AND METHOD OF ASSEMBLING THERMOELECTRIC DEVICES 有权
标题翻译：自组装装置，装置自组装方法和组装热电装置的方法
公开(公告)号：US20130302935A1
公开(公告)日：2013-11-14
申请号：US13551606
申请日：2012-07-17
申请人： Ming-Ji Dai , Chun-Kai Liu , Heng-Chieh Chien , Li-Ling Liao , Ker-Win Wang , Yen-Lin Tzeng , Yan-Bo Lin
发明人： Ming-Ji Dai , Chun-Kai Liu , Heng-Chieh Chien , Li-Ling Liao , Ker-Win Wang , Yen-Lin Tzeng , Yan-Bo Lin
IPC分类号： H01L21/98 , B23P19/04 , H05K13/04
CPC分类号： H01L35/34 , H01L24/95 , H01L2224/95001 , H01L2924/12042 , Y10T29/49895 , Y10T29/53174 , Y10T29/53196 , H01L2924/00
摘要： A self-assembly apparatus for assembling a plurality of devices with a predetermined aspect ratio is provided. The self-assembly apparatus includes a guiding element, a vibration device, and a magnetic field inducing device. The guiding element has a mesh structure. The vibration device is coupled to the guiding element and configured to vibrate the guiding element. The magnetic field inducing device is disposed below the guiding element and configured to generate a time-varying magnetic field to rotate each of the devices. Through a collective effect of the vibration of the guiding element, the time-varying magnetic field, and the self-gravity of each of the devices, the devices are positioned on a plate between the guiding element and the magnetic field inducing device through the mesh structure.
摘要翻译：提供了一种用于组装具有预定宽高比的多个装置的自组装装置。自组装装置包括引导元件，振动装置和磁场诱导装置。引导元件具有网格结构。振动装置联接到引导元件并且构造成使引导元件振动。磁场诱导装置设置在引导元件的下方，并被配置成产生时变磁场以使每个装置旋转。通过引导元件的振动，时变磁场和每个器件的自重的集体效应，器件通过网格定位在引导元件和磁场诱导器之间的板上结构体。

10. 发明申请

US20120118346A1 Thermoelectric Apparatus and Method of Fabricating the Same 有权
标题翻译：热电设备及其制造方法
公开(公告)号：US20120118346A1
公开(公告)日：2012-05-17
申请号：US13040477
申请日：2011-03-04
申请人： Chun-Kai Liu , Ming-Ji Dai , Suh-Yun Feng , Li-Ling Liao
发明人： Chun-Kai Liu , Ming-Ji Dai , Suh-Yun Feng , Li-Ling Liao
IPC分类号： H01L35/30 , H01L21/02
CPC分类号： H01L35/30 , H01L35/32
摘要： A thermoelectric apparatus includes a first and a second assemblies, at least a first and a second heat conductors. The first assembly includes a first and a second substrates, and several first thermoelectric material sets disposed between the first and second substrates. The first substrate has at least a first through hole. The second assembly includes a third and a fourth substrates, and several second thermoelectric material sets disposed between the third and fourth substrates. The fourth substrate has at least a second through hole. Each of the first and second thermoelectric material sets has a p-type and an n-type thermoelectric element. The first and second heat conductors respectively penetrate the first and second through holes. Two ends of the first heat conductor respectively connect the second and fourth substrates, while two ends of the second heat conductor respectively connect the first and third substrates.
摘要翻译：热电装置包括第一和第二组件，至少第一和第二热导体。第一组件包括第一和第二衬底以及设置在第一和第二衬底之间的几个第一热电材料组。第一基板具有至少第一通孔。第二组件包括第三和第四衬底以及设置在第三和第四衬底之间的几个第二热电材料组。第四基板具有至少第二通孔。第一和第二热电材料组中的每一个具有p型和n型热电元件。第一和第二热导体分别穿透第一和第二通孔。第一导热体的两端分别连接第二和第四基板，而第二导热体的两端分别连接第一和第三基板。

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