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1. 发明授权

US07345885B2 Heat spreader with multiple stacked printed circuit boards 失效
标题翻译：具有多层叠印刷电路板的散热器
公开(公告)号：US07345885B2
公开(公告)日：2008-03-18
申请号：US11023213
申请日：2004-12-22
申请人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
发明人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译：具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。散热器和第二PCB基本上围绕其中的第一PCB。

2. 发明授权

US07475175B2 Multi-processor module 失效
标题翻译：多处理器模块
公开(公告)号：US07475175B2
公开(公告)日：2009-01-06
申请号：US10800837
申请日：2004-03-15
申请人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
发明人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
IPC分类号： H01L23/34 , H01L23/12 , H05K7/20 , G06F13/00
CPC分类号： G06F15/0216 , G06F15/7864
摘要： An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.
摘要翻译：一种装置包括多个逻辑上独立的处理器，系统总线以及与多个处理器通信的高速缓存控制和总线桥接器件，使得高速缓存控制和总线桥接器件被逻辑地插入在处理器和系统总线之间，以及其中所述处理器和高速缓存控制和总线桥接器件以模块形式被布置，使得所述设备是用于标准单处理器模块的插入式替换。

3. 发明授权

US07289328B2 Multi-chip module with power system and pass-thru holes 有权
标题翻译：带电源系统和通孔的多芯片模块
公开(公告)号：US07289328B2
公开(公告)日：2007-10-30
申请号：US11021500
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K7/20436 , H05K1/0204 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
摘要翻译：实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。第二部分具有动力系统和散热装置。散热装置具有多个延伸部，电力系统具有多个通过孔。当多个延伸部延伸穿过电力系统的多个通孔并且通过设置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。

4. 发明授权

US07072185B1 Electronic module for system board with pass-thru holes 有权
标题翻译：带通孔的系统板电子模块
公开(公告)号：US07072185B1
公开(公告)日：2006-07-04
申请号：US11021527
申请日：2004-12-21
申请人： Christian L. Belady , Gary W. Williams , Shaun L Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
发明人： Christian L. Belady , Gary W. Williams , Shaun L Harris , Steven A. Belson , Eric C. Peterson , Stuart C. Haden
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/189 , G06F1/20 , H01L23/3677 , H01L2924/0002 , H05K1/0204 , H05K1/0263 , H05K1/144 , H05K3/0061 , H05K2201/045 , H05K2201/064 , H05K2201/09054 , H05K2201/10189 , H05K2201/1056 , H05K2201/10689 , H05K2203/1572 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.
摘要翻译：实施例包括用于具有至少一个通过孔的系统板的电子模块的装置，方法和系统。可连接到具有通孔的系统板的示例性电子模块包括耦合到系统板的一侧的第一部分。第一部分具有多个处理器的印刷电路板（PCB）。电子模块的第二部分耦合到系统板的第二相对侧。第二部分具有电耦合到第一部分的电力系统板。第二部分还包括延伸穿过系统板的通孔的散热装置。

5. 发明授权

US06818835B2 Processor and power supply circuit 有权
标题翻译：处理器和电源电路
公开(公告)号：US06818835B2
公开(公告)日：2004-11-16
申请号：US10420572
申请日：2003-04-22
申请人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Christian L Belady , Lisa Heid Pallotti , Paul T. Artman , Eric C. Peterson
发明人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Christian L Belady , Lisa Heid Pallotti , Paul T. Artman , Eric C. Peterson
IPC分类号： H05K103
CPC分类号： H05K1/0231 , H05K1/0262 , H05K1/113 , H05K2201/09309 , H05K2201/0979 , H05K2201/10636 , Y02P70/611
摘要： A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.
摘要翻译：本文公开了包括多个电路板的电路。电路的实施例可以包括第一和第二印刷电路板。第一印刷电路板可包括第一和第二导电平面。第一导电平面具有第一形状，第二导电平面具有第二形状，其中第一形状基本上类似于第二形状。第一导电平面位于第二导电平面附近，其中第一导电平面平行于第二导电平面并与第二导电平面对准。第二印刷电路板连接到第一印刷电路板。

6. 发明授权

US06825651B2 Test method for characterizing currents associated with powered components in an electronic system 有权
标题翻译：用于表征电子系统中与动力部件相关的电流的测试方法
公开(公告)号：US06825651B2
公开(公告)日：2004-11-30
申请号：US10121356
申请日：2002-04-12
申请人： Christian L. Belady , Stuart C. Haden , Paul A. Wirtzberger
发明人： Christian L. Belady , Stuart C. Haden , Paul A. Wirtzberger
IPC分类号： G01R114
CPC分类号： G01R15/181 , G01R19/0092 , G01R31/2851 , H05K1/0268
摘要： A test method characterizes current behavior of power components (e.g., semiconductor packages) within an electronic system. One or more electrically conductive loops are formed with a first printed circuit board of the electronic system; these loops surround, at least in part, one or more electrical vias of the first printed circuit board. One or more power components connect to the vias to obtain power therethrough. Current characteristics are measured from one or more vias to assess transient and steady-state currents of components within the system. Power dissipation may be determined from the current. The loops may be formed within tracks of internal layers of the first printed circuit board, or a second printed circuit board may form the tracks.
摘要翻译：测试方法表征电子系统内的功率部件（例如半导体封装）的电流特性。一个或多个导电环形成有电子系统的第一印刷电路板; 这些环至少部分地围绕第一印刷电路板的一个或多个电气通孔。一个或多个电源组件连接到通孔以通过其通电。从一个或多个通孔测量电流特性，以评估系统内组件的瞬态和稳态电流。功耗可以从电流确定。环可以形成在第一印刷电路板的内层的轨道内，或者第二印刷电路板可以形成轨道。

7. 发明授权

US06596948B1 Processor and power supply circuit 失效
标题翻译：处理器和电源电路
公开(公告)号：US06596948B1
公开(公告)日：2003-07-22
申请号：US09560794
申请日：2000-04-28
申请人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Lisa Heid Pallotti
发明人： Stuart C. Haden , Shaun L. Harris , Michael C. Day , Lisa Heid Pallotti
IPC分类号： H01R1204
CPC分类号： H05K1/0231 , H05K1/0262 , H05K1/113 , H05K2201/09309 , H05K2201/0979 , H05K2201/10636 , Y02P70/611
摘要： A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to components on the printed circuit board by way of parallel and split power planes. The parallel and split power planes reduce inductance and increase capacitance associated therewith. The reduced inductance reduces voltage variations caused by load transient currents. Capacitors are electrically connected to the power planes by way of multiple vias to further reduce inductance.
摘要翻译：高性能处理器组件电连接到电源，以便最小化与向处理器组件供电的电压变化相关联。处理器组件制造在多层印刷电路板上。电源通过并联和分离电源平面提供给印刷电路板上的组件。并联和分离电源平面减小电感并增加与其相关联的电容。减小的电感降低了由负载瞬态电流引起的电压变化。电容器通过多个通孔电连接到电源层，以进一步降低电感。

8. 发明申请

US20080094106A1 Apparatus for configuring I/O signal levels of interfacing logic circuits 有权
标题翻译：用于配置接口逻辑电路的I / O信号电平的装置
公开(公告)号：US20080094106A1
公开(公告)日：2008-04-24
申请号：US11583322
申请日：2006-10-19
申请人： David Glen Edwards , Brian Matthew Johnson , Mark A. Shaw , Stuart C. Haden
发明人： David Glen Edwards , Brian Matthew Johnson , Mark A. Shaw , Stuart C. Haden
IPC分类号： H03K19/0175
CPC分类号： H03K19/017581
摘要： Apparatus for configuring input/output signal levels of interfacing logic circuits operating at different voltage levels comprises: a logic circuit for operating at a first voltage level; a bank of input/output gates coupled to the logic circuit for interfacing input/output signals at a second voltage level, different from the first voltage level, to the logic circuit, the bank of gates including a port for setting the operational voltage level thereof; and a control circuit coupled to the port and governed by a control signal to configure the operational voltage level of the bank of gates to render the logic circuit and the interfacing input/output signals voltage level compatible.
摘要翻译：用于配置以不同电压电平工作的接口逻辑电路的输入/输出信号电平的装置包括：用于在第一电压电平下操作的逻辑电路; 耦合到所述逻辑电路的用于将不同于所述第一电压电平的第二电压电平的输入/输出信号与所述逻辑电路接口的一组输入/输出门，所述一组门包括用于设置其操作电压电平的端口 ; 以及控制电路，其耦合到端口并由控制信号控制以配置栅极组的操作电压电平以使逻辑电路和接口输入/输出信号电压电平相容。

9. 发明申请

US20090267648A1 Apparatus for configuring I/O signal levels of interfacing logic circuits 有权
公开(公告)号：US20090267648A1
公开(公告)日：2009-10-29
申请号：US12458204
申请日：2009-07-02
申请人： David Glen Edwards , Brian Matthew Johnson , Mark A. Shaw , Stuart C. Haden
发明人： David Glen Edwards , Brian Matthew Johnson , Mark A. Shaw , Stuart C. Haden
IPC分类号： H03K19/0175
CPC分类号： H03K19/017581
摘要： Apparatus for configuring input/output signal levels of interfacing logic circuits operating at different voltage levels comprises: a logic circuit for operating at a first voltage level; a bank of input/output gates coupled to the logic circuit for interfacing input/output signals at a second voltage level, different from the first voltage level, to the logic circuit, the bank of gates including a port for setting the operational voltage level thereof; and a control circuit coupled to the port and governed by a control signal to configure the operational voltage level of the bank of gates to render the logic circuit and the interfacing input/output signals voltage level compatible.

10. 发明授权

US07230468B2 Systems and methods for providing distributed control signal redundancy among electronic circuits 失效
标题翻译：在电子电路中提供分布式控制信号冗余的系统和方法
公开(公告)号：US07230468B2
公开(公告)日：2007-06-12
申请号：US10797776
申请日：2004-03-10
申请人： Brad Underwood , Stuart C. Haden
发明人： Brad Underwood , Stuart C. Haden
IPC分类号： H03K3/13
CPC分类号： G06F1/06 , G06F11/1604 , G06F11/20
摘要： In one embodiment, a distributed redundant control signal distribution system comprises a first control signal source co-located with a first set of control signal controlled circuit elements, at least one second control signal source co-located with a second set of control signal controlled circuit elements, at least one controller for providing control signals from the first control signal source to control both the first and second sets of controlled circuit elements, the controller operable for substituting signals from the second control signal source for signals from the first signal control source if the signals from the first control signal source become unavailable to either the first or second circuit elements.
摘要翻译：在一个实施例中，分布式冗余控制信号分配系统包括与第一组控制信号控制电路元件共同定位的第一控制信号源，与第二组控制信号控制电路共同定位的至少一个第二控制信号源元件，至少一个控制器，用于提供来自第一控制信号源的控制信号以控制第一和第二组受控电路元件，所述控制器可操作用于将来自第二控制信号源的信号用于来自第一信号控制源的信号，如果来自第一控制信号源的信号对第一或第二电路元件都不可用。

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