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1. 发明申请

US20050028594A1 Method and apparatus for detecting wafer flaw 有权
标题翻译：检测晶圆缺陷的方法和装置
公开(公告)号：US20050028594A1
公开(公告)日：2005-02-10
申请号：US10633414
申请日：2003-08-04
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Lo
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Lo
IPC分类号： G01N29/07 , G01N29/22 , G01N29/44 , G01N29/04
CPC分类号： G01N29/223 , G01N29/07 , G01N29/44 , G01N2291/0237 , G01N2291/044 , G01N2291/2697 , G01N2291/2698
摘要： The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.
摘要翻译：本发明提供了一种用于检测晶片中的缺陷的装置。该装置具有用于保持位于其上的晶片的检测平台，位于检测平台上方的横杆式超声波检测装置，用于发射和接收由晶片反射的超声波; 以及用于处理反射的超声波并传送到监视器的微处理器。

2. 发明授权

US07252099B2 Wafer cleaning apparatus with multiple wash-heads 有权
标题翻译：具有多个洗头的晶圆清洗设备
公开(公告)号：US07252099B2
公开(公告)日：2007-08-07
申请号：US10655224
申请日：2003-09-05
申请人： Chih-Kun Chen , Yao-Hsiung Kung
发明人： Chih-Kun Chen , Yao-Hsiung Kung
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , B08B3/02 , Y10S134/902
摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.
摘要翻译：在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。旋转模块也包括在晶片清洁装置中。旋转模块的顶侧与驱动装置连接。此外，旋转模块包括多个洗头和至少一个喷嘴。这里的洗头的底部与晶片的表面接触。通过使用驱动装置，可以完全驱动旋转模块。此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。流体从喷嘴和助剂喷射通过流体管清洁晶片。单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

3. 发明申请

US20050103121A1 DEVICE USED FOR DETECTING CLAMPING FORCE OF PROCESSED OBJECT AND METHOD THEREOF 有权
标题翻译：用于检测加工对象夹紧力的装置及其方法
公开(公告)号：US20050103121A1
公开(公告)日：2005-05-19
申请号：US10705939
申请日：2003-11-13
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
IPC分类号： G01L5/00 , H01L21/00 , H01L21/687 , G01N3/02
CPC分类号： H01L21/67288 , G01L5/009 , H01L21/68707
摘要： A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.
摘要翻译：提出了一种用于检测加工对象的夹持力的装置及其方法。该装置包括检测单元，基础部件和设置在基础部件上的压力检测部件。具有压力检测部件的基础部件紧密地放置在枢转杆之间，使得检测单元可以检测压力检测部件的电特性的变化，以调节枢转杆之间的间隔，从而有助于调节夹紧力。

4. 发明授权

US06920796B2 Device used for detecting clamping force of processed object and method thereof 有权
标题翻译：用于检测加工对象的夹紧力的装置及其方法
公开(公告)号：US06920796B2
公开(公告)日：2005-07-26
申请号：US10705939
申请日：2003-11-13
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Shan-Chang Wang , Jiun-Bo Wang
IPC分类号： G01L5/00 , H01L21/00 , H01L21/687 , G01N3/02
CPC分类号： H01L21/67288 , G01L5/009 , H01L21/68707
摘要： A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.
摘要翻译：提出了一种用于检测加工对象的夹持力的装置及其方法。该装置包括检测单元，基础部件和设置在基础部件上的压力检测部件。具有压力检测部件的基础部件紧密地放置在枢转杆之间，使得检测单元可以检测压力检测部件的电特性的变化，以调节枢转杆之间的间隔，从而有助于调节夹紧力。

5. 发明授权

US06941811B2 Method and apparatus for detecting wafer flaw 有权
公开(公告)号：US06941811B2
公开(公告)日：2005-09-13
申请号：US10633414
申请日：2003-08-04
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Yuan Lo
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Tun Yuan Lo
IPC分类号： G01N29/07 , G01N29/22 , G01N29/44 , G01N29/10
CPC分类号： G01N29/223 , G01N29/07 , G01N29/44 , G01N2291/0237 , G01N2291/044 , G01N2291/2697 , G01N2291/2698
摘要： The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.

6. 发明申请

US20050051200A1 Wafer cleaning apparatus with multiple wash-heads 有权
标题翻译：具有多个洗头的晶圆清洗设备
公开(公告)号：US20050051200A1
公开(公告)日：2005-03-10
申请号：US10655224
申请日：2003-09-05
申请人： Chih-Kun Chen , Yao-Hsiung Kung
发明人： Chih-Kun Chen , Yao-Hsiung Kung
IPC分类号： B08B3/02 , H01L21/00
CPC分类号： H01L21/67051 , B08B3/02 , Y10S134/902
摘要： A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.
摘要翻译：在晶片清洗之后，在化学和机械抛光工艺中应用具有多个洗头的晶片清洁装置。晶片清洗装置包括支撑基座，该支撑基座包括驱动装置和至少一个流体管。旋转模块也包括在晶片清洁装置中。旋转模块的顶侧与驱动装置连接。此外，旋转模块包括多个洗头和至少一个喷嘴。这里的洗头的底部与晶片的表面接触。通过使用驱动装置，可以完全驱动旋转模块。此外，多个洗头可以沿着用于清洁晶片的清洁路径单独旋转。流体从喷嘴和助剂喷射通过流体管清洁晶片。单晶片清洗头的现有技术在晶片清洗过程中容易改造清洁死角。

7. 发明授权

US06834547B2 Humidity sensor and fabrication method thereof 有权
公开(公告)号：US06834547B2
公开(公告)日：2004-12-28
申请号：US10440934
申请日：2003-05-19
申请人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Hsin-Chuan Tsai
发明人： Chih-Kun Chen , Yao-Hsiung Kung , Chung-Min Lin , Hsin-Chuan Tsai
IPC分类号： G01N100
CPC分类号： G01N27/121
摘要： A humidity sensor and fabrication method thereof. In the humidity sensor of the present invention, two comb-type electrodes with a plurality of teeth are disposed on a semiconductor substrate. A SiO2 sensing film is disposed between the teeth of the two comb-type electrodes on the substrate. A predetermined voltage is applied between the two comb-type electrodes, a leakage current between the two electrodes is detected, and the humidity in the environment is measured according thereto.

8. 发明授权

US06923709B2 Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring 有权
标题翻译：化学机械抛光装置具有用于测量导向环的测量装置
公开(公告)号：US06923709B2
公开(公告)日：2005-08-02
申请号：US10410558
申请日：2003-04-07
申请人： Chih-Kun Chen , Shan-Chang Wang , Ching-Huang Chen
发明人： Chih-Kun Chen , Shan-Chang Wang , Ching-Huang Chen
IPC分类号： B24B49/00
CPC分类号： B24B37/32 , B24B49/00
摘要： A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.
摘要翻译：一种具有用于测量导向环的测量装置的CMP（化学机械抛光）装置。提供了抛光台。晶片装载/卸载装置位于抛光台的第一侧。测量装置位于抛光台的第二侧。一种具有与第一侧面相反的第一横向和第二横向的载体，其中所述第一横向面向所述抛光台，所述晶片装载/卸载装置或所述测量装置。引导环布置在载体的第一侧面上。传送装置设置在载体的第二侧面上并连接到载体上，其中传送装置用于将载体移动到抛光台，晶片装载/卸载装置或测量装置上。测量装置用于自动并立即测量导环上刻痕的严重程度。

9. 发明授权

US06743081B2 In-line oscillating device 有权
标题翻译：在线振荡装置
公开(公告)号：US06743081B2
公开(公告)日：2004-06-01
申请号：US10034328
申请日：2001-12-28
申请人： Chih-Kun Chen
发明人： Chih-Kun Chen
IPC分类号： B24B100
CPC分类号： B24B37/04 , B24B1/04 , B24B57/02 , Y10S451/91
摘要： An in-line oscillating device is essentially composed of an oscillating tank, an oscillating pipe, and an oscillating generator. The oscillating pipe is set in the oscillating tank and connects with a slurry pipe. The oscillating generator for generating ultrasonic waves is mounted on the oscillating tank. Furthermore, the oscillating tank is filled with a medium to transmit the ultrasonic waves generated by the oscillating generator to the oscillating pipe. The in-line oscillating device is suitable to be mounted on any location of the slurry pipe where oscillation is needed.
摘要翻译：在线振荡装置主要由振荡槽，振荡管和振荡发生器组成。振荡管设置在振荡槽中，与浆管连接。用于产生超声波的振荡发生器安装在振荡槽上。此外，振荡槽填充有介质，以将由振荡发生器产生的超声波传输到振荡管。在线振荡装置适合安装在需要振荡的浆料管道的任何位置。

10. 发明授权

US06671576B1 Wafer carrier 有权
标题翻译：晶圆载体
公开(公告)号：US06671576B1
公开(公告)日：2003-12-30
申请号：US10391717
申请日：2003-03-19
申请人： Chih-Kun Chen
发明人： Chih-Kun Chen
IPC分类号： G06F700
CPC分类号： H01L21/67259 , H01L21/681 , Y10S414/137 , Y10S414/141
摘要： A wafer carrier device capable of detecting positioning precision of a supporting plate thereof. In the present invention, a supporting plate connected to a mechanical arm has three reflectors and a positioning window. A detection device has a vertical signal generator to output a vertical alignment signal to a vertical signal receiver, and three level detectors to each output a second signal to the corresponding reflector respectively and receive a corresponding reflected level detection signal from the corresponding reflector. A determining unit determines whether the supporting plate is aligned with the vertical signal receiver according to the vertical alignment signal. The determining unit outputs a position rectification signal when the supporting plate is not aligned with the vertical signal receiver. A driver moves the supporting plate by mechanical arm to align the vertical signal receiver according to the position rectification signal.
摘要翻译：一种能够检测其支撑板的定位精度的晶片载体装置。在本发明中，连接到机械臂的支撑板具有三个反射器和定位窗。检测装置具有垂直信号发生器，用于向垂直信号接收器输出垂直对准信号，并且三个电平检测器分别向对应的反射器输出第二信号，并从相应的反射器接收相应的反射电平检测信号。确定单元根据垂直对准信号确定支撑板是否与垂直信号接收器对准。当支撑板不与垂直信号接收器对准时，确定单元输出位置整流信号。驱动器通过机械臂移动支撑板，以根据位置整流信号对准垂直信号接收器。

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