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    • 2. 发明授权
    • Fabry-Perot micro filter-detector
    • 法布里 - 珀罗微滤器检测器
    • US5550373A
    • 1996-08-27
    • US367491
    • 1994-12-30
    • Barrett E. ColeBernard S. FritzRobert D. Horning
    • Barrett E. ColeBernard S. FritzRobert D. Horning
    • B81B1/00G01J3/26G01J3/28G01J5/20G02B26/00G01B9/02G01J3/45
    • G01J3/2823G01J3/02G01J3/0208G01J3/0256G01J3/26G01J5/20G02B26/001
    • A monolithically constructed infrared, tunable Fabry-Perot cavity filter-detector for spectroscopic detection of particular substances having an absorption line in the wavelength range from 2 to 12 microns. The filter-detector has a hermetically sealed Fabry-Perot cavity that has a mirror which has an adjustable distance relative to another mirror of the cavity. The former mirror is adjusted by piezoelectric film on the mirror support or with piezoelectric stacks or wall supporting the mirror. There may be electrodes situated near the mirrors for capacitive sensing of the distance between the mirrors. Light to be filtered and detected comes in through a window wafer which may have diffractive or refractive microlenses, plus an optional spatial filter. After passing through the window wafer, the light is filtered by the tunable mirrors of the Fabry-Perot cavity. The portion of the light that is passed by the cavity is detected by an infrared microbolometer or a CCD array. The cavity and detector are hermetically sealed in a vacuum.
    • 用于光谱检测具有2至12微米波长范围内的吸收线的特定物质的单片构造的红外可调谐法布里 - 珀罗腔滤波器检测器。 过滤器检测器具有气密密封的法布里 - 珀罗腔,其具有相对于空腔的另一反射镜具有可调距离的反射镜。 前镜由反射镜支架上的压电膜或支撑镜子的压电叠层或墙壁调节。 可能存在位于反射镜附近的用于电容感测反射镜之间的距离的电极。 要过滤和检测的光通过可能具有衍射或折射微透镜的窗玻璃加上可选的空间滤光片进入。 通过窗玻璃后,光被法布里 - 珀罗腔的可调镜过滤。 由空腔通过的光的部分由红外微辐射热计或CCD阵列检测。 空腔和检测器在真空中气密密封。
    • 5. 发明授权
    • Method of personal navigation using stride vectoring
    • 使用步幅矢量的个人导航方法
    • US08078401B2
    • 2011-12-13
    • US12019368
    • 2008-01-24
    • Ryan SupinoRobert D. Horning
    • Ryan SupinoRobert D. Horning
    • G01C25/00G01C17/38G01C21/00
    • G01C21/16G01S1/72G01S5/186G01S5/26
    • A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object.
    • 提供了惯性测量单元的误差补偿方法。 该方法包括提供包括惯性测量单元的第一对象,提供靠近第一对象的第二对象,以及确定第一对象的初始位置和取向。 当第二物体相对于地面静止时,对于惯性测量单元触发运动更新。 当第一物体运动并且第二物体静止时,在第一物体和第二物体之间测量至少一个位置矢量。 使用至少一个位置矢量来计算第二对象相对于第一对象的距离,方向和方向。 然后根据计算出的第二物体相对于第一物体的距离,方向和取向来确定惯性测量单元的纠错。
    • 6. 发明申请
    • HYBRID HERMETIC INTERFACE CHIP
    • 混合界面切片
    • US20100320595A1
    • 2010-12-23
    • US12488847
    • 2009-06-22
    • Robert D. HorningJeff A. Ridley
    • Robert D. HorningJeff A. Ridley
    • H01L23/02H01L23/48H01L21/50
    • B81B7/007B81C2203/019H01L2224/48091H01L2924/1461H01L2924/00014H01L2924/00
    • A hermetically sealed MEMS device package comprises a MEMS device platform, a hermetic interface chip, and an outer seal ring. The MEMS device platform includes a MEMS device surrounded by a continuous outer boundary wall with a top surface. The hermetic interface chip includes a glass substrate and at least one silicon mesa. The glass substrate includes at least one hole and has a lower surface with an inner portion surrounded by an outer portion. The at least one silicon mesa is bonded to the inner portion of the lower surface of the glass substrate, such that the at least one silicon mesa is aligned with the at least one hole in the glass substrate. The outer seal ring bonds the outer portion of the lower surface of the glass substrate to the top surface of the continuous outer boundary wall of the MEMS device platform.
    • 密封的MEMS器件封装包括MEMS器件平台,密封接口芯片和外部密封环。 MEMS器件平台包括由具有顶表面的连续外边界壁包围的MEMS器件。 密封接口芯片包括玻璃基板和至少一个硅台面。 玻璃基板包括至少一个孔,并且具有下表面,内部被外部包围。 至少一个硅台面结合到玻璃基板的下表面的内部,使得至少一个硅台面与玻璃基板中的至少一个孔对准。 外密封环将玻璃基板的下表面的外部部分结合到MEMS器件平台的连续外边界壁的顶表面。
    • 7. 发明申请
    • SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP
    • 实现水平线性界面芯片的系统和方法
    • US20100084752A1
    • 2010-04-08
    • US12247368
    • 2008-10-08
    • Robert D. HorningDavid S. Willits
    • Robert D. HorningDavid S. Willits
    • H01L23/02H01L21/50
    • B81B7/007B81B7/0038
    • Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip (HIC) that facilitates a stable hermetic sealing process. The HIC includes a plurality of vias in a substrate layer, a plurality of mesas having etched portions, a seal ring, a plurality of conductive leads on a first side of the HIC, and a plurality of conductive leads on a second side of the HIC. The plurality of conductive leads on the first side of the HIC feeds from the etched portions of the plurality of mesas through the plurality of vias in the substrate layer to the plurality of conductive leads on the second side of the HIC. The conductive leads are capable of connecting an external circuit to the MEMS device.
    • 用于在制造微机电传感器(MEMS)器件期间在晶片级进行气密密封的系统和方法。 MEMS器件具有专门的密封接口芯片(HIC),有助于稳定的气密密封过程。 HIC在衬底层中包括多个通孔,具有蚀刻部分的多个台面,密封环,HIC的第一侧上的多个导电引线以及HIC的第二侧上的多个导电引线 。 HIC的第一侧上的多个导电引线从多个台面的蚀刻部分通过衬底层中的多个通孔馈送到HIC的第二侧上的多个导电引线。 导电引线能够将外部电路连接到MEMS器件。