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1. 发明授权

US08960268B2 Methods for cooling computers and electronics 有权
标题翻译：冷却电脑和电子设备的方法
公开(公告)号：US08960268B2
公开(公告)日：2015-02-24
申请号：US12898776
申请日：2010-10-06
申请人： Christian L Belady , Vance Murakami , Robert Allen Pereira
发明人： Christian L Belady , Vance Murakami , Robert Allen Pereira
IPC分类号： F28F27/00 , F28F7/00 , F25B41/00 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20836 , F25B41/003 , F25B2500/06 , G06F1/20 , H05K7/20609
摘要： An exemplary method may include thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also include providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to a second fluid source for configuring the network of cooling lines in different states. The method may also include delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers both when the network of cooling lines is connected only to the first fluid source and when the network of cooling lines is connected to both the first and second fluid sources.
摘要翻译：示例性方法可以包括将冷却管网络热耦合到冷却系统中的多个热交换器中的每一个。该方法还可以包括提供从冷却管线网络到第一流体源的第一连接以及从冷却管网到第二流体源的第二连接，用于配置处于不同状态的冷却管线网络。当冷却管网络仅连接到第一流体源时，并且当冷却管网络连接到第一和第二流体时，该方法还可以包括将冷却流体通过冷却管线网络输送到多个热交换器中的每一个和第二流体源。

2. 发明授权

US06602091B2 Thermally enhanced electrical connector 失效
公开(公告)号：US06602091B2
公开(公告)日：2003-08-05
申请号：US10016167
申请日：2001-10-29
申请人： Christian L Belady , Steve Belson , Michael L. McHugh
发明人： Christian L Belady , Steve Belson , Michael L. McHugh
IPC分类号： H01R1300
CPC分类号： H01R13/533
摘要： An electrical connector is constructed including heat-spreading devices in order to reduce hotspots within the connector and to efficiently dissipate heat to the surrounding atmosphere, thus increasing the current carrying capability of the connector.

3. 发明授权

US06580610B2 Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump 失效
公开(公告)号：US06580610B2
公开(公告)日：2003-06-17
申请号：US10292997
申请日：2002-11-12
申请人： Terrel L. Morris , Christian L Belady
发明人： Terrel L. Morris , Christian L Belady
IPC分类号： H65K720
CPC分类号： H01L23/552 , H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

4. 发明授权

US06452789B1 Packaging architecture for 32 processor server 有权
标题翻译： 32处理器服务器的包装架构
公开(公告)号：US06452789B1
公开(公告)日：2002-09-17
申请号：US09562593
申请日：2000-04-29
申请人： Lisa Heid Pallotti , Eric C. Peterson , Christian L Belady , Terrel L. Morris , Michael C. Day
发明人： Lisa Heid Pallotti , Eric C. Peterson , Christian L Belady , Terrel L. Morris , Michael C. Day
IPC分类号： G06F1200
CPC分类号： G06F15/16
摘要： The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
摘要翻译：本发明的系统使用背板来互连多个模块化单元板。每个单元板包括多个处理器，处理器控制器芯片，存储器子系统和电源子系统。处理器控制器芯片管理单元板上的组件之间的通信。机械子组件为电池板提供支撑，以及用于冷却的通风通道。控制器芯片连接到背板的一侧，而单元板连接到另一侧。控制器芯片管理单元板到单元板通信，以及背板和计算机系统之间的通信。单元板布置成背靠背对，其中最外面的单元板具有其组件延伸超出背板的高度。这允许相邻电池板的前面与前面之间的间隔增加。

5. 发明授权

US07345885B2 Heat spreader with multiple stacked printed circuit boards 失效
标题翻译：具有多层叠印刷电路板的散热器
公开(公告)号：US07345885B2
公开(公告)日：2008-03-18
申请号：US11023213
申请日：2004-12-22
申请人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
发明人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译：具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。散热器和第二PCB基本上围绕其中的第一PCB。

6. 发明授权

US06517315B2 Enhanced performance fan with the use of winglets 失效
标题翻译：增强性能风扇与使用小翼
公开(公告)号：US06517315B2
公开(公告)日：2003-02-11
申请号：US09867194
申请日：2001-05-29
申请人： Christian L Belady
发明人： Christian L Belady
IPC分类号： F01D100
CPC分类号： F04D29/384 , F05D2240/307
摘要： Small winglets placed at the outer end of each fan blade substantially reduce the vortices created in conventional fans by the pressure differential between the low pressure and high pressure sides of the blade. The winglet acts as a barrier, which substantially blocks leakage around the blade tip, thus suppressing vortices. Technical advantages include noise reduction, because there are no shedding vortices to create noise as the blades pass the struts; increased aerodynamic efficiency of the fan, providing higher air flow for the same fan speed, size, and power, because less energy is lost in vortices; and minimal cost impacts, because housings currently used for fans can still be used with standard finger guards and because winglets and blades can be formed integrally of injection molded plastic.
摘要翻译：放置在每个风扇叶片的外端的小小翼片通过叶片的低压侧和高压侧之间的压力差大大地减少了传统风扇中产生的涡流。小翼充当障碍物，其基本上阻挡了叶片尖端周围的泄漏，从而抑制涡流。技术优势包括降噪，因为当叶片通过支柱时，没有脱落的旋涡产生噪音; 提高风扇的空气动力效率，为同样的风扇转速，尺寸和功率提供更高的空气流量，因为在涡流中损耗较少的能量; 并且最小的成本影响，因为目前用于风扇的外壳仍然可以与标准的手指保护罩一起使用，并且因为小翼和叶片可以由注射成型的塑料一体地形成。

7. 发明授权

US06377453B1 Field replaceable module with enhanced thermal interface 失效
标题翻译：现场可更换模块，具有增强的热接口
公开(公告)号：US06377453B1
公开(公告)日：2002-04-23
申请号：US09535090
申请日：2000-03-24
申请人： Christian L Belady
发明人： Christian L Belady
IPC分类号： H05K714
CPC分类号： H05K9/0007 , H05K7/20345 , H05K7/2039
摘要： A self-contained field replaceable module that is adapted for low thermal resistance slideable contact with a heat sink that does not require interface pressure to ensure the contact and that is tolerant of misalignment is presented. The invention includes an interdigitated arrangement of the heat sink and field replaceable module. The field replaceable module includes a lid which forms a sealed cavity around at least one electronic component on the printed circuit board of the field replaceable module. The lid provides spray cooling or conduction cooling to the sealed electronic components. The lid includes a major surface having digit members extending longitudinally therefrom. The heat sink includes a major surface having digit members extending longitudinally therefrom. The digit members of the heat sink and field replaceable module are arranged in interdigitated arrangement for transferring heat from the field replaceable module to the heat sink. The digit members of the field replaceable module are particularly adapted and arranged for slideable contact with the digit members of the heat sink, so as to provide for ease of maintainability and exchangeability of the field replaceable module.
摘要翻译：提供了一种独立的现场可更换模块，适用于低热阻与散热器的滑动接触，不需要界面压力来确保接触并且容许不对准。本发明包括散热器和现场可更换模块的交叉排列。现场可更换模块包括盖，该盖围绕现场可更换模块的印刷电路板上的至少一个电子部件形成密封空腔。盖子向密封的电子部件提供喷雾冷却或传导冷却。盖子包括具有从其纵向延伸的数位构件的主表面。散热器包括具有从其纵向延伸的数位构件的主表面。散热器和现场可更换模块的数字部件以交错布置布置，用于将热量从现场可更换模块传递到散热器。现场可更换模块的数字部件特别适用于和布置成可与散热片的数字部件滑动接触，以便于现场可更换模块的易维护性和可更换性。

8. 发明授权

US06989049B2 Airborne conductive contaminant handler 失效
标题翻译：机载导电污染物处理机
公开(公告)号：US06989049B2
公开(公告)日：2006-01-24
申请号：US10655384
申请日：2003-09-04
申请人： Stev Arthur Belson , Shaun Harris , Christian L Belady
发明人： Stev Arthur Belson , Shaun Harris , Christian L Belady
IPC分类号： B03C3/68
CPC分类号： B03C3/36
摘要： An example airborne conductive contaminant handling system is described. The airborne conductive contaminant handling system may include a handling circuit that is configured to selectively pass an electric current through a conductive contaminant. The airborne conductive contaminant handling system may also include an attracting circuit that is configured to attract an airborne conductive contaminant towards the handling circuit, where it can be subjected to the electric current.
摘要翻译：描述了机载导电污染物处理系统的示例。机载导电污染物处理系统可以包括被配置为选择性地将电流通过导电污染物的处理电路。机载导电污染物处理系统还可以包括吸引电路，该吸引电路被配置为向处理电路吸引机载导电污染物，在那里可以承受电流。

9. 发明授权

US06818835B2 Processor and power supply circuit 有权
标题翻译：处理器和电源电路
公开(公告)号：US06818835B2
公开(公告)日：2004-11-16
申请号：US10420572
申请日：2003-04-22
申请人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Christian L Belady , Lisa Heid Pallotti , Paul T. Artman , Eric C. Peterson
发明人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Christian L Belady , Lisa Heid Pallotti , Paul T. Artman , Eric C. Peterson
IPC分类号： H05K103
CPC分类号： H05K1/0231 , H05K1/0262 , H05K1/113 , H05K2201/09309 , H05K2201/0979 , H05K2201/10636 , Y02P70/611
摘要： A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.
摘要翻译：本文公开了包括多个电路板的电路。电路的实施例可以包括第一和第二印刷电路板。第一印刷电路板可包括第一和第二导电平面。第一导电平面具有第一形状，第二导电平面具有第二形状，其中第一形状基本上类似于第二形状。第一导电平面位于第二导电平面附近，其中第一导电平面平行于第二导电平面并与第二导电平面对准。第二印刷电路板连接到第一印刷电路板。

10. 发明授权

US06285550B1 Sub-cooled processor and companion voltage regulator 失效
标题翻译：次冷处理器和配套电压调节器
公开(公告)号：US06285550B1
公开(公告)日：2001-09-04
申请号：US09523454
申请日：2000-03-10
申请人： Christian L Belady
发明人： Christian L Belady
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A compact sub cooling method and apparatus arranged for simultaneously sub cooling both a processor and it companion voltage regulator for enhanced performance. A preferred embodiment of the invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation. In a preferred embodiment, a circuit board arrangement includes a processor requiring at least one bias voltage, and further includes a companion voltage regulator for providing the bias voltage. The voltage regulator is arranged sufficiently proximate to the processor, so as to limit inductance of electrical coupling therebetween. In a preferred embodiment, a piggy-back design is utilized, wherein the voltage regulator is stacked on top of the processor. Furthermore, a sub cooling module is utilized to simultaneously sub cool both the processor and the voltage regulator below ambient temperature, thereby potentially enhancing the performance of both components. In a preferred embodiment, an evaporator module is sandwiched between the voltage regulator and processor, and the evaporator module interoperates with a compressor and condenser to accomplish sub cooling of the voltage regulator and processor components.
摘要翻译：一种紧凑的子冷却方法和装置，其被设置用于同时对处理器及其配套电压调节器进行二次冷却，以提高性能。本发明的优选实施例提供了用于高速操作的靠近处理器的电压调节器和存储器的有利布置。在优选实施例中，电路板装置包括需要至少一个偏置电压的处理器，并且还包括用于提供偏置电压的配套电压调节器。电压调节器被布置成足够靠近处理器，以便限制它们之间的电耦合的电感。在优选实施例中，利用背负式设计，其中电压调节器堆叠在处理器的顶部。此外，使用副冷却模块来同时将处理器和电压调节器二者同时降温到低于环境温度，从而潜在地增强两个部件的性能。在优选实施例中，蒸发器模块夹在调压器和处理器之间，并且蒸发器模块与压缩机和冷凝器互操作以完成电压调节器和处理器部件的次冷。

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