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1. 发明申请

US20050130437A1 Dry film remove pre-filter system 审中-公开
标题翻译：干膜去除预过滤系统
公开(公告)号：US20050130437A1
公开(公告)日：2005-06-16
申请号：US10736948
申请日：2003-12-16
申请人： Chih-Min Tseng , Chien-Hsun Peng , Szu-Yao Wang , Chun-Yen Lo
发明人： Chih-Min Tseng , Chien-Hsun Peng , Szu-Yao Wang , Chun-Yen Lo
IPC分类号： C11D7/34 , C11D11/00 , H01L21/00 , H01L21/302 , H01L21/311 , H01L21/461
CPC分类号： H01L21/31111 , C11D7/34 , C11D11/0047 , H01L21/31133 , H01L21/67086
摘要： In accordance with the objectives of the invention a new method and apparatus is provided for the removal of by-products resulting from a dry-film removal process. The conventional method and apparatus for controlling a dry-film removal process is extended by the addition of a Dry-Film Remove Pre-Filter System, which significantly enhances the capability of filtering a dry-film removal solution.
摘要翻译：根据本发明的目的，提供了一种新的方法和装置，用于除去由干膜去除过程产生的副产物。通过添加干膜去除预过滤系统来延长用于控制干膜去除过程的常规方法和装置，其显着增强了干膜去除溶液的过滤能力。

2. 发明授权

US06620722B2 Bumping process 有权
公开(公告)号：US06620722B2
公开(公告)日：2003-09-16
申请号：US09886834
申请日：2001-06-21
申请人： Wen-Chang Kuo , Szu-Yao Wang
发明人： Wen-Chang Kuo , Szu-Yao Wang
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/13099 , H01L2924/01005 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H05K3/3457 , H05K2203/0285 , H05K2203/0338 , H01L2224/05624 , H01L2924/00014 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/05124
摘要： A process of forming a solder bump on a semiconductor device including vibrating a solder reservoir carrier in a vertical direction while pressure and heat are applied to the solder reservoir. An engagement surface of the solder reservoir is contacted with an engagement surface of the semiconductor device and the semiconductor device is vibrated in a horizontal direction to reflow a portion of the solder reservoir on the engagement surface. The solder reservoir carrier and the semiconductor device are moved away from each other so that additional solder is deposited and a solder column is grown on the semiconductor device. The solder column is cut off from the solder reservoir by vibrating the solder reservoir carrier in a horizontal direction to form a solder bump on the semiconductor device.

3. 发明授权

US06691738B2 Filler for airtight container 失效
标题翻译：填料用于密封容器
公开(公告)号：US06691738B2
公开(公告)日：2004-02-17
申请号：US09996335
申请日：2001-11-21
申请人： Wen-Chang Kuo , Szu-Yao Wang , Wen-Hsiang Tseng
发明人： Wen-Chang Kuo , Szu-Yao Wang , Wen-Hsiang Tseng
IPC分类号： G05D700
CPC分类号： B67D7/0288 , B67D7/344 , Y10T137/86332
摘要： The present invention is directed to a filler assembly for dispensing liquid to and from a container capable of storing an indicated liquid. The filler assembly has a portable part and a stationary part cooperating to provide a sealed dispensing means for communicating an indicated liquid from an indicated liquid source to a container and for safely communicating the indicated liquid from the container to another location. The portable part and the stationary part are adapted to sealably mate together and further provide means for preventing misassembly of the two parts. The portable part provides dispensing means capable of communicating the liquid from the stationary part to a remote location. The stationary part is adapted to further sealably mate and communicate with a container capable of storing an indicated liquid.
摘要翻译：本发明涉及一种用于将液体分配到能够存储指定液体的容器中的填充器组件。填充器组件具有便携式部件和固定部件，其配合以提供密封的分配装置，用于将指示的液体从指示的液体源传送到容器并且用于将指示的液体从容器安全地传递到另一位置。便携式部件和固定部件适于密封地配合在一起，并且还提供用于防止两个部件的错误组装的装置。便携式部件提供能够将液体从静止部分传送到远程位置的分配装置。固定部分适于进一步密封地配合并与能够储存指定液体的容器连通。

4. 发明授权

US06598314B1 Method of drying wafers 有权
标题翻译：干燥晶圆的方法
公开(公告)号：US06598314B1
公开(公告)日：2003-07-29
申请号：US10036887
申请日：2002-01-04
申请人： Wen-Chang Kuo , Szu-Yao Wang
发明人： Wen-Chang Kuo , Szu-Yao Wang
IPC分类号： F26B334
CPC分类号： H01L21/67034
摘要： A new method and apparatus is provided for the cleaning and drying of a wafer. An IPA vapor is created using an ultrasonic nebulizer that can be operated at a relatively low temperature. The water and the IPA that is used by the cleaning and drying process will be heated and evaporated using energy supplied by a microwave source of energy.
摘要翻译：提供了一种用于清洁和干燥晶片的新方法和装置。使用可在较低温度下操作的超声波雾化器产生IPA蒸气。用清洁和干燥过程使用的水和IPA将通过由微波能源提供的能量进行加热和蒸发。

5. 发明授权

US06918397B2 Flush system for dry film photoresist remover 失效
标题翻译：用于干膜光刻胶去除剂的冲洗系统
公开(公告)号：US06918397B2
公开(公告)日：2005-07-19
申请号：US10127086
申请日：2002-04-22
申请人： Ta-Min Lin , Szu-Yao Wang , Chia-Fu Lin , Kai-Ming Ching , Wen-Hsiang Tseng
发明人： Ta-Min Lin , Szu-Yao Wang , Chia-Fu Lin , Kai-Ming Ching , Wen-Hsiang Tseng
IPC分类号： B01D36/02 , B01D37/00 , B08B7/04 , B08B9/093
CPC分类号： B01D36/02 , B01D37/00
摘要： A flush system comprising a network of conduits, valves and screens that can be interposed between the process container and solvent re-claim tank components of a dry film photoresist (DFR) remover system, for example, that is used in the processing and packaging of integrated circuit chips. By operation of the valves in the flush system, DFR particles can be removed from the DFR remover system in order to prevent or minimize particle clogging of a particle filter in the DFR remover system. The screens in the flush system can be periodically cleaned by reverse flow of solvent or by operation of a nitrogen and DI (deionized) water purge system.
摘要翻译：一种冲洗系统，其包括可以介于干膜光致抗蚀剂（DFR）去除剂系统的处理容器和溶剂重新溶液罐组分之间的管道网络，阀门和筛网，例如用于加工和包装集成电路芯片。通过操作冲洗系统中的阀，可以从DFR去除器系统中去除DFR颗粒，以防止或最小化DFR去除器系统中的颗粒过滤器的颗粒堵塞。冲洗系统中的筛网可以通过溶剂的反向流动或通过操作氮气和DI（去离子水）清洗系统来定期清洁。

6. 发明授权

US06712260B1 Bump reflow method by inert gas plasma 失效
标题翻译：通过惰性气体等离子体进行爆破回流
公开(公告)号：US06712260B1
公开(公告)日：2004-03-30
申请号：US10124998
申请日：2002-04-18
申请人： Wen-Chang Kuo , Chia-Fu Lin , Sheng-Liang Pan , Szu-Yao Wang , Cheng-Yu Chu
发明人： Wen-Chang Kuo , Chia-Fu Lin , Sheng-Liang Pan , Szu-Yao Wang , Cheng-Yu Chu
IPC分类号： B23K3102
CPC分类号： B23K35/38 , B23K1/0016 , B23K1/206 , B23K2101/40 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H05K3/3457 , H05K2203/0315 , H05K2203/043 , H05K2203/095 , H01L2224/05099
摘要： A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side walls and/or the initial bump top surfaces. The organic residue is simultaneously removed from the initial bump side walls and top surfaces with the forming a surface oxide layer over the initial bump side walls and top surfaces. The surface oxide layer is stripped from the initial bump top surfaces and an upper portion of the initial bump side walls to form partially exposed bumps. The partially exposed bumps are heat treated to melt the partially exposed bumps to form the reflowed bumps.
摘要翻译：一种形成回流凸块的方法，包括以下顺序步骤。提供晶片。在晶片上形成一系列间隔开的初始凸块。初始凸起在初始凸起侧壁和/或初始凸起顶表面上具有暴露的侧壁和顶表面以及有机残余物。有机残余物同时从初始凸块侧壁和顶表面去除，在初始凸块侧壁和顶表面上形成表面氧化层。表面氧化物层从初始凸起顶表面和初始凸块侧壁的上部剥离以形成部分暴露的凸块。部分暴露的凸起被热处理以熔化部分暴露的凸块以形成回流的凸块。

7. 发明授权

US06360756B1 Wafer rinse tank for metal etching and method for using 有权
标题翻译：用于金属蚀刻的晶圆冲洗槽和使用方法
公开(公告)号：US06360756B1
公开(公告)日：2002-03-26
申请号：US09325307
申请日：1999-06-03
申请人： Chie-Chi Chen , Tzu-Yang Chung , Szu-Yao Wang , Sheng-Liang Pan
发明人： Chie-Chi Chen , Tzu-Yang Chung , Szu-Yao Wang , Sheng-Liang Pan
IPC分类号： B08B704
CPC分类号： H01L21/67057 , B08B3/102 , Y10S134/902
摘要： A rinse tank for rinsing electronic substrates after a chemical process and a method for utilizing such rinse tank are provided. In the rinse tank, devices for performing a quick dump rinse; for performing a cascade overflow rinse and for feeding an inert gas bubbling are provided in the cavity of a single rinse tank. By utilizing the present invention novel rinse tank, the processing problems frequently observed in conventional rinse tanks where two rinse tanks are required for the quick dump rinse and for the cascade overflow rinse, such as particle re-deposition and a large floor space area requirement are eliminated. Furthermore, the wafer rinse process after a metal etching process can be accomplished in a total process time that is at least 2˜3 minutes shorter than that required by using conventional rinse tanks.
摘要翻译：提供了一种用于在化学过程之后冲洗电子基板的冲洗槽和用于使用这种冲洗槽的方法。在冲洗槽中，进行快速冲洗冲洗的装置; 在单个冲洗槽的空腔中设置用于进行级联溢流冲洗和用于进料惰性气体鼓泡的装置。通过利用本发明的新型漂洗槽，在常规冲洗槽中经常观察到的处理问题，其中需要两个漂洗槽用于快速冲洗冲洗和级联溢流冲洗，例如颗粒再沉积和大的占地空间面积要求，消除了此外，在金属蚀刻工艺之后的晶片冲洗过程可以在比使用常规冲洗槽所需的总处理时间短至少2〜3分钟的时间内完成。

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