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1. 发明公开

US20240381577A1 HEAT-DISSIPATING SHEET AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20240381577A1
公开(公告)日：2024-11-14
申请号：US18691045
申请日：2022-09-14
申请人： SHIN-ETSU POLYMER CO., LTD.
发明人： Kazuya NAKADA
IPC分类号： H05K7/20 , B29D7/01 , B29K19/00 , B29K83/00 , B29K105/16 , B29K507/04
CPC分类号： H05K7/2039 , B29D7/01 , B29K2019/00 , B29K2083/005 , B29K2105/16 , B29K2507/04 , B29K2995/0013 , B29K2995/0051
摘要： There is provided a heat-dissipating sheet that can achieve low hardness and high thermal conductivity, and a method for manufacturing the same. The present invention relates to a heat-dissipating sheet and a method for manufacturing the same. The heat-dissipating sheet includes a sheet-shaped rubbery elastic body, and an elongated thermally conductive filler, which has higher thermal conductivity than the rubbery elastic body and is embedded in the rubbery elastic body oriented obliquely with respect to a thickness direction thereof. The rubbery elastic body includes at least one hole that is oriented in parallel to the thickness direction of the rubbery elastic body or obliquely with respect to the thickness direction thereof. The thermally conductive filler has both end portions respectively exposed on surfaces of the rubbery elastic body.

2. 发明授权

US12141005B2 Intelligent adaptable fins for cooling datacenter devices 有权
公开(公告)号：US12141005B2
公开(公告)日：2024-11-12
申请号：US17606952
申请日：2020-08-24
申请人： Nvidia Corporation
发明人： Xiaozhuo Cai , Shuanghu Yan , Dinghai Yi , Hao Zhu , Yonghua Fu
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/206 , H05K7/2039 , H05K7/20836
摘要： A cooling system for a datacenter device is disclosed. Fins are provided between a first plate and a second plate to dissipate a first amount of heat to an environment in a first configuration of the fins. The first plate is movable relative to the second plate to expose a surface area of the fins to the environment in a second configuration of the fins.

3. 发明公开

US20240357731A1 INTERFERENCE SHIELDING IN COMPACT ELECTRONIC DEVICES 审中-公开
公开(公告)号：US20240357731A1
公开(公告)日：2024-10-24
申请号：US18302152
申请日：2023-04-18
申请人： PLUME DESIGN, INC.
发明人： Miroslav SAMARDZIJA , Ming-Tsung SU , Yun-Ping HUANG , Chun-Hung LIU , Yu-Han LIU , Liem Hieu Dinh VO
IPC分类号： H05K1/02 , H05K7/20 , H05K9/00
CPC分类号： H05K1/0216 , H05K7/2039 , H05K9/0024
摘要： Disclosed is a system and/or apparatus for a specifically configured and/or adapted electronic device that can provide interference shielding. The disclosed system and apparatus can be embodied with various combinations of components to effectuate improved thermal resistance while reducing noise within the device and/or among components of the device. The specifically configured components of the device can have specifically configured constitutions which can effectuate the thermal and noise limiters enabled by the disclosed system/apparatus.

4. 发明公开

US20240349454A1 COOLING DEVICE FOR VIRTUAL REALITY HEADSETS 审中-公开
公开(公告)号：US20240349454A1
公开(公告)日：2024-10-17
申请号：US18134471
申请日：2023-04-13
申请人： Jie Gui
发明人： Jie Gui
IPC分类号： H05K7/20 , G02B27/01 , G06F1/20
CPC分类号： H05K7/2039 , G02B27/0176 , G06F1/203 , H05K7/20218 , G06F2200/201
摘要： A liquid-filled cushion-shaped cooling device designed for virtual reality headsets is disclosed in this patent. The device is designed to lay around the area where the user's facial and virtual reality headset come in contact. The material of the cooling device uses good thermal conductive materials, such as PVC, silicon, etc. and a low-temperature liquid with large heat absorb capacity in the cushion such as gel, ice, water etc. to keep the contact area cool and refreshing while using virtual reality headset which emits heat generated from its own various components. The main cause of heat emission is mainly because the virtual reality device needs to seal the user's face or eyes into a mini space with the virtual reality headset lens in order to achieve an immersive experience, therefore causing poor ventilation in that area and discomfort in long-term contact between the device and facial area. The heat emission of the user's face also leads to more sultriness in that space. The liquid-filled cushion-shaped cooling device aims to address these issues by providing a comfortable and cool environment for the user while using virtual reality headsets. The cushion-shaped cooling device is easy to use and can be easily attached to any virtual reality headset.

5. 发明公开

US20240341062A1 TWO-PHASE LIQUID COOLING SYSTEM, TWO-PHASE LIQUID COOLING CABINET, AND METHOD FOR LIQUID COOLING OF ELECTRONIC DEVICES 审中-公开
公开(公告)号：US20240341062A1
公开(公告)日：2024-10-10
申请号：US18229197
申请日：2023-08-02
申请人： Fulian Precision Electronics (Tianjin) Co., LTD.
发明人： SUNG TSANG , TSUNG-LIN LIU , YU-CHIA TING
IPC分类号： H05K7/20
CPC分类号： H05K7/20327 , H05K7/2039 , H05K7/20818
摘要： A two-phase liquid cooling system for cooling electronic devices includes a housing configured for accommodating the electronic devices, a cooling loop connected to the housing, and an impedance device connected to the cooling loop. The cooling loop includes a supply manifold, a return manifold, and multiple cooling branches connected in parallel between the supply manifold and the return manifold, each cooling branch is configured for transferring cooling liquid to cool one electronic device. The impedance device increases impedance in each of the multiple cooling branches to reduce difference in impedance between each cooling branch and balances the pressure drop in each cooling branch, and thus balancing the cooling liquid flow rate in each cooling branch. A two-phase liquid cooling cabinet and method for liquid cooling of multiple electronic devices with different thermal loads are also disclosed.

6. 发明授权

US12111113B2 Heat transfer component reinforcement structure 有权
公开(公告)号：US12111113B2
公开(公告)日：2024-10-08
申请号：US16666426
申请日：2019-10-29
申请人： ASIA VITAL COMPONENTS CO., LTD.
发明人： Sheng-Huang Lin , Yuan-Yi Lin
IPC分类号： F28D15/04 , H05K7/20
CPC分类号： F28D15/04 , H05K7/20218 , H05K7/20336 , H05K7/2039
摘要： A heat transfer component reinforcement structure includes a main body. The main body has a pair of first lateral sides and a pair of second lateral sides and a reinforcement member. The reinforcement member is correspondingly externally connected with the main body in at least one manner selected from the group consisting of that the reinforcement members are engaged, latched and connected with the first lateral sides and the second lateral sides of the main body and the reinforcement members are engaged, latched and connected with the junctions between the first and second lateral sides in four corners.

7. 发明公开

US20240334654A1 Removable Adapter For An Upgradable Electronic Control Unit 审中-公开
公开(公告)号：US20240334654A1
公开(公告)日：2024-10-03
申请号：US18619307
申请日：2024-03-28
申请人： Aptiv Technologies AG
发明人： Lukasz Barus , Michal Przyjemski , Maciej Tyniec
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/2039 , H05K7/1402
摘要： A removable adapter for a housing of an upgradable electronic control unit. The adapter includes a body. The body includes a top surface and a base surface. The base surface is configured to contact the housing. The top surface includes one or more pedestals configured for contacting one or more electronic components of a printed circuit board.

8. 发明授权

US12108554B2 Fixing structure of electronic component and in-vehicle charger 有权
公开(公告)号：US12108554B2
公开(公告)日：2024-10-01
申请号：US17898961
申请日：2022-08-30
申请人： YAZAKI CORPORATION
发明人： Chiaki Chida , Kentaro Imoto
IPC分类号： H05K7/12 , H05K7/20
CPC分类号： H05K7/12 , H05K7/2039
摘要： A fixing structure of an electronic component includes a fixing member configured to fix an electronic component while pressing the electronic component against a wall surface of a housing in a pressing direction; and a fastened portion which is provided at a position away from the wall surface of the housing and to which the fixing member is fastened and fixed. The fixing member includes a fixing portion that is fastened and fixed to the fastened portion, a pressing portion that extends from the fixing portion toward the electronic component and is configured to press the electronic component against the wall surface in the pressing direction, and an engaging portion which is provided at the fixing portion. The fastened portion includes an engaged portion that is engaged with the engaging portion, and is configured to limit movement of the fixing portion in a direction opposite to the pressing direction.

9. 发明授权

US12103294B2 Graphene based heat sink and method for manufacturing the heat sink 有权
公开(公告)号：US12103294B2
公开(公告)日：2024-10-01
申请号：US17524871
申请日：2021-11-12
申请人： SHT Smart High-Tech AB
发明人： Johan Liu , Nan Wang
IPC分类号： B32B9/00 , B32B5/16 , B32B7/027 , B32B7/12 , B32B9/04 , C01B32/194 , F28F3/02 , F28F21/02 , H05K7/20 , B32B37/12 , B32B37/24 , B32B38/00 , B32B38/10 , B82Y30/00 , B82Y40/00
CPC分类号： B32B9/007 , B32B5/16 , B32B7/027 , B32B7/12 , B32B9/04 , C01B32/194 , F28F3/02 , F28F21/02 , H05K7/2039 , B32B2037/1253 , B32B37/24 , B32B38/004 , B32B38/10 , B32B2255/205 , B32B2255/26 , B32B2264/108 , B32B2307/302 , B32B2313/04 , B32B2319/00 , B32B2333/00 , B32B2363/00 , B32B2375/00 , B32B2379/08 , B32B2457/00 , B82Y30/00 , B82Y40/00 , Y10T156/1062 , Y10T156/108
摘要： Heat sink and method of manufacturing a graphene based heat sink, the method comprising: providing a first and second graphene film; arranging a layer of nanoparticles on a surface of the first and second graphene film to improve an adhesion strength between the graphene films; attaching the second graphene film to the first graphene film by means of an adhesive and the layer of nanoparticles; forming a laminated graphene film comprising a number of graphene film layers by repeating the steps, wherein the laminated graphene film is formed to have an anisotropic thermal conductivity; assembling a plurality of laminated graphene films by applying pressure and heat to cure the adhesive to form a graphene block; and removing selected portions of the graphene block to form a heat sink comprising fins extending from a base plate of the heat sink.

10. 发明公开

US20240288777A1 OPTICAL SYSTEM, LITHOGRAPHY APPARATUS AND METHOD 审中-公开
公开(公告)号：US20240288777A1
公开(公告)日：2024-08-29
申请号：US18655501
申请日：2024-05-06
申请人： Carl Zeiss SMT GmbH
发明人： Stefan Krone , Kai Kunze , Sven Urban , Philipp Torres Da Silva
IPC分类号： G03F7/00 , G02B26/08 , H05K7/20
CPC分类号： G03F7/70233 , G02B26/0816 , G03F7/70033 , G03F7/70833 , G03F7/70841 , G03F7/70983 , G03F7/70991 , H05K7/2039
摘要： A lithography optical system comprises: actuatable individual mirrors; a vacuum-tight housing; and an electronics arrangement integrated in the vacuum-tight housing and configured for individual actuation of each individual mirror. The electronics arrangement has a plurality of electronics modules releasably installed in the vacuum-tight housing and which each have a plurality of interconnected electronic and/or electrical components. A specific electronic module has a PCB, on which the electronic and/or electrical components of the specific electronics module are arranged. The PCB is arranged on a frame of the specific electronics module. The frame has a fastening section to releasably install the specific electronics module in the vacuum-tight housing and/or to connect the specific electronics module to a further electronics module of the electronics arrangement. When installed, the fastening section of the specific electronics module is in contact with a corresponding fastening section of the vacuum-tight housing and/or of the further electronics module.

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