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1. 发明授权

US06474712B1 Gripper for supporting substrate in a vertical orientation 失效
标题翻译：夹持器用于垂直方向支撑基板
公开(公告)号：US06474712B1
公开(公告)日：2002-11-05
申请号：US09559889
申请日：2000-04-26
申请人： Boris I. Govzman , Manoocher Birang , Michael Sugarman , Anwar Husain
发明人： Boris I. Govzman , Manoocher Birang , Michael Sugarman , Anwar Husain
IPC分类号： B66C100
CPC分类号： H01L21/68707 , Y10S414/141
摘要： A gripper assembly is provided which supports a substrate in a vertical orientation. The gripper assembly's end effectors contact only the edge of the substrate. In a first aspect the end effectors each comprise a first pair of opposed surfaces and an second pair of opposed surfaces, all of which simultaneously contact the substrate, holding the substrate in a clamp-type manner. In a second aspect the end effectors each comprise a lower pair of opposed surfaces which simultaneously contact the substrate, and an upper pair of opposed surfaces, larger than the thickness of the substrate, which limit the substrate from horizontal tilting. In the second aspect the end effectors can close at a first elevation where they do not contact the substrate, and can then elevate to gently contact and support the substrate in a pocket-like manner. In a third aspect one of the end effectors has two pairs of opposed surfaces which simultaneously contact the substrate, and the other end effector has two pairs of opposed surfaces which limit the substrate from horizontal tilting. In any aspect no moving parts are required to limit the substrate's vertical and horizontal movement. In a further aspect, fingers to which the end effectors are coupled, are bent so that the gripper is not positioned above the substrate.
摘要翻译：提供了一种夹持器组件，其以垂直取向支撑衬底。夹持器组件的端部执行器仅接触基板的边缘。在第一方面，端部执行器各自包括第一对相对表面和第二对相对表面，所述第二对相对表面同时接触基板，以夹紧方式保持基板。在第二方面，端部执行器各自包括同时接触基板的下一对相对表面，以及大于基板厚度的上对对相对表面，其将基板限制为水平倾斜。在第二方面，末端效应器可以在它们不接触衬底的第一高度处关闭，然后可以以袋状方式轻轻地接触和支撑衬底。在第三方面中，一个端部执行器具有两对同时接触基板的相对表面，而另一端部执行器具有两对相对的表面，这些对面限制了基板的水平倾斜。在任何方面，无需移动部件来限制基板的垂直和水平运动。在另一方面，端部执行器耦合到的手指被弯曲，使得夹持器不位于衬底上方。

2. 发明授权

US06516816B1 Spin-rinse-dryer 失效
公开(公告)号：US06516816B1
公开(公告)日：2003-02-11
申请号：US09544660
申请日：2000-04-06
申请人： Anwar Husain , Brian J. Brown , David G. Andeen , Svetlana Sherman , John M. White , Michael Sugarman , Makoto Inagawa , Manoocher Birang
发明人： Anwar Husain , Brian J. Brown , David G. Andeen , Svetlana Sherman , John M. White , Michael Sugarman , Makoto Inagawa , Manoocher Birang
IPC分类号： B08B302
CPC分类号： H01L21/67028 , Y10S134/902
摘要： An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction. A sensor adapted to facilitate desired flywheel position, an openable gripper having a remote actuator, a radiused gripper and a source of inert drying gas are also provided in individual embodiments.

3. 发明授权

US07226514B2 Spin-rinse-dryer 失效
标题翻译：旋转干燥机
公开(公告)号：US07226514B2
公开(公告)日：2007-06-05
申请号：US10309832
申请日：2002-12-04
申请人： Anwar Husain , Brian J. Brown , David G. Andeen , Svetlana Sherman , John M. White , Michael Sugarman , Makoto Inagawa , Manoocher Birang
发明人： Anwar Husain , Brian J. Brown , David G. Andeen , Svetlana Sherman , John M. White , Michael Sugarman , Makoto Inagawa , Manoocher Birang
IPC分类号： B08B3/02
CPC分类号： H01L21/67028 , Y10S134/902
摘要： An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction. A sensor adapted to facilitate desired flywheel position, an openable gripper having a remote actuator, a radiused gripper and a source of inert drying gas are also provided in individual embodiments.
摘要翻译：提供了一种创造性的垂直旋转干燥器。本发明的旋转干燥器可以具有屏蔽系统，其被定位成接收从垂直定位在旋转干燥器内的衬底移位的流体。屏蔽系统可以具有一个或多个屏蔽件，其定位成当流体冲击屏蔽时至少部分地反射流体。一个或多个屏蔽件成角度以促使其流体流动，并且优选是亲水的以防止液滴形成。优选地，屏蔽系统具有以水平和垂直交错方式定位的三个屏蔽件，使得流体从第一屏蔽件的面向基板的表面转移到相邻屏蔽件的顶部或非基板面向表面等。压力梯度可以施加在旋转干燥器的内部以产生鼓风流体沿着屏蔽系统沿所需方向行进的空气流。在各个实施例中还提供了适于促进期望的飞轮位置的传感器，具有远程致动器的可打开夹具，圆角夹持器和惰性干燥气体源。

4. 发明授权

US06520315B1 Gripper assembly 失效
标题翻译：夹爪组件
公开(公告)号：US06520315B1
公开(公告)日：2003-02-18
申请号：US09698821
申请日：2000-10-26
申请人： Michael Sugarman , Boris I. Govzman
发明人： Michael Sugarman , Boris I. Govzman
IPC分类号： B65G4724
CPC分类号： H01L21/68728 , B25J15/08 , B65G47/92 , H01L21/68707 , Y10S414/139
摘要： The invention provides a gripper assembly comprising a mounting base having a first magnet coupled thereto and having a moveable gripper coupled to the mounting base. The moveable gripper has a second magnet coupled thereto and comprises an end effector adapted to contact a wafer. The first and second magnets are adapted so that the magnetic force therebetween biases the end effector away from the mounting base. An inventive method of gripping a substrate comprises coupling a moveable gripper to a mounting base and magnetically biasing the moveable gripper in a closed position.
摘要翻译：本发明提供了一种夹持器组件，其包括安装基座，该安装基座具有耦合到其上的第一磁体并具有联接到安装基座的可移动夹具。可移动的夹持器具有耦合到其上的第二磁体并且包括适于接触晶片的端部执行器。第一和第二磁体适于使得它们之间的磁力使端部执行器偏离安装基座。夹持基底的创造性方法包括将可移动的夹持器联接到安装基座并将可移动的夹持器磁力偏置在闭合位置。

5. 发明授权

US06921494B2 Backside etching in a scrubber 失效
标题翻译：洗涤器中的背面蚀刻
公开(公告)号：US06921494B2
公开(公告)日：2005-07-26
申请号：US10456723
申请日：2003-06-06
申请人： Brian J. Brown , Madhavi Chandrachood , Radha Nayak , Fred C. Redeker , Michael Sugarman , John M. White
发明人： Brian J. Brown , Madhavi Chandrachood , Radha Nayak , Fred C. Redeker , Michael Sugarman , John M. White
IPC分类号： B08B1/04 , B08B3/02 , B08B3/08 , B08B7/04 , H01L21/00 , H01L21/304 , H01L21/306 , B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H01L21/6708 , H01L21/67075 , Y10S134/902
摘要： A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
摘要翻译：提供洗涤器装置。洗涤器装置可以蚀刻晶片的背面并且可以同时清洁晶片的前侧。洗涤器装置可以包括编程控制器，其适用于每当将蚀刻流体供应到晶片的背面时，将非蚀刻流体提供给晶片的前侧。

6. 发明授权

US06599402B2 Electro-chemical deposition cell for face-up processing of single semiconductor substrates 失效
公开(公告)号：US06599402B2
公开(公告)日：2003-07-29
申请号：US10178469
申请日：2002-06-24
申请人： Yezdi Dordi , Joe Stevens , Roy Edwards , Bob Lowrance , Michael Sugarman , Mark Denome
发明人： Yezdi Dordi , Joe Stevens , Roy Edwards , Bob Lowrance , Michael Sugarman , Mark Denome
IPC分类号： C25D1706
CPC分类号： H01L21/68721 , C25D5/20 , C25D7/123 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/08 , C25D21/00 , C25D21/18 , H01L21/67051 , H01L21/6715 , H01L21/6838 , H01L21/68742 , H01L21/68792
摘要： An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

7. 发明授权

US06290865B1 Spin-rinse-drying process for electroplated semiconductor wafers 有权
标题翻译：电镀半导体晶圆的旋转干燥工艺
公开(公告)号：US06290865B1
公开(公告)日：2001-09-18
申请号：US09201566
申请日：1998-11-30
申请人： Mark Lloyd , Ashok K. Sinha , Sergio Edelstein , Michael Sugarman
发明人： Mark Lloyd , Ashok K. Sinha , Sergio Edelstein , Michael Sugarman
IPC分类号： C23F100
CPC分类号： H01L21/02087 , H01L21/0209 , H01L21/32134 , H01L21/67051 , H01L21/6708 , Y10S438/928
摘要： The present invention removes unwanted deposited material from a substrate backside by chemically dissolving the material, while substantially preventing dissolution of the material from the substrate front side. Preferably, the dissolving process is included with a spin-rinse-dry process and uses a greater flow rate of rinsing fluid directed onto the front side compared to the flow rate of dissolving fluid directed onto a substrate backside to protect the substrate front side while the unwanted backside material is removed. The present invention includes the method of dissolving the unwanted material from the backside and edge and the associated apparatus.
摘要翻译：本发明通过化学溶解材料从衬底背面去除不想要的沉积材料，同时基本上防止材料从衬底前侧的溶解。优选地，溶解过程包括在旋转冲洗干燥过程中，并且与引导到衬底背面的溶解流体的流速相比，使用更大的冲洗流体流量，以保护衬底前侧，同时去除不需要的背面材料。本发明包括从背面和边缘以及相关联的装置中溶解不需要的材料的方法。

8. 发明申请

US20070295371A1 SINGLE WAFER DRYER AND DRYING METHODS 有权
标题翻译：单辊干燥机和干燥方法
公开(公告)号：US20070295371A1
公开(公告)日：2007-12-27
申请号：US11846400
申请日：2007-08-28
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B1/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
摘要翻译：在第一方面，提供一种适于处理晶片的模块。模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与卸货港（2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

9. 发明申请

US20060174921A1 Single wafer dryer and drying methods 审中-公开
公开(公告)号：US20060174921A1
公开(公告)日：2006-08-10
申请号：US11398058
申请日：2006-04-04
申请人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
发明人： Younes Achkire , Alexander Lerner , Boris Govzman , Boris Fishkin , Michael Sugarman , Rashid Mavleiv , Haoquan Fang , Shijian Li , Guy Shirazi , Jianshe Tang
IPC分类号： B08B3/00
CPC分类号： H01L21/67034 , B08B3/10 , H01L21/67751 , H01L21/681 , H01L21/68764 , Y10S414/139
摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

10. 发明申请

US20050268937A1 Scrubber with sonic nozzle 失效
公开(公告)号：US20050268937A1
公开(公告)日：2005-12-08
申请号：US11148915
申请日：2005-06-09
申请人： Michael Sugarman
发明人： Michael Sugarman
IPC分类号： B08B1/04 , B08B3/02 , H01L21/00 , B08B3/12
CPC分类号： H01L21/67046 , B08B1/04 , B08B3/02 , B08B2203/0288 , Y10S134/902
摘要： An apparatus for cleaning a substrate is provided. The apparatus comprises a plurality of rollers adapted to support a substrate in a vertical orientation, a scrubber brush adapted to contact a substrate supported by the plurality of rollers, and a sonic nozzle positioned at an elevation below the elevation of the scrubber brush and adapted so as to output a sonicated fluid spray that contacts a beveled edge or a major surface of the substrate such that fluid having sufficient sonic energy to harm the scrubber brush will not contact the scrubber brush.

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