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1. 发明申请

US20070238322A1 Technique for blind-mating daughtercard to mainboard 有权
标题翻译：盲卡子卡到主板的技术
公开(公告)号：US20070238322A1
公开(公告)日：2007-10-11
申请号：US11393540
申请日：2006-03-30
申请人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
发明人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H05K1/147 , H05K3/222 , H05K2201/044 , H05K2201/10189 , H05K2201/10325 , H05K2201/10719
摘要： An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughtercard having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
摘要翻译：一种装置包括固定到PCB的印刷电路板（PCB）和第一柔性导电电缆（“柔性电缆”）。该装置还包括具有邻近PCB的端部的子卡和固定到子卡的第二柔性电缆。该装置还包括连接器，其在第一柔性电缆和第二柔性电缆之间提供导电连接。连接器被定位成将第一柔性电缆的一部分夹在连接器和PCB之间。

2. 发明授权

US07402048B2 Technique for blind-mating daughtercard to mainboard 有权
标题翻译：盲卡子卡到主板的技术
公开(公告)号：US07402048B2
公开(公告)日：2008-07-22
申请号：US11393540
申请日：2006-03-30
申请人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
发明人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H05K1/147 , H05K3/222 , H05K2201/044 , H05K2201/10189 , H05K2201/10325 , H05K2201/10719
摘要： An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
摘要翻译：一种装置包括固定到PCB的印刷电路板（PCB）和第一柔性导电电缆（“柔性电缆”）。该装置还包括具有邻近PCB的端部的子卡和固定到子卡的第二柔性电缆。该装置还包括连接器，其在第一柔性电缆和第二柔性电缆之间提供导电连接。连接器被定位成将第一柔性电缆的一部分夹在连接器和PCB之间。

3. 发明授权

US07641481B2 Non-intrusive interposer for accessing integrated circuit package signals 有权
标题翻译：用于访问集成电路封装信号的非插入式插入器
公开(公告)号：US07641481B2
公开(公告)日：2010-01-05
申请号：US11870064
申请日：2007-10-10
申请人： Mark Trobough
发明人： Mark Trobough
IPC分类号： H01R12/00
CPC分类号： H01R13/2442 , H01R12/714 , H05K7/1061
摘要： Disclosed is an interposer for accessing one or more signals from an Integrated Circuit (IC) package. The interposer is disposed between the IC package and a socket body. The interposer comprises a plurality of clearance holes and at least one connecting element. The plurality of clearance holes allows an array of contacts on a first surface of the socket body to pass through the interposer and make electrical contact with a first set of contacts of a plurality of contacts of the IC package. The at least one connecting element is configured to make electrical contact with a second set of contacts of the plurality of contacts of the IC package. The electrical contact between the at least one connecting element and the second set of contacts of the plurality of contacts of the IC package provides access to the one or more signals from the IC package.
摘要翻译：公开了一种用于从集成电路（IC）封装访问一个或多个信号的插入器。插入器设置在IC封装和插座主体之间。插入器包括多个间隙孔和至少一个连接元件。多个间隙孔允许插座主体的第一表面上的触点阵列通过插入件并与IC封装的多个触点的第一组触点电接触。所述至少一个连接元件构造成与所述IC封装的所述多个触点中的第二组触点进行电接触。所述至少一个连接元件和所述IC封装的所述多个触点中的所述第二组触点之间的电接触提供对所述IC封装中的所述一个或多个信号的访问。

4. 发明申请

US20050286239A1 Circuit board and system with a multi-portion socket 有权
标题翻译：电路板和具有多部分插座的系统
公开(公告)号：US20050286239A1
公开(公告)日：2005-12-29
申请号：US10877680
申请日：2004-06-24
申请人： Mark Trobough
发明人： Mark Trobough
IPC分类号： H05K7/10
CPC分类号： H05K7/1061
摘要： Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.
摘要翻译：本文描述了具有多部分插座的电路板和系统以及在其上实施的信号方法。

5. 发明申请

US20070224849A1 SOCKET WITH INTEGRAL, RETRACTABLE SOCKET CONTACT PROTECTOR 有权
标题翻译：插座与整体，可回收插座接触保护器
公开(公告)号：US20070224849A1
公开(公告)日：2007-09-27
申请号：US11390615
申请日：2006-03-27
申请人： Mark Trobough
发明人： Mark Trobough
IPC分类号： H01R12/00
CPC分类号： H01R12/82 , H05K7/1069
摘要： In some embodiments, a socket with integral, retractable socket contact protector is presented. In this regard, a contact protector is introduced to protect contacts, and to provide openings through which the contacts can emerge to couple with lands. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，呈现了具有整体的可收回插座接触保护器的插座。在这方面，引入接触保护器以保护接触，并提供开口，触点可以通过该开口与接地部接合。还公开并要求保护其他实施例。

6. 发明申请

US20070223865A1 Optical interconnect with passive optical alignment 有权
标题翻译：具有无源光学对准的光学互连
公开(公告)号：US20070223865A1
公开(公告)日：2007-09-27
申请号：US11386149
申请日：2006-03-22
申请人： Daoqiang Lu , Henning Braunisch , Bram Leader , Mark Trobough
发明人： Daoqiang Lu , Henning Braunisch , Bram Leader , Mark Trobough
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/3885 , G02B6/423 , H01L2224/16225
摘要： A coupler is passively aligned over a substrate, wherein the coupler is laterally aligned to an optoelectronic (OE) device coupled to the substrate. The coupler is placed on the substrate, wherein the coupler is vertically aligned to the OE device. The coupler is fixed to the substrate.
摘要翻译：耦合器在衬底上被动对准，其中耦合器横向对准耦合到衬底的光电子（OE）器件。耦合器被放置在基板上，其中耦合器垂直对准OE设备。耦合器固定在基板上。

7. 发明授权

US5418469A Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components 失效
标题翻译：用于将测试设备连接到电路板的互连设备，用于精细节距焊丝集成电路组件
公开(公告)号：US5418469A
公开(公告)日：1995-05-23
申请号：US343842
申请日：1994-11-23
申请人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
发明人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
IPC分类号： G01R1/073 , G01R31/00
CPC分类号： G01R1/07328 , Y10S439/912
摘要： An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention includes a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit features a lead frame which is attached to a metal body. The lead frame is used to route or convert the pins into an array of contact pads. The contact pads are relatively widely spaced for better access to and connection with an array of electrically conductive spring pins or contact pins of the interposer. Because the lead frame converts the fine dimension pins to a more widely spaced array of contact pads, the corresponding spring pins of the interposer do not have to be manufactured with the precise dimensional tolerances required for the manufacture of the pins.
摘要翻译：描述了一种用于将测试装置与设计用于细间距焊料引线表面安装部件的电路板可靠地互连的装置和方法。本发明的测试设备接口系统包括板互连单元，插入器和测试设备电缆。测试设备电缆耦合到可以经由电缆接收和操纵信号的测试设备。这些信号对应于由本发明仿真的部件提供的信号。正在仿真的部件由电路板互连单元在电路板上替换。电路板互连单元具有对应于正在仿真的部件的数量，尺寸和配置的引线或引脚，并且通常被焊接到被测电路板，以分析和调试电路板上的电路。电路板互连单元具有连接到金属体的引线框架。引线框架用于将引脚路由或转换为接触焊盘阵列。接触垫相对较宽地间隔开，以便更好地接触和连接插入件的导电弹簧销或接触针阵列。因为引线框架将精细尺寸的引脚转换成更广泛间隔的接触焊盘阵列，因此插入器的相应弹簧销不必以制造引脚所需的精确尺寸公差制造。

8. 发明申请

US20050287837A1 MULTI-PORTION SOCKET AND RELATED APPARATUSES 有权
标题翻译：多部分插座及相关装置
公开(公告)号：US20050287837A1
公开(公告)日：2005-12-29
申请号：US10877323
申请日：2004-06-24
申请人： Mark Trobough
发明人： Mark Trobough
IPC分类号： H01R12/00 , H05K7/10
CPC分类号： H05K7/1092
摘要： A multi-portion socket, related components, and systems having such socket/components are described herein.
摘要翻译：这里描述了具有这种插座/部件的多部分插座，相关组件和系统。

9. 发明授权

US5594356A Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components 失效
标题翻译：用于将测试设备连接到电路板的互连设备，用于精细节距焊丝集成电路组件
公开(公告)号：US5594356A
公开(公告)日：1997-01-14
申请号：US382295
申请日：1995-02-01
申请人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
发明人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R1/07328 , Y10S439/912
摘要： An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention comprises a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit comprises a lead frame which is attached to a metal body. The lead frame is used to route or convert the pins into an array of contact pads. The contact pads are relatively widely spaced for better access to and connection with an array of electrically conductive spring pins or contact pins of the interposer. Because the lead frame converts the fine dimension pins to a more widely spaced array of contact pads, the corresponding spring pins of the interposer do not have to be manufactured with the precise dimensional tolerances required for the manufacture of the pins.
摘要翻译：描述了一种用于将测试装置与设计用于细间距焊料引线表面安装部件的电路板可靠地互连的装置和方法。本发明的测试设备接口系统包括板互连单元，插入器和测试设备电缆。测试设备电缆耦合到可以经由电缆接收和操纵信号的测试设备。这些信号对应于由本发明仿真的部件提供的信号。正在仿真的部件由电路板互连单元在电路板上替换。电路板互连单元具有对应于正在仿真的部件的数量，尺寸和配置的引线或引脚，并且通常被焊接到被测电路板，以分析和调试电路板上的电路。板互连单元包括附接到金属体的引线框架。引线框架用于将引脚路由或转换为接触焊盘阵列。接触垫相对较宽地间隔开，以便更好地接触和连接插入件的导电弹簧销或接触针阵列。因为引线框架将精细尺寸的引脚转换成更广泛间隔的接触焊盘阵列，因此插入器的相应弹簧销不必以制造引脚所需的精确尺寸公差制造。

10. 发明申请

US20090197436A1 NON-INTRUSIVE INTERPOSER FOR ACCESSING INTEGRATED CIRCUIT PACKAGE SIGNALS 有权
标题翻译：用于访问集成电路封装信号的非侵入式插件
公开(公告)号：US20090197436A1
公开(公告)日：2009-08-06
申请号：US11870064
申请日：2007-10-10
申请人： Mark Trobough
发明人： Mark Trobough
IPC分类号： H01R12/00
CPC分类号： H01R13/2442 , H01R12/714 , H05K7/1061
摘要： Disclosed is an interposer for accessing one or more signals from an Integrated Circuit (IC) package. The interposer is disposed between the IC package and a socket body. The interposer comprises a plurality of clearance holes and at least one connecting element. The plurality of clearance holes allows an array of contacts on a first surface of the socket body to pass through the interposer and make electrical contact with a first set of contacts of a plurality of contacts of the IC package. The at least one connecting element is configured to make electrical contact with a second set of contacts of the plurality of contacts of the IC package. The electrical contact between the at least one connecting element and the second set of contacts of the plurality of contacts of the IC package provides access to the one or more signals from the IC package.
摘要翻译：公开了一种用于从集成电路（IC）封装访问一个或多个信号的插入器。插入器设置在IC封装和插座主体之间。插入器包括多个间隙孔和至少一个连接元件。多个间隙孔允许插座主体的第一表面上的触点阵列通过插入件并与IC封装的多个触点的第一组触点电接触。所述至少一个连接元件构造成与所述IC封装的所述多个触点中的第二组触点进行电接触。所述至少一个连接元件和所述IC封装的所述多个触点中的所述第二组触点之间的电接触提供对所述IC封装中的所述一个或多个信号的访问。

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