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1. 发明申请

US20180254129A1 Temperature Sensor Element 审中-公开
公开(公告)号：US20180254129A1
公开(公告)日：2018-09-06
申请号：US15913226
申请日：2018-03-06
申请人： KOA Corporation
发明人： Ryusuke SUZUKI
IPC分类号： H01C7/00 , H01C1/01 , H01C1/14 , H01C1/142 , H01C17/065 , G01K7/18
CPC分类号： H01C7/003 , G01K7/18 , H01C1/01 , H01C1/14 , H01C1/142 , H01C3/12 , H01C17/065
摘要： A resistance pattern and a pair of internal electrodes are formed on a main face of a cuboidal insulating substrate. The pair of internal electrodes are connected to opposite end portions of the resistance pattern. A surface glass film is formed to cover the entire main face including a pair of lead wires and a protective film. The pair of lead wires are bonded to the internal electrodes and protrude outward from the insulating substrate. The protective film is formed on the resistance pattern. The surface glass film extends over a region covering respective upper-side faces of the insulating substrate adjacent to the main face. The total dimension (T+D) is (T+D)≈W. T: a thickness of the insulating substrate, D: a wire diameter of each of the lead wires, W: a width of the insulating substrate along a lateral direction.

2. 发明申请

US20180211748A1 RESISTOR AND METHOD FOR MANUFACTURING SAME 审中-公开
公开(公告)号：US20180211748A1
公开(公告)日：2018-07-26
申请号：US15935326
申请日：2018-03-26
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Seiji TSUDA , Shogo NAKAYAMA , Takeshi ISEKI , Kazutoshi MATSUMURA
IPC分类号： H01C1/14 , H01C17/28 , H01C17/24 , G03F7/40 , H01C17/06 , H01C17/00 , H01C7/00 , H01C17/065
CPC分类号： H01C1/14 , G03F7/40 , H01C7/003 , H01C17/003 , H01C17/06 , H01C17/065 , H01C17/24 , H01C17/28 , H01C17/281
摘要： A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

3. 发明申请

US20180158580A1 RESISTOR PRODUCTION METHOD, RESISTOR, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180158580A1
公开(公告)日：2018-06-07
申请号：US15568540
申请日：2016-03-23
申请人： STANLEY ELECTRIC CO., LTD.
发明人： Akihiko HANYA
IPC分类号： H01C17/065 , H05K1/16 , H01C7/00 , H01C17/22
CPC分类号： H01C17/065 , H01B1/22 , H01C7/003 , H01C17/22 , H01C17/24 , H05K1/097 , H05K1/167 , H05K3/1283 , H05K2203/1131
摘要： A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 μm and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.

4. 发明申请

US20180158578A1 Chip Resistor 审中-公开
公开(公告)号：US20180158578A1
公开(公告)日：2018-06-07
申请号：US15572847
申请日：2016-04-11
申请人： KOA Corporation
发明人： Yasushi AKAHANE , Shinsuke CHIHARA
IPC分类号： H01C1/148 , H01C1/142
CPC分类号： H01C1/148 , H01C1/028 , H01C1/14 , H01C1/142 , H01C7/00 , H01C7/003 , H01C17/02
摘要： Provided is a chip resistor in which cracks, fracture, etc. can be surely prevented from occurring due to thermal stress in solder bonding portions. The chip resistor 1 includes: a ceramic substrate 2 that is shaped like a cuboid; a pair of front electrodes 3 that are provided on lengthwise opposite end portions of a front surface of the ceramic substrate 2; a resistor body 4 that is provided between and connected to the two front electrodes 3; a protective layer 5 that covers the resistor body 4; a pair of back electrodes 6 that are provided on lengthwise opposite end portions of a back surface of the ceramic substrate 2; end-surface electrodes 7 through which the front electrodes 3 and the back electrodes 6 are electrically conductively connected to each other respectively; external electrodes 8 that cover the end-surface electrodes 7; and a pair of insulating resin layers 9 that are provided to cover edge portions of the back electrodes 6; wherein: the pair of insulating resin layers 9 are opposed to each other with interposition of a predetermined interval therebetween on the back surface of the ceramic substrate 2; and at least opposed side end portions of the insulating resin layers 9 are exposed from the external electrodes 8.

5. 发明申请

US20170271054A1 CHIP RESISTOR 审中-公开
公开(公告)号：US20170271054A1
公开(公告)日：2017-09-21
申请号：US15611282
申请日：2017-06-01
申请人： ROHM CO., LTD.
发明人： Shinsuke OGAWA , Makoto TOYONAGA
IPC分类号： H01C1/142 , H01C7/00 , H01C17/00 , H01C1/148 , H01C17/24
CPC分类号： H01C1/142 , H01C1/148 , H01C7/003 , H01C17/006 , H01C17/24
摘要： A chip resistor includes a base member, a resistive element formed on the base member, a first inner electrode held in contact with a first end portion of the resistive element, a second inner electrode held in contact with a second end portion of the resistive element, a first reverse surface electrode reaching a first end portion of the base member, and a second reverse surface electrode reaching a second end portion of the base member. The length of the first and the second reverse surface electrodes is in a range of 2/10 to 3/10 of the length of the base member. Also, the length of the first and the second reverse surface electrodes is greater than the length of the first and the second inner electrodes.

6. 发明授权

US09754705B2 Resistor, method of manufacturing the same, and board having the same 有权
公开(公告)号：US09754705B2
公开(公告)日：2017-09-05
申请号：US14931684
申请日：2015-11-03
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae In Kim , Jung Min Nam , Jea Hoon Lee , Young Key Kim
IPC分类号： H01C1/14 , H01C1/01 , H01C7/00 , H01C17/28 , H05K1/18 , H05K3/34
CPC分类号： H01C1/14 , H01C1/01 , H01C7/003 , H01C17/281 , H05K1/181 , H05K3/3431 , H05K2201/10022 , H05K2201/10045 , Y02P70/611
摘要： A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

7. 发明申请

US20160358701A1 RESISTIVE ELEMENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电阻元件及其制造方法
公开(公告)号：US20160358701A1
公开(公告)日：2016-12-08
申请号：US15102711
申请日：2014-11-19
申请人： KOA CORPORATION
发明人： Sohei KODA , Yuya TAKEUE
IPC分类号： H01C7/00 , H01C1/142 , H01C17/28 , H01C17/00 , H01C17/065
CPC分类号： H01C7/003 , H01C1/142 , H01C7/00 , H01C17/006 , H01C17/065 , H01C17/28 , H01C17/281 , H01C17/283
摘要： A method for manufacturing a chip resistive element including a substrate, a resistor formed on the substrate, and electrodes connected to opposite ends of the resistor, the method including an electrode forming step of forming the electrodes on the substrate. The electrode forming step includes a step of forming a first electrode layer on the substrate using a first electrode material containing silver, and a step of forming a second electrode layer on the first electrode layer using a second electrode material containing silver and palladium. The first electrode material has a higher silver content than the second electrode material.
摘要翻译：一种用于制造芯片电阻元件的方法，该芯片电阻元件包括基板，形成在基板上的电阻器和连接到电阻器的相对端的电极，该方法包括在基板上形成电极的电极形成步骤。电极形成步骤包括使用包含银的第一电极材料在基板上形成第一电极层的步骤，以及使用含有银和钯的第二电极材料在第一电极层上形成第二电极层的步骤。第一电极材料具有比第二电极材料更高的银含量。

8. 发明申请

US20160343479A1 CHIP RESISTOR 审中-公开
标题翻译：芯片电阻
公开(公告)号：US20160343479A1
公开(公告)日：2016-11-24
申请号：US15107079
申请日：2015-02-02
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Masaaki ITOU
IPC分类号： H01C1/084 , H01C1/14 , G01R1/20 , H01C1/028
CPC分类号： H01C1/084 , G01R1/203 , H01C1/028 , H01C1/14 , H01C7/003 , H01C7/06
摘要： A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.
摘要翻译：芯片电阻器包括电阻元件，一对电极和散热板。电阻元件由板状金属制成。一对电极形成在电阻元件的第一表面的两端。散热板固定在电阻元件的第二表面上，并通过它们之间的间隙彼此隔开设置。

9. 发明授权

US09390844B2 Chip resistor 有权
标题翻译：贴片电阻
公开(公告)号：US09390844B2
公开(公告)日：2016-07-12
申请号：US14221822
申请日：2014-03-21
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Hun Cho , Young Key Joo Kim , Chang Ho Lee , Byung Sung Kang
IPC分类号： H01C1/012 , H01C7/00 , H01C7/18 , H01C17/00 , H01C17/065
CPC分类号： H01C7/003 , H01C7/18 , H01C17/006 , H01C17/06526 , H01C17/06533
摘要： A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.
摘要翻译：芯片电阻器可以包括：具有堆叠在其中的多个基板的主体; 多个电阻器，其形成在主体中，各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极，并且分别连接到暴露的电阻器的两个端部。

10. 发明授权

US09373430B2 Resistor component 有权
标题翻译：电阻元件
公开(公告)号：US09373430B2
公开(公告)日：2016-06-21
申请号：US13893423
申请日：2013-05-14
申请人： Viking Tech Corporation
发明人： Shih-Long Wei , Shen-Li Hsiao , Chien-Hung Ho
IPC分类号： H01C1/012 , H01C1/028 , H01C1/04 , H01C1/148 , H01C7/00
CPC分类号： H01C1/028 , H01C1/04 , H01C1/148 , H01C7/003
摘要： A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability.
摘要翻译：提供一种电阻器部件，包括其上涂覆有膜的陶瓷棒，在陶瓷棒的中间部分中形成在膜上的保护层，在陶瓷棒的两端形成在膜上的端电镀层，绝缘体形成在保护层上的层，以及形成在绝缘层上的指示电阻器部件的电阻的颜色编码标记。端镀层通过滚镀法形成，包括铜，锡，镍及其组合。因此，电阻器部件成本低并且通过简单的工艺制造，同时避免了由现有方法引起的孔或不完全密封的连接的发生。因此，电阻器组件具有高可靠性。

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