专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07374966B2 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby 有权
标题翻译：用于堆叠半导体芯片的装置，使用该半导体芯片的半导体封装的制造方法以及由此制造的半导体封装
公开(公告)号：US07374966B2
公开(公告)日：2008-05-20
申请号：US11534924
申请日：2006-09-25
申请人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
发明人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

2. 发明授权

US07135353B2 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby 有权
标题翻译：用于堆叠半导体芯片的装置，使用该半导体芯片的半导体封装的制造方法以及由此制造的半导体封装
公开(公告)号：US07135353B2
公开(公告)日：2006-11-14
申请号：US10916094
申请日：2004-08-10
申请人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
发明人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

3. 发明申请

US20050054140A1 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby 有权
标题翻译：用于堆叠半导体芯片的装置，使用该半导体芯片的半导体封装的制造方法以及由此制造的半导体封装
公开(公告)号：US20050054140A1
公开(公告)日：2005-03-10
申请号：US10916094
申请日：2004-08-10
申请人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
发明人： Min-Ill Kim , Dong-Kuk Kim , Chang-Cheol Lee , Tae-Hoe Hwang , Jae-Young Hong
IPC分类号： H01L21/67 , H01L21/00 , H01L21/52 , H01L21/68 , H01L21/98 , H01L25/065 , H01L25/07 , H01L25/18 , H01L21/66 , G01R31/26 , H01L21/44 , H01L21/48 , H01L21/50 , H01L23/34
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

4. 发明申请

US20060105477A1 Device and method for manufacturing wafer-level package 审中-公开
标题翻译：晶圆级封装制造装置及方法
公开(公告)号：US20060105477A1
公开(公告)日：2006-05-18
申请号：US11280838
申请日：2005-11-15
申请人： Suk-Kun Lim , Chae-Hun Im , Min-Ill Kim , Chang-Cheol Lee
发明人： Suk-Kun Lim , Chae-Hun Im , Min-Ill Kim , Chang-Cheol Lee
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： H01L21/67271 , G01R31/2893 , H01L21/67144
摘要： In an embodiment of the invention, a device for manufacturing a wafer-level package includes a wafer sawing unit, a sorting unit, a pickup unit, and a placing unit. The wafer sawing unit cuts a wafer into wafer-level packages. The sorting unit performs a sorting process on the wafer-level packages to judge whether each of the wafer-level packages is normal or not. The pickup unit picks up the normal wafer-level packages. The placing unit stores the normal wafer-level packages in a storage case. The sawing process, the sorting process, and the placing process for the wafer-level package can be automatically performed within one device, thus a processing time reduction, a processing accuracy increase, and manpower reduction are achieved compared with the case where the processes are performed manually.
摘要翻译：在本发明的一个实施例中，用于制造晶片级封装的器件包括晶片锯切单元，分类单元，拾取单元和放置单元。晶圆锯切单元将晶片切割成晶片级封装。分选单元对晶片级封装执行分类处理，以判断晶片级封装是否正常。拾取单元拾取正常晶圆级封装。放置单元将正常的晶片级封装存储在存储盒中。可以在一个设备内自动执行晶片级封装的锯切过程，分选过程和放置过程，从而与处理的情况相比，实现了处理时间缩短，处理精度提高和人力减少手动执行。

5. 发明授权

US08796597B2 In-line package apparatuses and methods 有权
标题翻译：在线包装设备和方法
公开(公告)号：US08796597B2
公开(公告)日：2014-08-05
申请号：US12272867
申请日：2008-11-18
申请人： Min-Ill Kim , Jong-Gi Lee , Kwang-Yong Lee , Ki-Kwon Jeong
发明人： Min-Ill Kim , Jong-Gi Lee , Kwang-Yong Lee , Ki-Kwon Jeong
IPC分类号： B23K1/002 , B23K1/00 , B23K5/00 , B23K20/14 , B23K37/04 , H05B6/04
CPC分类号： B23K1/0016 , B23K1/002 , B23K2101/40 , H01L24/75 , H01L24/81 , H01L2224/48091 , H01L2224/81191 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/15311 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.
摘要翻译：一种在线封装装置包括第一处理单元，输入存储单元，加热单元和输出存储单元。第一处理单元执行球连接处理或芯片安装处理。在第一处理单元中完成处理的处理对象被接收在盒中以便被垂直堆叠，并且每个具有一个或多个处理对象的多个杂志被存储在输入堆叠器中。加热单元通过感应加热方法对存储在输入堆叠器中的仓库中的处理对象进行回流处理。回收处理完成的处理对象被接收在仓库中，然后存储在输出堆垛机中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式