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1. 发明授权

US08941245B2 Semiconductor package including semiconductor chip with through opening 有权
标题翻译：半导体封装包括半导体芯片通过开口
公开(公告)号：US08941245B2
公开(公告)日：2015-01-27
申请号：US13533473
申请日：2012-06-26
申请人： Chang-Cheol Lee , Hyun-Jun Kim , In-Young Lee , Ki-Kwon Jeong
发明人： Chang-Cheol Lee , Hyun-Jun Kim , In-Young Lee , Ki-Kwon Jeong
IPC分类号： H01L23/52 , H01L23/13 , H01L25/065 , H01L23/498 , H01L21/56
CPC分类号： H01L23/13 , H01L21/565 , H01L23/49816 , H01L25/0657 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/1815
摘要： A semiconductor package comprises a substrate having a first opening formed therethrough, a first semiconductor chip stacked on the substrate in a flip chip manner and having a second opening formed therethrough, a second semiconductor chip stacked on the first semiconductor chip in a flip chip manner and having a third opening formed therethrough, and a molding material covering the first semiconductor chip and the second semiconductor chip and filling up a space between the substrate and the first semiconductor chip, a space between the first semiconductor chip and the second semiconductor chip, and filling each of the first opening, the second opening, and the third opening.
摘要翻译：半导体封装包括具有通过其形成的第一开口的衬底，以倒装芯片方式堆叠在衬底上并具有穿过其中的第二开口的第一半导体芯片，以倒装芯片方式堆叠在第一半导体芯片上的第二半导体芯片，以及具有通过其形成的第三开口，以及覆盖所述第一半导体芯片和所述第二半导体芯片并填充所述基板和所述第一半导体芯片之间的空间的模塑材料，所述第一半导体芯片和所述第二半导体芯片之间的空间，以及填充第一开口，第二开口和第三开口中的每一个。

2. 发明授权

US07135353B2 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby 有权
标题翻译：用于堆叠半导体芯片的装置，使用该半导体芯片的半导体封装的制造方法以及由此制造的半导体封装
公开(公告)号：US07135353B2
公开(公告)日：2006-11-14
申请号：US10916094
申请日：2004-08-10
申请人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
发明人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

3. 发明申请

US20050054140A1 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby 有权
标题翻译：用于堆叠半导体芯片的装置，使用该半导体芯片的半导体封装的制造方法以及由此制造的半导体封装
公开(公告)号：US20050054140A1
公开(公告)日：2005-03-10
申请号：US10916094
申请日：2004-08-10
申请人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
发明人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
IPC分类号： H01L21/67 , H01L21/00 , H01L21/52 , H01L21/68 , H01L21/98 , H01L25/065 , H01L25/07 , H01L25/18 , H01L21/66 , G01R31/26 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/34
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

4. 发明授权

US07374966B2 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby 有权
标题翻译：用于堆叠半导体芯片的装置，使用该半导体芯片的半导体封装的制造方法以及由此制造的半导体封装
公开(公告)号：US07374966B2
公开(公告)日：2008-05-20
申请号：US11534924
申请日：2006-09-25
申请人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
发明人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

5. 发明授权

US07096914B2 Apparatus for bonding a chip using an insulating adhesive tape 有权
标题翻译：使用绝缘胶带粘接芯片的装置
公开(公告)号：US07096914B2
公开(公告)日：2006-08-29
申请号：US10629937
申请日：2003-07-29
申请人： Dong-Kuk Kim , Min-Il Kim , Sang-Yeop Lee , Chang-Cheol Lee
发明人： Dong-Kuk Kim , Min-Il Kim , Sang-Yeop Lee , Chang-Cheol Lee
IPC分类号： H01L21/44
CPC分类号： H01L24/27 , H01L24/29 , H01L24/83 , H01L25/50 , H01L2224/2919 , H01L2224/48091 , H01L2224/73265 , H01L2224/7565 , H01L2224/83101 , H01L2224/83192 , H01L2224/8385 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T29/41 , Y10T29/5317 , Y10T29/53187 , Y10T29/53261 , Y10T156/1075 , Y10T156/12 , Y10T156/1317 , Y10T156/1339 , Y10T156/1744 , Y10T156/1751 , Y10T156/1768 , H01L2924/00014 , H01L2924/00
摘要： In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.
摘要翻译：在本发明的实施例中，一种装置被配置为堆叠具有相同或相似尺寸的多个半导体芯片。该装置包括：提供绝缘胶带的带提供单元，用于将绝缘胶带附接到第一芯片的电极焊盘之间的区域的带附接装置和用于将第二芯片附接到绝缘胶带的芯片附接装置。

6. 发明授权

US07298032B2 Semiconductor multi-chip package and fabrication method 有权
标题翻译：半导体多芯片封装及制造方法
公开(公告)号：US07298032B2
公开(公告)日：2007-11-20
申请号：US10787679
申请日：2004-02-25
申请人： Dong-Kuk Kim , Chang-Cheol Lee
发明人： Dong-Kuk Kim , Chang-Cheol Lee
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05554 , H01L2224/05644 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48464 , H01L2224/48471 , H01L2224/48599 , H01L2224/48799 , H01L2224/4899 , H01L2224/49175 , H01L2224/73265 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3862 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package comprises a package substrate having bond fingers disposed thereon. A first chip have center bonding pads formed on a substantially center portion thereof. The first chip is disposed on the package substrate. Insulating support structures are formed on the first chip located outward of the bonding pads. A bonding wire is connected between one of the bond fingers and at least one of the center bonding pads. A second chip has is disposed over the bonding wire and overlying the insulating support structures.
摘要翻译：多芯片封装包括其上设置有键合指状的封装基板。第一芯片具有形成在其基本中心部分上的中心焊盘。第一芯片设置在封装基板上。绝缘支撑结构形成在位于接合焊盘外侧的第一芯片上。接合线连接在一个接合指状物和至少一个中心接合焊盘之间。第二芯片设置在接合线上并覆盖绝缘支撑结构。

7. 发明申请

US20060105477A1 Device and method for manufacturing wafer-level package 审中-公开
标题翻译：晶圆级封装制造装置及方法
公开(公告)号：US20060105477A1
公开(公告)日：2006-05-18
申请号：US11280838
申请日：2005-11-15
申请人： Suk-Kun Lim , Chae-Hun Im , Min-Ill Kim , Chang-Cheol Lee
发明人： Suk-Kun Lim , Chae-Hun Im , Min-Ill Kim , Chang-Cheol Lee
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： H01L21/67271 , G01R31/2893 , H01L21/67144
摘要： In an embodiment of the invention, a device for manufacturing a wafer-level package includes a wafer sawing unit, a sorting unit, a pickup unit, and a placing unit. The wafer sawing unit cuts a wafer into wafer-level packages. The sorting unit performs a sorting process on the wafer-level packages to judge whether each of the wafer-level packages is normal or not. The pickup unit picks up the normal wafer-level packages. The placing unit stores the normal wafer-level packages in a storage case. The sawing process, the sorting process, and the placing process for the wafer-level package can be automatically performed within one device, thus a processing time reduction, a processing accuracy increase, and manpower reduction are achieved compared with the case where the processes are performed manually.
摘要翻译：在本发明的一个实施例中，用于制造晶片级封装的器件包括晶片锯切单元，分类单元，拾取单元和放置单元。晶圆锯切单元将晶片切割成晶片级封装。分选单元对晶片级封装执行分类处理，以判断晶片级封装是否正常。拾取单元拾取正常晶圆级封装。放置单元将正常的晶片级封装存储在存储盒中。可以在一个设备内自动执行晶片级封装的锯切过程，分选过程和放置过程，从而与处理的情况相比，实现了处理时间缩短，处理精度提高和人力减少手动执行。

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