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1. 发明授权

US07312468B2 Semiconductor light-emitting element and method of manufacturing the same 失效
标题翻译：半导体发光元件及其制造方法
公开(公告)号：US07312468B2
公开(公告)日：2007-12-25
申请号：US10535175
申请日：2003-11-12
申请人： Atushi Watanabe , Atsuya Ito , Hirokazu Takahashi , Yoshinori Kimura , Mamoru Miyachi
发明人： Atushi Watanabe , Atsuya Ito , Hirokazu Takahashi , Yoshinori Kimura , Mamoru Miyachi
IPC分类号： H01L29/06 , H01L31/072 , H01L31/109 , H01L31/0328 , H01L31/0336 , H01L33/00
CPC分类号： B82Y20/00 , H01S5/305 , H01S5/3086 , H01S5/34333
摘要： The semiconductor light-emitting element uses a compound semiconductor quantum well structure comprising a well layer, and barrier layers between which the well layer is sandwiched, as an active layer. In the adjacent well layer and barrier layers of the semiconductor light-emitting element, the well layer has in part a doped well region to which an n-type impurity is added at the interface with the barrier layer on the electron injection side, and in the vicinity of this interface, and the barrier layer has a doped barrier region to which the n-type impurity is added at least at the interface and in the vicinity of this interface.
摘要翻译：半导体发光元件使用包括阱层的化合物半导体量子阱结构和夹在阱层之间的阻挡层作为有源层。在半导体发光元件的相邻的阱层和阻挡层中，阱层部分地具有与电子注入侧的势垒层的界面处添加n型杂质的掺杂阱区域，在该界面附近，势垒层具有至少在界面处和界面附近添加n型杂质的掺杂阻挡区域。

2. 发明申请

US20060027814A1 Semiconductor light-emitting element and method of manufacturingthe same 失效
标题翻译：半导体发光元件及其制造方法
公开(公告)号：US20060027814A1
公开(公告)日：2006-02-09
申请号：US10535175
申请日：2003-11-12
申请人： Atsushi Watanabe , Atsuya Ito , Hirokazu Takahashi , Yoshinori Kimura , Mamoru Miyachi
发明人： Atsushi Watanabe , Atsuya Ito , Hirokazu Takahashi , Yoshinori Kimura , Mamoru Miyachi
IPC分类号： H01L33/00
CPC分类号： B82Y20/00 , H01S5/305 , H01S5/3086 , H01S5/34333
摘要： The semiconductor light-emitting element uses a compound semiconductor quantum well structure comprising a well layer, and barrier layers between which the well layer is sandwiched, as an active layer. In the adjacent well layer and barrier layers of the semiconductor light-emitting element, the well layer has in part a doped well region to which an n-type impurity is added at the interface with the barrier layer on the electron injection side, and in the vicinity of this interface, and the barrier layer has a doped barrier region to which the n-type impurity is added at least at the interface and in the vicinity of this interface.
摘要翻译：半导体发光元件使用包括阱层的化合物半导体量子阱结构和夹在阱层之间的阻挡层作为有源层。在半导体发光元件的相邻的阱层和阻挡层中，阱层部分具有与电子注入侧的势垒层的界面处添加n型杂质的掺杂阱区域，该界面附近，势垒层具有至少在界面处和界面附近添加n型杂质的掺杂阻挡区域。

3. 发明授权

US06795471B2 Group III nitride compound semiconductor laser and manufacturing method thereof 失效
标题翻译： III族氮化物半导体激光器及其制造方法
公开(公告)号：US06795471B2
公开(公告)日：2004-09-21
申请号：US10117095
申请日：2002-04-08
申请人： Atsushi Watanabe , Yoshinori Kimura , Hiroyuki Ota , Toshiyuki Tanaka , Hirokazu Takahashi , Mamoru Miyachi , Atsuya Ito
发明人： Atsushi Watanabe , Yoshinori Kimura , Hiroyuki Ota , Toshiyuki Tanaka , Hirokazu Takahashi , Mamoru Miyachi , Atsuya Ito
IPC分类号： H01S500
CPC分类号： H01S5/32341 , H01S5/0213 , H01S5/0224 , H01S5/221 , H01S5/2216 , H01S5/222 , H01S5/2222 , H01S2301/18 , H01S2304/00
摘要： A nitride compound semiconductor laser, of which driving voltage is low and transverse mode of light is stable, having a plurality of crystal layers made of a group III nitride compound semiconductor expressed by the formula (AlGa1-x)1-yInyN (0≦x≦1, 0≦y≦1). The layers include an active layer-side guide layer which is adjacent to an active layer in the crystal layers of the group III nitride compound semiconductor and made of Alx′Ga1-x′-y′Iny′N (0≦x′≦1, 0≦y′≦1), a current constricting AlN layer deposited on said guide layer and having a stripe-shape aperture, an electrode-side guide layer made of Alx″Ga1-x″-y″Iny″N (0≦x″≦1, 0≦y″≦1) and deposited filling the aperture of the current constricting layer, and a clad layer made of AluGa1-u-vInvN (0≦u≦1, 0≦v≦1) and deposited on the electrode-side guide layer.
摘要翻译：驱动电压低且横向模式稳定的氮化物化合物半导体激光器具有由式（AlGa1-x）1-yInyN（0≤...）表示的由III族氮化物化合物半导体构成的多个晶体层， x <= 1，0 <= y <= 1）。这些层包括与III族氮化物化合物半导体的晶体层中的有源层相邻的有源层侧引导层，由Al x Ga 1-x'-y'In y'N（0 <= x' = 1,0 <= y'<= 1），沉积在所述引导层上并具有条形孔的电流收缩AlN层，由Al x''Ga 1-x“y”形成的电极侧引导层， “Iny''N（0 <= x”<= 1,0,0 <= y“<= 1），并填充电流收缩层的孔径，以及由AluGa1-u-vInvN（0 <= u <= 1，0 <= v <= 1）并沉积在电极侧引导层上。

4. 发明授权

US07098063B2 Semiconductor laser device and method of manufacturing the same 失效
标题翻译：半导体激光器件及其制造方法
公开(公告)号：US07098063B2
公开(公告)日：2006-08-29
申请号：US10743542
申请日：2003-12-23
申请人： Mamoru Miyachi , Atsushi Watanabe , Hirokazu Takahashi , Yoshinori Kimura
发明人： Mamoru Miyachi , Atsushi Watanabe , Hirokazu Takahashi , Yoshinori Kimura
IPC分类号： H01L21/00
CPC分类号： B82Y20/00 , G11B7/1275 , G11B2007/0006 , H01L2224/48463 , H01S5/0202 , H01S5/0207 , H01S5/0213 , H01S5/0217 , H01S5/0224 , H01S5/02272 , H01S5/02461 , H01S5/0421 , H01S5/0425 , H01S5/2214 , H01S5/2231 , H01S5/32325 , H01S5/32341 , H01S5/34326 , H01S5/34333 , H01S5/4043 , H01S5/4087 , H01S2301/173 , H01S2304/04
摘要： A semiconductor laser device comprises: a first light-emitting element having a first laser part, an insulating layer, and an ohmic electrode layer; and a second light-emitting element having a second laser part, an insulating layer, and an ohmic electrode layer. The first laser part has a ridge waveguide, and is formed by stacking thin films of group-III nitride compound semiconductors (for example, GaN-based semiconductors). The second laser part has a ridge waveguide, and is formed by stacking thin films of group III–V compound semiconductors (such as GaAs). The first laser part and the second laser part are integrally bonded to each other by the interposition of an adhesive metal layer which is formed between the ohmic electrode layers. This provides the semiconductor laser device with a small distance between the light-emitting spots of the laser parts.
摘要翻译：半导体激光器件包括：具有第一激光器部分，绝缘层和欧姆电极层的第一发光元件; 以及具有第二激光部分，绝缘层和欧姆电极层的第二发光元件。第一激光器部分具有脊形波导，并且通过堆叠III族氮化物化合物半导体（例如，GaN基半导体）的薄膜形成。第二激光器部分具有脊形波导，并且通过堆叠III-V族化合物半导体（诸如GaAs）的薄膜形成。第一激光部分和第二激光部分通过插入形成在欧姆电极层之间的粘合金属层而彼此一体地接合。这为半导体激光器件在激光器部件的发光点之间提供了很小的距离。

5. 发明申请

US20060081860A1 Group III nitride semiconductor light-emitting element and method of manufacturing the same 审中-公开
标题翻译： III族氮化物半导体发光元件及其制造方法
公开(公告)号：US20060081860A1
公开(公告)日：2006-04-20
申请号：US10530322
申请日：2003-09-29
申请人： Atsushi Watanabe , Hirokazu Takahashi , Yoshinori Kimura , Mamoru Miyachi
发明人： Atsushi Watanabe , Hirokazu Takahashi , Yoshinori Kimura , Mamoru Miyachi
IPC分类号： H01L33/00
CPC分类号： H01S5/34333 , B82Y20/00 , H01L33/02 , H01L33/025 , H01L33/32 , H01S5/3086 , H01S5/309 , H01S2301/173 , H01S2301/18
摘要： A Group III nitride semiconductor light-emitting element includes a crack-preventing layer 15 of n-type GaN provided between a n-type contact layer 4A and a n-type clad layer 5A, wherein the crack-preventing layer 15 has a dopant concentration lower than that of the n-type contact layer 4A.
摘要翻译： III族氮化物半导体发光元件包括设置在n型接触层4A和n型覆盖层5A之间的n型GaN的防裂层15，其中防裂层15具有掺杂剂浓度低于n型接触层4A的掺杂浓度。

6. 发明授权

US5834326A Process for producing a luminous element of group III nitride semi-conductor 失效
标题翻译： III族氮化物半导体发光元件的制造方法
公开(公告)号：US5834326A
公开(公告)日：1998-11-10
申请号：US763779
申请日：1996-12-11
申请人： Mamoru Miyachi , Toshiyuki Tanaka , Yoshinori Kimura , Hirokazu Takahashi , Hitoshi Sato , Atsushi Watanabe , Hiroyuki Ota , Isamu Akasaki , Hiroshi Amano
发明人： Mamoru Miyachi , Toshiyuki Tanaka , Yoshinori Kimura , Hirokazu Takahashi , Hitoshi Sato , Atsushi Watanabe , Hiroyuki Ota , Isamu Akasaki , Hiroshi Amano
IPC分类号： H01L33/12 , H01L33/32 , H01L33/36 , H01S5/00 , H01S5/323 , H01L21/00
CPC分类号： H01L33/32 , H01L33/007 , H01L33/325 , Y10S148/065 , Y10S148/113
摘要： A process for producing a semiconductor emitting device of group III nitride semiconductor having a crystal layer (Al.sub.x Ga.sub.1-x).sub.1-y In.sub.y N (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1) includes; a step of forming at least one pn-junction or pin-junction and a crystal layer (Al.sub.x Ga.sub.1-x).sub.1-y In.sub.y N (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1) to which a group II element is added; and a step of forming electrodes on the crystal layer. The process further includes an electric-field-assisted annealing treatment in which the pn-junction or pin-junction is heated to the predetermined temperature range while forming and maintaining an electric field across the pn-junction or pin-junction for at least partial time period of the predetermined temperature range via the electrodes.
摘要翻译：一种用于制造半导体具有晶体层（的AlxGa1-x）的1-yInyN（0

7. 发明授权

US07079563B2 Semiconductor laser device and method of manufacturing the same 失效
标题翻译：半导体激光器件及其制造方法
公开(公告)号：US07079563B2
公开(公告)日：2006-07-18
申请号：US10743944
申请日：2003-12-24
申请人： Mamoru Miyachi , Atsushi Watanabe , Hirokazu Takahashi , Yoshinori Kimura
发明人： Mamoru Miyachi , Atsushi Watanabe , Hirokazu Takahashi , Yoshinori Kimura
IPC分类号： H01S5/00
CPC分类号： H01S5/32341 , H01L2224/48463 , H01S5/0202 , H01S5/0217 , H01S5/0224 , H01S5/02272 , H01S5/0425 , H01S5/22 , H01S5/4043 , H01S5/4087
摘要： An improved semiconductor laser device is provided which has a small distance between laser light emitting spots. Such laser device comprises i) a first light emitting element including a laser oscillation section provided with a ridge waveguide and formed by forming a group-III nitride semiconductor film on a substrate, an insulating layer and an ohmic electrode layer, ii) a second light emitting element including a laser oscillation section provided with a waveguide and formed by forming III–V compound semiconductor film, an insulating layer and an ohmic electrode layer. By virtue of the adhesive metal layer interposed between the two ohmic electrode layers, the two laser oscillation sections are combined together, thereby forming the improved semiconductor laser device which has a small distance between laser light emitting spots of the two laser oscillation sections.
摘要翻译：提供了一种在激光发光点之间具有小距离的改进的半导体激光器件。这种激光装置包括：i）第一发光元件，其包括设置有脊波导的激光振荡部，并且通过在基板上形成III族氮化物半导体膜，形成绝缘层和欧姆电极层，ii）第二光包括设置有波导并通过形成III-V化合物半导体膜，绝缘层和欧姆电极层形成的激光振荡部的发光元件。通过插入在两个欧姆电极层之间的粘合金属层，将两个激光振荡部分组合在一起，从而形成在两个激光振荡部分的激光发光点之间具有小距离的改进的半导体激光器装置。

8. 发明授权

US07333525B2 Integrated semiconductor light-emitting device and method for manufacturing same 失效
标题翻译：集成半导体发光器件及其制造方法
公开(公告)号：US07333525B2
公开(公告)日：2008-02-19
申请号：US11038576
申请日：2005-01-21
申请人： Yoshinori Kimura , Mamoru Miyachi , Kiyofumi Chikuma
发明人： Yoshinori Kimura , Mamoru Miyachi , Kiyofumi Chikuma
IPC分类号： H01S5/00
CPC分类号： H01S5/4031 , H01S5/0202 , H01S5/0217 , H01S5/0224 , H01S5/02272 , H01S5/32325 , H01S5/32341 , H01S5/405 , H01S5/4087
摘要： An integrated semiconductor light-emitting device suitable for being mounted on a pickup is provided. The integrated semiconductor light-emitting device has a first laser part stacked on a semiconductor substrate and a projection-shaped second laser part formed by stack in thin-film-layer form. The second laser part is fitted into a trench formed adjacent to the first laser part in the semiconductor substrate. At least the first and second laser parts and the trench are bonded together through a metal bonding layer. An emission spot of the first laser part and an emission spot of the second laser part are located away in approximately the same horizontal direction perpendicular to the direction of the stack of the first and second laser parts.
摘要翻译：提供一种适于安装在拾取器上的集成半导体发光器件。集成半导体发光器件具有堆叠在半导体衬底上的第一激光器部分和以薄膜层形式堆叠形成的突出形状的第二激光器部分。第二激光器部件装配到与半导体衬底中的第一激光器部分相邻形成的沟槽中。至少第一和第二激光部分和沟槽通过金属粘结层粘合在一起。第一激光部的发光点和第二激光部的发光点位于与第一激光部和第二激光部的堆叠的方向垂直的大致相同的水平方向上。

9. 发明授权

US08236588B2 Method for manufacturing a multi-wavelength integrated semiconductor laser 失效
标题翻译：多波长集成半导体激光器的制造方法
公开(公告)号：US08236588B2
公开(公告)日：2012-08-07
申请号：US12158648
申请日：2006-12-14
申请人： Mamoru Miyachi , Yoshinori Kimura
发明人： Mamoru Miyachi , Yoshinori Kimura
IPC分类号： H01S3/063
CPC分类号： H01S5/4043 , H01S5/0216 , H01S5/0224 , H01S5/02272 , H01S5/024 , H01S5/22 , H01S5/405 , H01S5/4087 , Y10S438/977
摘要： An object is to provide a multi-wavelength integrated semiconductor laser device which can reduce variations in emission point distance, can be formed by simplified manufacturing processes, and can provide improve electric characteristics.A first semiconductor laser element 100 having an active layer AL1 for emitting a laser beam of a first wavelength from its light-emitting point X1 and a second semiconductor laser element 200 having an active layer AL2 for emitting a laser beam of a second wavelength from its light-emitting point X2 are bonded to each other via an adhesive layer MC made of metal. At least either one of the semiconductor laser elements has a ridge waveguide made of an n-type semiconductor. The semiconductor laser elements 100 and 200 are bonded via the metal adhesive layer MC at the sides of their respective p-type semiconductors. A submount SUB is bonded to the first semiconductor laser element 100 via metal at a side where its ridge waveguide is formed.
摘要翻译：本发明的目的是提供一种可以减少发射点距离的变化的多波长集成半导体激光器件，可以通过简化的制造工艺形成，并且可以提供改善的电气特性。具有从其发光点X1发射第一波长的激光束的有源层AL1的第一半导体激光元件100和具有从其发光点X1发射第二波长的激光束的有源层AL2的第二半导体激光元件200 发光点X2通过由金属制成的粘合剂层MC彼此结合。半导体激光元件中的至少一个具有由n型半导体构成的脊状波导。半导体激光元件100和200通过金属粘合剂层MC在它们各自的p型半导体的侧面接合。底座SUB通过金属在其脊形波导形成的一侧与第一半导体激光元件100接合。

10. 发明申请

US20070099321A1 Method for fabricating semiconductor laser device 审中-公开
标题翻译：制造半导体激光器件的方法
公开(公告)号：US20070099321A1
公开(公告)日：2007-05-03
申请号：US10581202
申请日：2004-09-27
申请人： Mamoru Miyachi , Yoshinori Kimura , Kiyofumi Chikuma
发明人： Mamoru Miyachi , Yoshinori Kimura , Kiyofumi Chikuma
IPC分类号： H01L21/00 , H01L21/28 , H01L21/3205
CPC分类号： H01S5/4043 , H01S5/0217 , H01S5/0425 , H01S5/22 , H01S5/4087
摘要： A first intermediate body is fabricated on a semiconductor substrate. The first intermediate body includes a first lasing portion of a multi-layer stack and a metal adherent layer. A second intermediate body is fabricated on a support substrate. The second intermediate body includes a second lasing portion formed of a multi-layer stack to be less in size than the first lasing portion, and a groove formed adjacent thereto to form a metal adherent layer. Then, with waveguide paths brought into close proximity, the adherent layers of the first and second intermediate bodies are fused to generate an integrated adherent layer, thereby securely adhering the first and second lasing portions to each other. Thereafter, the support substrate is stripped off from the second lasing portion, thereby allowing the adherent layer to be partially exposed. A semiconductor laser device is thus fabricated which has the exposed adherent layer as a common electrode.
摘要翻译：在半导体衬底上制造第一中间体。第一中间体包括多层堆叠的第一激光部分和金属粘附层。在支撑基板上制造第二中间体。第二中间体包括由多层叠层形成的尺寸小于第一激光部分的第二激光部分和与其相邻形成的沟槽以形成金属粘附层。然后，随着波导路径相互靠近，第一和第二中间体的粘附层被熔合以产生一体化的粘合层，从而将第一和第二激光部分牢固地粘附到彼此。此后，从第二激光部分剥离支撑基板，从而允许粘附层部分露出。因此制造了具有暴露的粘附层作为公共电极的半导体激光器件。

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