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1. 发明申请

US20100084752A1 SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP 审中-公开
标题翻译：实现水平线性界面芯片的系统和方法
公开(公告)号：US20100084752A1
公开(公告)日：2010-04-08
申请号：US12247368
申请日：2008-10-08
申请人： Robert D. Horning , David S. Willits
发明人： Robert D. Horning , David S. Willits
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： B81B7/007 , B81B7/0038
摘要： Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip (HIC) that facilitates a stable hermetic sealing process. The HIC includes a plurality of vias in a substrate layer, a plurality of mesas having etched portions, a seal ring, a plurality of conductive leads on a first side of the HIC, and a plurality of conductive leads on a second side of the HIC. The plurality of conductive leads on the first side of the HIC feeds from the etched portions of the plurality of mesas through the plurality of vias in the substrate layer to the plurality of conductive leads on the second side of the HIC. The conductive leads are capable of connecting an external circuit to the MEMS device.
摘要翻译：用于在制造微机电传感器（MEMS）器件期间在晶片级进行气密密封的系统和方法。 MEMS器件具有专门的密封接口芯片（HIC），有助于稳定的气密密封过程。 HIC在衬底层中包括多个通孔，具有蚀刻部分的多个台面，密封环，HIC的第一侧上的多个导电引线以及HIC的第二侧上的多个导电引线。 HIC的第一侧上的多个导电引线从多个台面的蚀刻部分通过衬底层中的多个通孔馈送到HIC的第二侧上的多个导电引线。导电引线能够将外部电路连接到MEMS器件。

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