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1. 发明授权

US07402048B2 Technique for blind-mating daughtercard to mainboard 有权
标题翻译：盲卡子卡到主板的技术
公开(公告)号：US07402048B2
公开(公告)日：2008-07-22
申请号：US11393540
申请日：2006-03-30
申请人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
发明人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H05K1/147 , H05K3/222 , H05K2201/044 , H05K2201/10189 , H05K2201/10325 , H05K2201/10719
摘要： An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
摘要翻译：一种装置包括固定到PCB的印刷电路板（PCB）和第一柔性导电电缆（“柔性电缆”）。该装置还包括具有邻近PCB的端部的子卡和固定到子卡的第二柔性电缆。该装置还包括连接器，其在第一柔性电缆和第二柔性电缆之间提供导电连接。连接器被定位成将第一柔性电缆的一部分夹在连接器和PCB之间。

2. 发明申请

US20070238322A1 Technique for blind-mating daughtercard to mainboard 有权
标题翻译：盲卡子卡到主板的技术
公开(公告)号：US20070238322A1
公开(公告)日：2007-10-11
申请号：US11393540
申请日：2006-03-30
申请人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
发明人： Pascal C. Meier , Michael W. Leddige , Mohiuddin Mazumder , Mark Trobough , Alok Tripathi , Ven R. Holalkere
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H05K1/147 , H05K3/222 , H05K2201/044 , H05K2201/10189 , H05K2201/10325 , H05K2201/10719
摘要： An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughtercard having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.
摘要翻译：一种装置包括固定到PCB的印刷电路板（PCB）和第一柔性导电电缆（“柔性电缆”）。该装置还包括具有邻近PCB的端部的子卡和固定到子卡的第二柔性电缆。该装置还包括连接器，其在第一柔性电缆和第二柔性电缆之间提供导电连接。连接器被定位成将第一柔性电缆的一部分夹在连接器和PCB之间。

3. 发明授权

US06813149B2 High capacity air-cooling systems for electronic apparatus and associated methods 有权
标题翻译：用于电子设备和相关方法的大容量空气冷却系统
公开(公告)号：US06813149B2
公开(公告)日：2004-11-02
申请号：US09896869
申请日：2001-06-29
申请人： Barrett M. Faneuf , William E. Berry , Ven R. Holalkere , David S. De Lorenzo
发明人： Barrett M. Faneuf , William E. Berry , Ven R. Holalkere , David S. De Lorenzo
IPC分类号： G06F116
CPC分类号： H05K7/20727
摘要： An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
摘要翻译：用于高性能，高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇，具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。空气冷却系统设计用于为诸如服务器的低高度，高发热电子模块提供最大的冷却。通过仅使用与挡板的低阻气流特性匹配的单个风扇，空气冷却系统比多风扇系统具有显着的优点。还描述了一种计算机服务器和制造散热设备的方法。

4. 发明授权

US07079388B2 Baffles for high capacity air-cooling systems for electronics apparatus 失效
标题翻译：用于电子设备的大容量空气冷却系统的挡板
公开(公告)号：US07079388B2
公开(公告)日：2006-07-18
申请号：US10931634
申请日：2004-09-01
申请人： Barrett M. Faneuf , William E. Berry , Ven R. Holalkere
发明人： Barrett M. Faneuf , William E. Berry , Ven R. Holalkere
IPC分类号： G06F1/16
CPC分类号： H05K7/20727
摘要： An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
摘要翻译：用于高性能，高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇，具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。空气冷却系统设计用于为诸如服务器的低高度，高发热电子模块提供最大的冷却。通过仅使用与挡板的低阻气流特性匹配的单个风扇，空气冷却系统比多风扇系统具有显着的优点。还描述了一种计算机服务器和制造散热设备的方法。

5. 发明授权

US07115987B2 Integrated stacked microchannel heat exchanger and heat spreader 有权
标题翻译：集成堆叠微通道换热器和散热器
公开(公告)号：US07115987B2
公开(公告)日：2006-10-03
申请号：US10750234
申请日：2003-12-31
申请人： Ven R. Holalkere , Ravi Prasher , Stephen Montgomery
发明人： Ven R. Holalkere , Ravi Prasher , Stephen Montgomery
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , F28D15/0266 , F28F2260/02 , H01L21/563 , H01L23/4006 , H01L23/427 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079
摘要： Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.
摘要翻译：公开了用于冷却集成电路（IC）模具和采用其的封装和冷却系统的集成堆叠微通道热交换器和散热器。在一个实施例中，堆叠的微通道热交换器使用与焊料组合的间隙焊料或可焊接材料来操作和热耦合到IC管芯或封装。在另一个实施例中，堆叠的微通道热交换器使用粘合剂可操作地和热耦合到IC管芯或封装。在另一个实施例中，堆叠的微通道热交换器通过紧固件可操作地耦合到IC管芯或封装，并且使用热界面材料热耦合到IC管芯或封装。集成的堆叠微通道热交换器和散热器可以用于包括泵和排热器的闭环冷却系统中。集成的堆叠微通道热交换器和散热器被配置为支持使用诸如水的工作流体的两相或单相热传递过程。

6. 发明授权

US06965513B2 Carbon nanotube thermal interface structures 有权
标题翻译：碳纳米管热界面结构
公开(公告)号：US06965513B2
公开(公告)日：2005-11-15
申请号：US10027442
申请日：2001-12-20
申请人： Stephen W. Montgomery , Ven R. Holalkere
发明人： Stephen W. Montgomery , Ven R. Holalkere
IPC分类号： G06F1/20 , F28F13/00 , F28F21/02 , H01L23/373 , H01L23/433 , H05K7/20
CPC分类号： H01L23/373 , B82Y10/00 , F28F13/00 , F28F21/02 , F28F2013/006 , H01L23/3737 , H01L23/433 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/10253 , H01L2924/3011 , Y10S977/833 , H01L2924/00 , H01L2924/0665
摘要： The invention relates to a process of forming a thermal interface that employs carbon nanotubes to reduce thermal resistance between an electronic device and a cooling solution. Bundles of aligned nanotubes receive injected polymeric material to produce a polymeric/carbon composite which is then placed between the electronic device and a heat sink or other cooling solution.
摘要翻译：本发明涉及形成使用碳纳米管以降低电子器件与冷却溶液之间热阻的热界面的方法。排列的纳米管束接收注入的聚合物材料以产生聚合物/碳复合材料，然后将其放置在电子装置和散热片或其它冷却溶液之间。

7. 发明授权

US06741465B2 Cooling method and apparatus for handheld devices 有权
标题翻译：手持设备的冷却方法和装置
公开(公告)号：US06741465B2
公开(公告)日：2004-05-25
申请号：US10112633
申请日：2002-03-29
申请人： Ven R. Holalkere , Barrett M. Faneuf
发明人： Ven R. Holalkere , Barrett M. Faneuf
IPC分类号： G06F120
CPC分类号： G06F1/203 , G06F2200/201
摘要： A method and apparatus for cooling an electronic component within a handheld device comprised of an extension to the casing of the handheld device and at least one portion of a cooling apparatus within the extension.
摘要翻译：一种用于冷却手持装置内的电子部件的方法和装置，包括对手持装置的壳体的延伸部以及延伸部内的冷却装置的至少一部分。

8. 发明授权

US06836407B2 Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure 有权
标题翻译：计算机系统具有多个服务器单元，该多个服务器单元将热传递到流过框架级流体通道结构的流体
公开(公告)号：US06836407B2
公开(公告)日：2004-12-28
申请号：US10039146
申请日：2002-01-04
申请人： Barrett M. Faneuf , Ven R. Holalkere , Stephen W. Montgomery
发明人： Barrett M. Faneuf , Ven R. Holalkere , Stephen W. Montgomery
IPC分类号： G06F120
CPC分类号： H05K7/20809 , G06F1/20 , H05K7/1454
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.
摘要翻译：描述了具有框架的类型的计算机系统和可插入到框架中的多个服务器单元子组件。每个服务器单元子组件具有与框架上的框架部件接合的底座部件。热量可以从底盘组件传输到框架组件，但是服务器单元组件仍然可以移出框架。在一个实施例中，空气管道位于多个框架部件上。热量从框架部件转移到流过管道的空气中。改进的毛细管抽吸回路用于将热量从服务器单元子组件的处理器传递到框架上的热部件。

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