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1. 发明申请

US20080067072A1 METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION 有权
标题翻译：沉积合金组合物的方法和系统
公开(公告)号：US20080067072A1
公开(公告)日：2008-03-20
申请号：US11840748
申请日：2007-08-17
申请人： Bioh Kim , Marvin Bernt , Greg Wilson , Paul McHugh
发明人： Bioh Kim , Marvin Bernt , Greg Wilson , Paul McHugh
IPC分类号： C25D5/00 , C25D17/00
CPC分类号： C25D5/02 , C25D3/56 , C25D5/18 , C25D7/123 , C25D21/10 , H01L21/2885 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05173 , H01L2224/05568 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/013 , H01L2924/0105
摘要： Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.
摘要翻译：控制电势，电流密度，搅拌和沉积速率以沉积金属合金，例如锡基焊料合金或磁性合金，在沉积的金属合金特征中的不同位置处的合金金属的重量比的变化最小。替代实施例包括形成金属合金特征的工艺，其中特征内的合金金属的重量比的变化不一定最小化，而是被控制以提供期望的变化。除了金属合金之外，替代实施例包括用于改善单个金属特征沉积的方法。

2. 发明申请

US20080041727A1 Method and system for depositing alloy composition 审中-公开
标题翻译：沉积合金组成的方法和系统
公开(公告)号：US20080041727A1
公开(公告)日：2008-02-21
申请号：US11507066
申请日：2006-08-18
申请人： Bioh Kim , Marvin Bernt , Greg Wilson , Paul R. McHugh
发明人： Bioh Kim , Marvin Bernt , Greg Wilson , Paul R. McHugh
IPC分类号： C25D5/02 , C25B9/00
CPC分类号： C25D5/02 , C25D3/56 , C25D5/18 , C25D7/123 , C25D21/10 , H01L21/2885 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05173 , H01L2224/05568 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/013 , H01L2924/0105
摘要： Electric potential, current density, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation.
摘要翻译：控制电势，电流密度和沉积速率以沉积金属合金，例如锡基焊料合金或磁性合金，在沉积的金属合金特征中的不同位置处的合金金属的重量比的变化最小。替代实施例包括形成金属合金特征的工艺，其中特征内的合金金属的重量比的变化不一定最小化，而是被控制以提供期望的变化。

3. 发明授权

US09359683B2 Method of forming metal and metal alloy features 有权
标题翻译：形成金属和金属合金特征的方法
公开(公告)号：US09359683B2
公开(公告)日：2016-06-07
申请号：US11840748
申请日：2007-08-17
申请人： Bioh Kim , Marvin Bernt , Greg Wilson , Paul R. McHugh
发明人： Bioh Kim , Marvin Bernt , Greg Wilson , Paul R. McHugh
IPC分类号： C25D5/02 , C25D5/18 , C25D3/56 , C25D21/10 , H01L23/00
CPC分类号： C25D5/02 , C25D3/56 , C25D5/18 , C25D7/123 , C25D21/10 , H01L21/2885 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05111 , H01L2224/05116 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05173 , H01L2224/05568 , H01L2224/05611 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/013 , H01L2924/0105
摘要： Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.
摘要翻译：控制电势，电流密度，搅拌和沉积速率以沉积金属合金，例如锡基焊料合金或磁性合金，在沉积的金属合金特征中的不同位置处的合金金属的重量比的变化最小。替代实施例包括形成金属合金特征的工艺，其中特征内的合金金属的重量比的变化不一定最小化，而是被控制以提供期望的变化。除了金属合金之外，替代实施例包括用于改善单个金属特征沉积的方法。

4. 发明申请

US20120052204A1 WORKPIECE WETTING AND CLEANING 审中-公开
标题翻译：工作湿润和清洁
公开(公告)号：US20120052204A1
公开(公告)日：2012-03-01
申请号：US12873002
申请日：2010-08-31
申请人： Bryan Puch , Kyle M. Hanson , Marvin Bernt , Paul R. McHugh , Gregory J. Wilson
发明人： Bryan Puch , Kyle M. Hanson , Marvin Bernt , Paul R. McHugh , Gregory J. Wilson
IPC分类号： C23C16/56
CPC分类号： H01L21/6719 , H01L21/67057 , H01L21/67126
摘要： In a workpiece processor, a head is moveable onto a bowl to form a process chamber. A workpiece can be cleaned in the processor by immersing the workpiece into a liquid bath in the bowl and then boiling the liquid. Vacuum may be applied to the chamber to reduce the pressure within the chamber, thereby reducing the boiling temperature of the liquid and allowing processing at lower temperatures. In a separate method for prewetting a workpiece, a humid gas is provided into the process chamber and condenses on the workpiece. In another separate method for wetting a workpiece, liquid water is provided into the bowl, with the workpiece above the liquid water. Water vapor is created in the process chamber by applying vacuum to the process chamber. The vapor wets the workpiece. The workpiece is then further wetted by submerging the workpiece into the liquid water.
摘要翻译：在工件处理器中，头可移动到碗上以形成处理室。工件可以通过将工件浸入碗中的液体浴中，然后煮沸液体而在处理器中进行清洁。真空可以施加到室以减小室内的压力，从而降低液体的沸腾温度并允许在较低温度下进行加工。在用于预润湿工件的单独方法中，将湿气提供到处理室中并在工件上冷凝。在用于润湿工件的另一种分开的方法中，液体水被提供到碗中，工件在液态水上方。通过对处理室施加真空，在处理室中产生水蒸汽。蒸汽润湿工件。然后通过将工件浸入液体水中来进一步润湿工件。

5. 发明申请

US20070121123A1 End point detection in workpiece processing 有权
标题翻译：工件加工中的终点检测
公开(公告)号：US20070121123A1
公开(公告)日：2007-05-31
申请号：US11288770
申请日：2005-11-28
申请人： Daniel Woodruff , Marvin Bernt
发明人： Daniel Woodruff , Marvin Bernt
IPC分类号： G01B11/28
CPC分类号： H01L21/67253 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： In a workpiece process end point detection system, light is diffused and then light intensity or color is sensed. Optical noise is greatly reduced and more accurate end point detection can be made. A light emitter and a light sensor may be located within a workpiece process chamber. A housing around the light emitter and the light sensor seals out process fluids and also diffuses light passing through. The diffused light may be optically filtered before reaching the light sensor.
摘要翻译：在工件处理终点检测系统中，光被漫射，然后感测到光强度或颜色。光学噪声大大降低，可以进行更准确的端点检测。光发射器和光传感器可以位于工件处理室内。光发射器周围的壳体和光传感器密封工艺流体，并且散射通过的光。扩散光可以在到达光传感器之前进行光学滤波。

6. 发明申请

US20080070411A1 METHODS FOR UNIFORMLY ETCHING FILMS ON A SEMICONDUCTOR WAFER 审中-公开
标题翻译：用于半导体波形上均匀蚀刻膜的方法
公开(公告)号：US20080070411A1
公开(公告)日：2008-03-20
申请号：US11533450
申请日：2006-09-20
申请人： John Ghekiere , Marvin Bernt
发明人： John Ghekiere , Marvin Bernt
IPC分类号： H01L21/302
CPC分类号： H01L21/31111 , H01L21/02087 , H01L21/32134
摘要： A chemical mixture etches chemically different materials, layers, or films on the surface of a semiconductor wafer or other workpiece at approximately the same rate. The different layers may include, for example, a first material, having a first chemical composition, encapsulated within or sandwiched between one or more materials having chemical compositions different from the first material. For example, a TiN layer may be encapsulated within or sandwiched between two or more TEOS layers. By etching away the different layers at approximately the same rate, undercutting of the encapsulated or sandwiched layer is substantially or entirely prevented. Flaking, liftoff, and similar defects are avoided.
摘要翻译：化学混合物以大致相同的速率在半导体晶片或其他工件的表面上化学地刻蚀化学上不同的材料，层或膜。不同的层可以包括例如具有第一化学组成的第一材料，其包封在一种或多种具有不同于第一材料的化学组成的材料中或夹在其中。例如，TiN层可以封装在两个或更多个TEOS层内或夹在两个或多个TEOS层之间。通过以大致相同的速率蚀刻掉不同的层，基本上或完全地防止了封装或夹层的底切。避免了剥落，脱落和类似缺陷。

7. 发明授权

US07305999B2 Centrifugal spray processor and retrofit kit 失效
标题翻译：离心喷雾处理器和改装套件
公开(公告)号：US07305999B2
公开(公告)日：2007-12-11
申请号：US10199998
申请日：2002-07-19
申请人： Trevor Henke , Craig Meuchel , Marvin Bernt
发明人： Trevor Henke , Craig Meuchel , Marvin Bernt
IPC分类号： B08B3/02
CPC分类号： H01L21/67313 , B08B3/02 , Y10S134/901 , Y10S134/902 , Y10S414/14
摘要： A centrifugal spray processor for processing semiconductor wafers uses larger numbers of spray nozzles. Each spray nozzle delivers a reduced volume of liquid, to reduce consumption of liquid process chemicals. The nozzles operate at a higher back pressure. The increased number of nozzles, offset nozzle patterns and groupings of nozzles, lower nozzle flow rates, and higher nozzle back pressures, provide improved processing results. The improved spray system may be provided as a retrofit kit.
摘要翻译：用于处理半导体晶片的离心喷雾处理器使用更大数量的喷嘴。每个喷嘴可以减少液体的体积，以减少液态工艺化学品的消耗。喷嘴在较高的背压下工作。喷嘴数量的增加，喷嘴图案的偏移以及喷嘴的分组，喷嘴流速的降低以及喷嘴背压的提高提供了改进的处理结果。改进的喷雾系统可以作为改装套件提供。

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