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    • 1. 发明授权
    • Baffles for high capacity air-cooling systems for electronics apparatus
    • 用于电子设备的大容量空气冷却系统的挡板
    • US07079388B2
    • 2006-07-18
    • US10931634
    • 2004-09-01
    • Barrett M. FaneufWilliam E. BerryVen R. Holalkere
    • Barrett M. FaneufWilliam E. BerryVen R. Holalkere
    • G06F1/16
    • H05K7/20727
    • An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
    • 用于高性能,高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇,具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室 以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。 空气冷却系统设计用于为诸如服务器的低高度,高发热电子模块提供最大的冷却。 通过仅使用与挡板的低阻气流特性匹配的单个风扇,空气冷却系统比多风扇系统具有显着的优点。 还描述了一种计算机服务器和制造散热设备的方法。
    • 2. 发明授权
    • High capacity air-cooling systems for electronic apparatus and associated methods
    • 用于电子设备和相关方法的大容量空气冷却系统
    • US06813149B2
    • 2004-11-02
    • US09896869
    • 2001-06-29
    • Barrett M. FaneufWilliam E. BerryVen R. HolalkereDavid S. De Lorenzo
    • Barrett M. FaneufWilliam E. BerryVen R. HolalkereDavid S. De Lorenzo
    • G06F116
    • H05K7/20727
    • An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
    • 用于高性能,高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇,具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室 以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。 空气冷却系统设计用于为诸如服务器的低高度,高发热电子模块提供最大的冷却。 通过仅使用与挡板的低阻气流特性匹配的单个风扇,空气冷却系统比多风扇系统具有显着的优点。 还描述了一种计算机服务器和制造散热设备的方法。
    • 6. 发明授权
    • Integrated stacked microchannel heat exchanger and heat spreader
    • 集成堆叠微通道换热器和散热器
    • US07115987B2
    • 2006-10-03
    • US10750234
    • 2003-12-31
    • Ven R. HolalkereRavi PrasherStephen Montgomery
    • Ven R. HolalkereRavi PrasherStephen Montgomery
    • H01L23/34
    • H01L23/473F28D15/0266F28F2260/02H01L21/563H01L23/4006H01L23/427H01L2224/16H01L2224/73253H01L2924/01019H01L2924/01078H01L2924/01079
    • Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.
    • 公开了用于冷却集成电路(IC)模具和采用其的封装和冷却系统的集成堆叠微通道热交换器和散热器。 在一个实施例中,堆叠的微通道热交换器使用与焊料组合的间隙焊料或可焊接材料来操作和热耦合到IC管芯或封装。 在另一个实施例中,堆叠的微通道热交换器使用粘合剂可操作地和热耦合到IC管芯或封装。 在另一个实施例中,堆叠的微通道热交换器通过紧固件可操作地耦合到IC管芯或封装,并且使用热界面材料热耦合到IC管芯或封装。 集成的堆叠微通道热交换器和散热器可以用于包括泵和排热器的闭环冷却系统中。 集成的堆叠微通道热交换器和散热器被配置为支持使用诸如水的工作流体的两相或单相热传递过程。