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1. 发明授权

US06941811B2 Method and apparatus for detecting wafer flaw 有权
公开(公告)号：US06941811B2
公开(公告)日：2005-09-13
申请号：US10633414
申请日：2003-08-04
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Yuan Lo
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Yuan Lo
IPC分类号： G01N29/07 , G01N29/22 , G01N29/44 , G01N29/10
CPC分类号： G01N29/223 , G01N29/07 , G01N29/44 , G01N2291/0237 , G01N2291/044 , G01N2291/2697 , G01N2291/2698
摘要： The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.

2. 发明授权

US07252099B2 Wafer cleaning apparatus with multiple wash-heads 有权
标题翻译：具有多个洗头的晶圆清洗设备
公开(公告)号：US07252099B2
公开(公告)日：2007-08-07
申请号：US10655224
申请日：2003-09-05
申请人： Chih-Kun Chen , Yao-Hsiung Kung
发明人： Chih-Kun Chen , Yao-Hsiung Kung
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , B08B3/02 , Y10S134/902
摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.
摘要翻译：在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。旋转模块也包括在晶片清洁装置中。旋转模块的顶侧与驱动装置连接。此外，旋转模块包括多个洗头和至少一个喷嘴。这里的洗头的底部与晶片的表面接触。通过使用驱动装置，可以完全驱动旋转模块。此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。流体从喷嘴和助剂喷射通过流体管清洁晶片。单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

3. 发明申请

US20050103121A1 DEVICE USED FOR DETECTING CLAMPING FORCE OF PROCESSED OBJECT AND METHOD THEREOF 有权
标题翻译：用于检测加工对象夹紧力的装置及其方法
公开(公告)号：US20050103121A1
公开(公告)日：2005-05-19
申请号：US10705939
申请日：2003-11-13
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
IPC分类号： G01L5/00 , H01L21/00 , H01L21/687 , G01N3/02
CPC分类号： H01L21/67288 , G01L5/009 , H01L21/68707
摘要： A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.
摘要翻译：提出了一种用于检测加工对象的夹持力的装置及其方法。该装置包括检测单元，基础部件和设置在基础部件上的压力检测部件。具有压力检测部件的基础部件紧密地放置在枢转杆之间，使得检测单元可以检测压力检测部件的电特性的变化，以调节枢转杆之间的间隔，从而有助于调节夹紧力。

4. 发明授权

US06920796B2 Device used for detecting clamping force of processed object and method thereof 有权
标题翻译：用于检测加工对象的夹紧力的装置及其方法
公开(公告)号：US06920796B2
公开(公告)日：2005-07-26
申请号：US10705939
申请日：2003-11-13
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
IPC分类号： G01L5/00 , H01L21/00 , H01L21/687 , G01N3/02
CPC分类号： H01L21/67288 , G01L5/009 , H01L21/68707
摘要： A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.
摘要翻译：提出了一种用于检测加工对象的夹持力的装置及其方法。该装置包括检测单元，基础部件和设置在基础部件上的压力检测部件。具有压力检测部件的基础部件紧密地放置在枢转杆之间，使得检测单元可以检测压力检测部件的电特性的变化，以调节枢转杆之间的间隔，从而有助于调节夹紧力。

5. 发明申请

US20050028594A1 Method and apparatus for detecting wafer flaw 有权
标题翻译：检测晶圆缺陷的方法和装置
公开(公告)号：US20050028594A1
公开(公告)日：2005-02-10
申请号：US10633414
申请日：2003-08-04
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Lo
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Lo
IPC分类号： G01N29/07 , G01N29/22 , G01N29/44 , G01N29/04
CPC分类号： G01N29/223 , G01N29/07 , G01N29/44 , G01N2291/0237 , G01N2291/044 , G01N2291/2697 , G01N2291/2698
摘要： The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.
摘要翻译：本发明提供了一种用于检测晶片中的缺陷的装置。该装置具有用于保持位于其上的晶片的检测平台，位于检测平台上方的横杆式超声波检测装置，用于发射和接收由晶片反射的超声波; 以及用于处理反射的超声波并传送到监视器的微处理器。

6. 发明申请

US20050051200A1 Wafer cleaning apparatus with multiple wash-heads 有权
标题翻译：具有多个洗头的晶圆清洗设备
公开(公告)号：US20050051200A1
公开(公告)日：2005-03-10
申请号：US10655224
申请日：2003-09-05
申请人： Chih-Kun Chen , Yao-Hsiung Kung
发明人： Chih-Kun Chen , Yao-Hsiung Kung
IPC分类号： B08B3/02 , H01L21/00
CPC分类号： H01L21/67051 , B08B3/02 , Y10S134/902
摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.
摘要翻译：在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。旋转模块也包括在晶片清洁装置中。旋转模块的顶侧与驱动装置连接。此外，旋转模块包括多个洗头和至少一个喷嘴。这里的洗头的底部与晶片的表面接触。通过使用驱动装置，可以完全驱动旋转模块。此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。流体从喷嘴和助剂喷射通过流体管清洁晶片。单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

7. 发明授权

US06834547B2 Humidity sensor and fabrication method thereof 有权
公开(公告)号：US06834547B2
公开(公告)日：2004-12-28
申请号：US10440934
申请日：2003-05-19
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Hsin-Chuan Tsai
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Hsin-Chuan Tsai
IPC分类号： G01N100
CPC分类号： G01N27/121
摘要： A humidity sensor and fabrication method thereof. In the humidity sensor of the present invention, two comb-type electrodes with a plurality of teeth are disposed on a semiconductor substrate. A SiO2 sensing film is disposed between the teeth of the two comb-type electrodes on the substrate. A predetermined voltage is applied between the two comb-type electrodes, a leakage current between the two electrodes is detected, and the humidity in the environment is measured according thereto.

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