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1. 发明申请

US20060176466A1 Chucking system for modulating shapes of substrates 有权
公开(公告)号：US20060176466A1
公开(公告)日：2006-08-10
申请号：US11389731
申请日：2006-03-27
申请人： Byung Choi , Ronald Voisin , Sidlgata Sreenivasan , Michael Watts , Daniel Babbs , Mario Meissl , Hillman Bailey , Norman Schumaker
发明人： Byung Choi , Ronald Voisin , Sidlgata Sreenivasan , Michael Watts , Daniel Babbs , Mario Meissl , Hillman Bailey , Norman Schumaker
IPC分类号： G03B27/58
CPC分类号： G03F7/70875 , B29C33/20 , B29C43/003 , B29C43/021 , B29C43/36 , B29C43/58 , B29C2043/025 , B29C2043/3233 , B29C2043/3488 , B29C2043/5841 , B29D11/00365 , G03B27/62 , G03F7/707
摘要： The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

2. 发明申请

US20060172549A1 Method of separating a mold from a solidified layer disposed on a substrate 有权
公开(公告)号：US20060172549A1
公开(公告)日：2006-08-03
申请号：US11108208
申请日：2005-04-18
申请人： Byung-Jin Choi , Anshuman Cherala , Yeong-jun Choi , Mario Meissl , Sidlgata Sreenivasan , Norman Schumaker , Xiaoming Lu , Ian McMackin , Daniel Babbs
发明人： Byung-Jin Choi , Anshuman Cherala , Yeong-jun Choi , Mario Meissl , Sidlgata Sreenivasan , Norman Schumaker , Xiaoming Lu , Ian McMackin , Daniel Babbs
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/6875 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/6838 , Y10S977/887
摘要： The present invention is directed towards a method of separating a mold, included in a template, from a layer disposed on a substrate, the method including, inter alia, applying a separation force to the template to separate the template from the layer; and facilitating localized deformation in the substrate to reduce the separation force required to achieve separation.

3. 发明申请

US20050072757A1 Method of creating a turbulent flow of fluid between a mold and a substrate 失效
标题翻译：在模具和基材之间产生流体紊流的方法
公开(公告)号：US20050072757A1
公开(公告)日：2005-04-07
申请号：US10898034
申请日：2004-07-23
申请人： Ian McMackin , Nicholas Stacey , Daniel Babbs , Duane Voth , Michael Watts , Van Truskett , Frank Xu , Ronald Voisin , Pankaj Lad
发明人： Ian McMackin , Nicholas Stacey , Daniel Babbs , Duane Voth , Michael Watts , Van Truskett , Frank Xu , Ronald Voisin , Pankaj Lad
IPC分类号： B01D19/00 , B29C59/02 , C23F1/00 , G03F20060101 , G03F7/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , Y10S425/06 , Y10S425/815 , Y10S438/909
摘要： The present invention is directed toward a method of controlling a turbulent flow of a fluid between a substrate and a template, and more specifically, controlling a turbulent flow of a fluid between droplets disposed on a substrate and a template. To that end, the method further comprises the ingression and egression of the fluid through a first and second aperture, and in a further embodiment, a plurality of apertures, to create such a turbulent flow of the fluid.
摘要翻译：本发明涉及一种控制衬底和模板之间的流体的紊流的方法，更具体地说，控制流体在设置在衬底和模板上的液滴之间的紊流。为此，该方法还包括流体通过第一和第二孔的进入和流出，并且在另一实施例中，多个孔，以产生流体的这种湍流。

4. 发明申请

US20050072755A1 Single phase fluid imprint lithography method 有权
标题翻译：单相流体压印光刻法
公开(公告)号：US20050072755A1
公开(公告)日：2005-04-07
申请号：US10677639
申请日：2003-10-02
申请人： Ian McMackin , Nicholas Stacey , Daniel Babbs , Duane Voth , Michael Watts , Van Truskett , Frank Xu , Ronald Voisin , Pankaj Lad
发明人： Ian McMackin , Nicholas Stacey , Daniel Babbs , Duane Voth , Michael Watts , Van Truskett , Frank Xu , Ronald Voisin , Pankaj Lad
IPC分类号： B01D19/00 , B29C59/02 , C23F1/00 , G03F20060101 , G03F7/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , Y10S425/06 , Y10S425/815 , Y10S438/909
摘要： The present invention is directed toward a method for reducing pattern distortions in imprinting layers by reducing gas pockets present in a layer of viscous liquid deposited on a substrate. To that end, the method includes varying a transport of the gases disposed proximate to the viscous liquid. Specifically, the atmosphere proximate to the substrate wherein a pattern is to be recorded is saturated with gases that are either highly soluble, highly diffusive, or both with respect to the viscous liquid being deposited. Additionally, or in lieu of saturating the atmosphere, the pressure of the atmosphere may be reduced.
摘要翻译：本发明涉及通过减少存在于沉积在基底上的粘性液体层中的气穴来减少压印层中的图案失真的方法。为此，该方法包括改变靠近粘性液体设置的气体的输送。具体地，其中待记录图案的基板附近的气氛相对于被沉积的粘性液体是高度可溶的，高度扩散的或者两者都被饱和。另外，或者代替饱和气氛，可以降低气氛的压力。

5. 发明申请

US20050074512A1 System for creating a turbulent flow of fluid between a mold and a substrate 有权
标题翻译：用于在模具和基底之间产生紊流流体的系统
公开(公告)号：US20050074512A1
公开(公告)日：2005-04-07
申请号：US10898037
申请日：2004-07-23
申请人： Ian McMackin , Nicholas Stacey , Daniel Babbs , Duane Voth , Michael Watts , Van Truskett , Frank Xu , Ronald Voisin , Pankaj Lad
发明人： Ian McMackin , Nicholas Stacey , Daniel Babbs , Duane Voth , Michael Watts , Van Truskett , Frank Xu , Ronald Voisin , Pankaj Lad
IPC分类号： B01D19/00 , B29C59/02 , C23F1/00 , G03F20060101 , G03F7/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , Y10S425/06 , Y10S425/815 , Y10S438/909
摘要： The present invention is directed toward a system for introducing a flow of a fluid between a mold, disposed on a template, and a substrate, the system including, a fluid supply system; and a chuck body having a baffle and first and second apertures, the first and second apertures disposed between the baffle and the template, with the first and second apertures in fluid communication with the fluid supply system to produce a turbulent flow of the fluid between the mold and said substrate.
摘要翻译：本发明涉及一种用于在设置在模板上的模具和基板之间引入流体流的系统，该系统包括：流体供应系统; 以及具有挡板和第一和第二孔的卡盘体，所述第一和第二孔设置在挡板和模板之间，其中第一和第二孔与流体供应系统流体连通，以在流体供应系统之间产生紊流模具和所述基板。

6. 发明授权

US07019819B2 Chucking system for modulating shapes of substrates 有权
标题翻译：用于调制基板形状的卡盘系统
公开(公告)号：US07019819B2
公开(公告)日：2006-03-28
申请号：US10293224
申请日：2002-11-13
申请人： Byung J. Choi , Ronald D. Voisin , Sidlgata V. Sreenivasan , Michael P. C. Watts , Daniel Babbs , Mario J. Meissl , Hillman Bailey , Norman E. Schumaker
发明人： Byung J. Choi , Ronald D. Voisin , Sidlgata V. Sreenivasan , Michael P. C. Watts , Daniel Babbs , Mario J. Meissl , Hillman Bailey , Norman E. Schumaker
IPC分类号： G03B27/62 , G03B27/42 , G03B27/60 , H01L21/4763
CPC分类号： G03F7/70875 , B29C33/20 , B29C43/003 , B29C43/021 , B29C43/36 , B29C43/58 , B29C2043/025 , B29C2043/3233 , B29C2043/3488 , B29C2043/5841 , B29D11/00365 , G03B27/62 , G03F7/707
摘要： The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.
摘要翻译：本发明涉及一种夹持系统，用于调制基板，以便相对于其上将与基底形成图案的晶片适当地成形和定位基板。夹持系统包括具有第一和第二相对侧的卡盘体。侧面在其间延伸。第一侧包括限定第一和第二间隔开的支撑区域的第一和第二间隔开的凹部。第一支撑区域使第二支撑区域和第一和第二凹槽成像。第二支撑区域使第二凹部成像，其中身体的与第二凹部重叠的部分对于具有预定波长的辐射是透明的。第二面和侧面限定外表面。主体包括使第一和第二凹槽与外表面之一流体连通的通道。

7. 发明授权

US06982783B2 Chucking system for modulating shapes of substrates 有权
标题翻译：用于调制基板形状的卡盘系统
公开(公告)号：US06982783B2
公开(公告)日：2006-01-03
申请号：US10864591
申请日：2004-06-09
申请人： Byung J. Choi , Ronald D. Voisin , Sidlgata V. Sreenivasan , Michael P. C. Watts , Daniel Babbs , Mario J. Meissl , Hillman Bailey , Norman E. Schumaker
发明人： Byung J. Choi , Ronald D. Voisin , Sidlgata V. Sreenivasan , Michael P. C. Watts , Daniel Babbs , Mario J. Meissl , Hillman Bailey , Norman E. Schumaker
IPC分类号： G03B27/58 , G03B27/42
CPC分类号： G03F7/70875 , B29C33/20 , B29C43/003 , B29C43/021 , B29C43/36 , B29C43/58 , B29C2043/025 , B29C2043/3233 , B29C2043/3488 , B29C2043/5841 , B29D11/00365 , G03B27/62 , G03F7/707
摘要： The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.
摘要翻译：本发明涉及一种夹持系统，用于调制基板，以便相对于其上将与基底形成图案的晶片适当地成形和定位基板。

8. 发明申请

US20090129897A1 SIDE OPENING UNIFIED POD 有权
标题翻译：侧开式统一POD
公开(公告)号：US20090129897A1
公开(公告)日：2009-05-21
申请号：US12123391
申请日：2008-05-19
申请人： Daniel Babbs , William Fosnight , Robert C. May , William Weaver
发明人： Daniel Babbs , William Fosnight , Robert C. May , William Weaver
IPC分类号： H01L21/677 , H01L21/68
CPC分类号： H01L21/67766 , H01L21/67201 , H01L21/67207 , H01L21/67213 , H01L21/67225 , H01L21/67376 , H01L21/67379 , H01L21/67393 , H01L21/67742 , H01L21/67772 , H01L21/67775 , H01L21/67778 , Y10S414/14
摘要： A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal volume for holding at least one substrate for transport to the processing section, the shell being configured to allow the internal volume to be pumped down to a predetermined vacuum pressure that is different than an exterior atmosphere outside the substrate processing system, and a load port communicably connected to the processing section to isolate the processing atmosphere from the exterior atmosphere, the load port being configured to couple with the carrier to pump down the internal volume of the carrier and to communicably connect the carrier to the processing section, for loading the substrate into the processing section through the load port.
摘要翻译：一种基板处理系统，包括：处理部，其被配置为保持其中的处理气氛;载体，其具有形成内部容积的外壳，用于保持至少一个基板用于输送到所述处理部分，所述壳体被配置为允许内部体积被泵送下降到与衬底处理系统外部的外部空气不同的预定真空压力，以及负载端口，可通信地连接到处理部分，以将处理气氛与外部大气隔离，负载端口被配置为与载体耦合，泵送载体的内部体积并将载体可通信地连接到处理部分，以通过负载端口将基板装载到处理部分中。

9. 发明申请

US20060172553A1 Method of retaining a substrate to a wafer chuck 有权
标题翻译：将基板保持在晶片卡盘上的方法
公开(公告)号：US20060172553A1
公开(公告)日：2006-08-03
申请号：US11047499
申请日：2005-01-31
申请人： Byung-Jin Choi , Anshuman Cherala , Daniel Babbs
发明人： Byung-Jin Choi , Anshuman Cherala , Daniel Babbs
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/6831 , H01L21/6838 , Y10T29/4978 , Y10T29/49998
摘要： The present invention is directed towards a method of retaining a substrate to a wafer chuck. The method features accelerating a portion of the substrate toward the wafer chuck, generating a velocity of travel of the substrate toward the wafer chuck, and reducing the velocity before the substrate reaches the wafer chuck. In this manner, the force of impact of the portion with the wafer chuck is greatly reduced, which is believed to reduce the probability that the structural integrity of the substrate, and layers on the substrate and/or the wafer chuck, are damaged.
摘要翻译：本发明涉及将基板保持在晶片卡盘上的方法。该方法特征在于，将基板的一部分朝向晶片卡盘加速，产生基板朝向晶片卡盘的移动速度，并降低基板到达晶片卡盘之前的速度。以这种方式，晶片卡盘的部分的冲击力大大降低，这被认为降低了基板的结构完整性和基板和/或晶片卡盘上的层被损坏的可能性。

10. 发明授权

US06805054B1 Method, system and holder for transferring templates during imprint lithography processes 有权
标题翻译：在压印光刻过程中传输模板的方法，系统和夹持器
公开(公告)号：US06805054B1
公开(公告)日：2004-10-19
申请号：US10438224
申请日：2003-05-14
申请人： Mario J. Meissl , Byung J. Choi , Daniel Babbs , Hillman L. Bailey
发明人： Mario J. Meissl , Byung J. Choi , Daniel Babbs , Hillman L. Bailey
IPC分类号： B41L3900
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： Disclosed are a method, system and holder for transferring templates during imprint lithography processes. To that end, a method for handling a template, having a patterned mold thereon, in an imprint lithography system having a motion stage with a chucking device coupled thereto, includes providing the template into a template transfer holder. The template transfer holder includes a side coupled to the motion stage and support members extending from the side. The template is disposed within the template transfer holder so as to have the patterned mold facing the side and spaced-apart therefrom. Relative movement is created between the motion stage and an imprint head to place the template transfer holder and the imprint head in superimposition. The template is removed from the template transfer holder, and the template is suspended above the wafer chuck by the imprint head. In another embodiment, a system and a template holder are described that facilitates the method.
摘要翻译：公开了一种用于在压印光刻工艺期间传送模板的方法，系统和保持器。为此，在具有与其耦合的夹紧装置的运动平台的压印光刻系统中处理具有图案化模具的模板的方法包括将模板提供到模板转印支架中。模板转印支架包括联接到运动台的侧面和从侧面延伸的支撑构件。模板设置在模板转印保持器内，以使图案化模具面向侧面并与之分开。在运动台和压印头之间产生相对运动，以使模板转印支架和压印头叠加。模板从模板转移支架上移除，模板通过压印头悬挂在晶片卡盘的上方。在另一个实施例中，描述了便于该方法的系统和模板保持器。

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