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1. 发明授权

US07849847B2 Drainage apparatus for a singulation system 有权
标题翻译：排水系统的排水装置
公开(公告)号：US07849847B2
公开(公告)日：2010-12-14
申请号：US11853326
申请日：2007-09-11
申请人： Chi Wah Cheng , Lap Kei Eric Chow , Chi Hang Leung
发明人： Chi Wah Cheng , Lap Kei Eric Chow , Chi Hang Leung
IPC分类号： B28D1/02
CPC分类号： B28D5/0076 , Y10T83/242 , Y10T83/647
摘要： A singulation system for a workpiece has a carrier for mounting the workpiece during singulation and a receptacle for collecting debris formed. A driving mechanism, which is operative to move the carrier and the workpiece, is at least partially covered by a bellows. A bellows protecting cover extending over the bellows is coupled between the carrier and the receptacle and is operative to guide debris from the carrier along its longitudinal length towards the receptacle. The bellows protecting cover further comprises side walls extending along opposite sides of its longitudinal length to prevent debris from falling off its sides.
摘要翻译：用于工件的分割系统具有用于在分割期间安装工件的载体和用于收集形成的碎屑的容器。用于移动载体和工件的驱动机构至少部分地被波纹管覆盖。延伸在波纹管上方的波纹管保护盖联接在托架和插座之间，并且可操作以沿着其纵向长度朝向容器引导载体的碎屑。波纹管保护盖还包括沿其纵向长度的相对侧延伸的侧壁，以防止碎屑从其侧面脱落。

2. 发明授权

US08167523B2 Singulation handler comprising vision system 有权
标题翻译：分割处理器包括视觉系统
公开(公告)号：US08167523B2
公开(公告)日：2012-05-01
申请号：US11777000
申请日：2007-07-12
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： H01L21/304
CPC分类号： H01L21/681 , H01L21/67092 , Y10T83/04
摘要： Singulation handler is provided which comprises a loading zone where a carrier mechanism receives and holds an electronic component and a singulation zone where the electronic component held by the carrier mechanism is singulated. A loader that is movable along an axis is operative to place the electronic component onto the carrier mechanism when it is situated in the loading zone and a vision system that is movable along substantially the same axis as the loader is operative to obtain at least one image of the electronic component showing alignment information so that the electronic component can be properly aligned during singulation.
摘要翻译：提供了一种分包处理器，其包括载体区域，其中载体机构接收并保持电子部件和由载体机构保持的电子部件被单个化的单位区域。沿着轴线可移动的装载机可操作以将电子部件放置在载体机构上，当它位于装载区域中时，以及视觉系统可沿与加载器基本上相同的轴线移动以获得至少一个图像的电子部件显示对准信息，使得电子部件可以在分割期间适当地对准。

3. 发明授权

US08167524B2 Handling system for inspecting and sorting electronic components 有权
标题翻译：电子元件检查和分类处理系统
公开(公告)号：US08167524B2
公开(公告)日：2012-05-01
申请号：US11941372
申请日：2007-11-16
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
IPC分类号： B65H9/08
CPC分类号： H01L21/67271
摘要： A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
摘要翻译：提供一种半导体封装处理系统，包括用于接收和保持单个半导体封装的封装保持器，以及第一检查装置，其布置和构造成在包装夹持器被保持时检查包装的第一表面。卸载装置从包装夹持器接收包装并将包装输送到卸载器，并且第二检查装置被布置和配置成在通过卸载保持的状态下检查与第一表面相对的包装的第二表面设备。

4. 发明授权

US07495759B1 Damage and wear detection for rotary cutting blades 有权
标题翻译：旋转切割刀片的损伤和磨损检测
公开(公告)号：US07495759B1
公开(公告)日：2009-02-24
申请号：US11877099
申请日：2007-10-23
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： G01N21/00 , B24B49/00
CPC分类号： B23D59/001 , B24B27/06 , B24B49/12 , G01N2021/151
摘要： A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.
摘要翻译：提供一种检测用于单个基板的旋转切割刀片的磨损和损坏的方法，包括以下步骤：提供传感器以在刀片的边缘定位第一检测位置，并且在传感器基本保持在基座上时与刀片进行切割用于检测对刀片的损坏的第一检测位置。随后，通过沿着刀片的方向驱动传感器来确定刀片的磨损程度，以便由于切割而使刀片的直径减小，从而将刀片的边缘处的第二检测位置定位。此后，当用刀片进行切割时，传感器基本上保持在第二检测位置，用于检测刀片的损坏。

5. 发明授权

US08702017B2 Nozzle device employing high frequency wave energy 有权
标题翻译：采用高频波能的喷嘴装置
公开(公告)号：US08702017B2
公开(公告)日：2014-04-22
申请号：US12335675
申请日：2008-12-16
申请人： Lap Kei Eric Chow , Hoi Shuen Tang , Hon Keung Lai , Chi Wah Cheng
发明人： Lap Kei Eric Chow , Hoi Shuen Tang , Hon Keung Lai , Chi Wah Cheng
IPC分类号： B05B1/08
CPC分类号： F04F7/00
摘要： A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.
摘要翻译：包括喷嘴室的喷嘴装置包括位于喷嘴室的第一侧处的流体入口，该流体入口可操作以沿喷射方向将流体引入喷嘴室，并且在喷嘴室的第二侧具有流体出口，从喷嘴室排出流体。高频波发生器也位于喷嘴室中，其定向和操作以在基本上平行于喷射方向的方向上产生高频波，从而向喷嘴室中的流体施加高频能量。

6. 发明申请

US20050162151A1 Device transfer mechanism for a test handler 有权
公开(公告)号：US20050162151A1
公开(公告)日：2005-07-28
申请号：US10763503
申请日：2004-01-22
申请人： Ching Man Stanley Tsui , Chak Tong Albert Sze , Pei Wei Tsai , Lap Kei Eric Chow
发明人： Ching Man Stanley Tsui , Chak Tong Albert Sze , Pei Wei Tsai , Lap Kei Eric Chow
IPC分类号： G01R1/00 , G01R31/26 , G01R31/28
CPC分类号： G01R31/2893
摘要： The invention provides a mechanism for a test handler using for electrical testing of electronic devices. The devices are placed on a platform configured to move semiconductor devices from an onloading position to an offloading position along a predetermined path. A transfer arm with a plurality of transfer heads connected to it is located adjacent the path. The transfer heads are configured to pick up and transfer semiconductor devices from the platform to a testing position for testing, and thereafter to transfer the semiconductor devices from the testing position to the platform for offloading.

7. 发明授权

US06967475B2 Device transfer mechanism for a test handler 有权
标题翻译：测试处理程序的设备传输机制
公开(公告)号：US06967475B2
公开(公告)日：2005-11-22
申请号：US10763503
申请日：2004-01-22
申请人： Ching Man Stanley Tsui , Chak Tong Albert Sze , Pei Wei Tsai , Lap Kei Eric Chow
发明人： Ching Man Stanley Tsui , Chak Tong Albert Sze , Pei Wei Tsai , Lap Kei Eric Chow
IPC分类号： G01R1/00 , G01R31/26 , G01R31/28
CPC分类号： G01R31/2893
摘要： The invention provides a mechanism for a test handler using for electrical testing of electronic devices. The devices are placed on a platform configured to move semiconductor devices from an onloading position to an offloading position along a predetermined path. A transfer arm with a plurality of transfer heads connected to it is located adjacent the path. The transfer heads are configured to pick up and transfer semiconductor devices from the platform to a testing position for testing, and thereafter to transfer the semiconductor devices from the testing position to the platform for offloading.
摘要翻译：本发明提供了一种用于电子设备的电气测试的测试处理器的机构。这些设备被放置在平台上，该平台被配置成沿着预定路径将半导体器件从加载位置移动到卸载位置。具有与其连接的多个传送头的传送臂位于路径附近。传送头被配置成将半导体器件从平台拾取和传送到用于测试的测试位置，然后将半导体器件从测试位置传送到平台用于卸载。

8. 发明授权

US06806725B2 Method and apparatus for processing an array of packaged semiconductor devices 有权
标题翻译：用于处理封装的半导体器件阵列的方法和装置
公开(公告)号：US06806725B2
公开(公告)日：2004-10-19
申请号：US10083177
申请日：2002-02-25
申请人： Ching Man Stanley Tsui , M. Bilan Curito, Jr. , Lap Kei Eric Chow
发明人： Ching Man Stanley Tsui , M. Bilan Curito, Jr. , Lap Kei Eric Chow
IPC分类号： G01R3102
CPC分类号： A61B17/29 , A61B17/0218 , A61B18/1445 , A61B2017/2929 , H01L21/67092 , H01L21/67282 , H01L21/681 , H01L21/78 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.
摘要翻译：本发明提供一种用于处理电子元件阵列的方法和装置。它涉及提供安装装置，以将未卷曲的部件安装到安装装置上，将部件分离成物理分离它们，以及在分离的电子部件安装在安装装置上时进行缺陷测试，并且不从其中移除。

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