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1. 发明授权

US5399305A Dynamic gating of polymers for isotropic properties 失效
标题翻译：用于各向同性的聚合物的动态门控
公开(公告)号：US5399305A
公开(公告)日：1995-03-21
申请号：US73874
申请日：1993-06-09
申请人： Arthur Bross , Thomas Walsh
发明人： Arthur Bross , Thomas Walsh
IPC分类号： B29C45/26 , B29C45/00 , B29C45/27 , B29L31/34 , H05K3/00 , B29C45/17
CPC分类号： B29C45/2708 , B29C45/00 , B29C2045/0098 , B29K2105/0079 , H05K3/0014
摘要： A polymeric article having isotropic properties is fabricated from anisotropic materials by orienting the polymer, as well as any fillers, in different directions at different planes through the polymeric article. In a first embodiment, molten polymer is passed between movable gate members (32 and 34) into cavity (30) of mold (28). The movable gate members (32 and 34) impart a strain on the molten polymer by moving in opposite directions (33 and 35) while the molten polymer is dispensed into the cavity (30). Reciprocating the movable gate members (32 and 34) yields a herringbone pattern. Having at least one movable gate member (38) have comb-like projections (40) can assure the strain is imparted deeper into the thickness of the polymeric article. In a second embodiment, molten polymer is passed through movable gates (96 and 100) on perpendicular sides of a mold cavity (94 and 98) where one movable gate (96) is located towards the top of the mold (84) and the other movable gate (100) is located towards the bottom of the mold (84). The gates (94 and 98) are simultaneously driven in directions (68 and 70) along their respective cavity sides while injecting polymer into the cavity. The finished article has a top layer (56) has polymer oriented (58) in a first direction and a bottom layer (52) with polymer oriented (54) in a perpendicular direction. Polymer is randomly oriented (62) between the top and bottom layer (56 and 52).
摘要翻译：具有各向同性特性的聚合物由各向异性材料制成，通过在聚合物制品的不同平面上使聚合物以及任何填料沿不同方向取向。在第一实施例中，熔融聚合物在可移动门件（32和34）之间通到模具（28）的空腔（30）中。可移动门构件（32和34）通过在熔融聚合物分配到空腔（30）中的同时沿相反方向（33和35）移动而对熔融聚合物施加应变。往复运动的门构件（32和34）产生人字形图案。具有至少一个可移动门构件（38）具有梳状突起（40）可以确保应变被更深地赋予聚合物制品的厚度。在第二实施例中，熔融聚合物在模腔（94和98）的垂直侧通过可移动门（96和100），其中一个可移动门（96）朝向模具（84）的顶部定位，而另一个活动门（100）位于模具（84）的底部。沿着其各自的空腔侧同时沿方向（68和70）驱动门（94和98），同时将聚合物注入空腔。最终制品具有在第一方向上具有聚合物取向（58）的顶层（56）和在垂直方向上具有聚合物取向（54）的底层（52）。聚合物在顶层和底层（56和52）之间随机取向（62）。

2. 发明授权

US5244378A Apparatus for dynamic gating of polymers for producing molded articles with isotropic properties 失效
标题翻译：用于生产具有各向同性的模制品的聚合物的动态门控装置
公开(公告)号：US5244378A
公开(公告)日：1993-09-14
申请号：US806499
申请日：1991-12-13
申请人： Arthur Bross , Thomas Walsh
发明人： Arthur Bross , Thomas Walsh
IPC分类号： B29C45/26 , B29C45/00 , B29C45/27 , B29L31/34 , H05K3/00
CPC分类号： B29C45/2708 , B29C45/00 , B29C2045/0098 , B29K2105/0079 , H05K3/0014
摘要： A polymeric article having isotropic properties is fabricated from anisotropic materials by orienting the polymer, as well as any fillers, in different directions at different planes through the polymeric article. In a first embodiment, molten polymer is passed between movable gate members (32 and 34) into cavity (30) of mold (28). The movable gate members (32 and 34) impart a strain on the molten polymer by moving in opposite directions (33 and 35) while the molten polymer is dispensed into the cavity (30). Reciprocating the movable gate members (32 and 34) yields a herringbone pattern. Having at least one movable gate member (38) have comb-like projections (40) can assure the strain is imparted deeper into the thickness of the polymeric article. In a second embodiment, molten polymer is passed through movable gates (96 and 100) on perpendicular sides of a mold cavity (94 and 98) where one movable gate (96) is located towards the top of the mold (84) and the other movable gate (100) is located towards the bottom of the mold (84). The gates (94 and 98) are simultaneously driven in directions (68 and 70) along their respective cavity sides while injecting polymer into the cavity. The finished article has a top layer (56) has polymer oriented (58) in a first direction and a bottom layer (52) with polymer oriented (54) in a perpendicular direction. Polymer is randomnly oriented (62) between the top and bottom layer (56 and 52).
摘要翻译：具有各向同性特性的聚合物由各向异性材料制成，通过在聚合物制品的不同平面上使聚合物以及任何填料沿不同方向取向。在第一实施例中，熔融聚合物在可移动门件（32和34）之间通到模具（28）的空腔（30）中。可移动门构件（32和34）通过在熔融聚合物分配到空腔（30）中的同时沿相反方向（33和35）移动而对熔融聚合物施加应变。往复运动的门构件（32和34）产生人字形图案。具有至少一个可移动门构件（38）具有梳状突起（40）可以确保应变被更深地赋予聚合物制品的厚度。在第二实施例中，熔融聚合物在模腔（94和98）的垂直侧通过可移动门（96和100），其中一个可移动门（96）朝向模具（84）的顶部定位，而另一个活动门（100）位于模具（84）的底部。沿着其各自的空腔侧同时沿方向（68和70）驱动门（94和98），同时将聚合物注入空腔。最终制品具有在第一方向上具有聚合物取向（58）的顶层（56）和在垂直方向上具有聚合物取向（54）的底层（52）。聚合物在顶层和底层（56和52）之间是随机取向的（62）。

3. 发明授权

US5205738A High density connector system 失效
标题翻译：高密度连接器系统
公开(公告)号：US5205738A
公开(公告)日：1993-04-27
申请号：US863643
申请日：1992-04-03
申请人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
发明人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
IPC分类号： H01R4/02 , H01R12/52 , H01R43/02 , H01R43/16 , H05K3/40
CPC分类号： H01R12/526 , H05K3/4015 , H05K3/4046 , H01R4/02 , H01R43/02 , H01R43/16 , H05K2201/0129 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/09754 , H05K2201/10234 , H05K2203/1105 , H05K2203/1189 , H05K3/403 , Y10S29/044 , Y10S439/951 , Y10T29/49167 , Y10T29/49853 , Y10T29/53191
摘要： There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.
摘要翻译：公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。这些迹线的输出触点由小金属球提供。金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。

4. 发明授权

US5362360A Method and product for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces 失效
标题翻译：通过往复式模具表面展现各向异性特性的挤出材料的方法和产品
公开(公告)号：US5362360A
公开(公告)日：1994-11-08
申请号：US157810
申请日：1993-11-24
申请人： Arthur Bross , Thomas J. Walsh
发明人： Arthur Bross , Thomas J. Walsh
IPC分类号： B29C47/18 , B44C1/22 , B28B3/20 , B32B5/12 , C23F1/00
CPC分类号： B29C47/18 , B29C47/0021 , B29K2105/0079 , B29K2995/0044 , B29K2995/0054 , Y10S428/901 , Y10T428/24058
摘要： Two movable die members that are situated opposed to each other in an extrusion die assembly, the axis of movement of the two die members is parallel to the longer sides of the rectangular cross-section of a throat opening of the extrusion die assembly. The members move in a reciprocating back and forward movement to impart shearing forces to the surface of the extruded material with a resultant multiaxial orientation of the molecules or fibrils.
摘要翻译：两个可移动的模具构件在挤出模头组件中彼此相对定位，两个模具构件的运动轴线平行于挤出模头组件的喉部开口的矩形横截面的长边。这些构件在往复运动中往复移动并向前移动，以使分子或原纤维的多轴取向产生剪切力到挤压材料的表面。

5. 发明授权

US5225777A High density probe 失效
标题翻译：高密度探头
公开(公告)号：US5225777A
公开(公告)日：1993-07-06
申请号：US830875
申请日：1992-02-04
申请人： Arthur Bross , Thomas J. Walsh
发明人： Arthur Bross , Thomas J. Walsh
IPC分类号： G01R1/073 , H01L21/66
CPC分类号： G01R1/07342
摘要： There is disclosed a high density test probe assembly, and method of fabricating it. The probe assembly has a multitude of wire-like probe elements whose exposed tips are spaced on centers X and Y to match the centers of closely spaced surface pads of a VLSI circuit. Interconnections to and from the probe elements (for connection to external test equipment) are provided by a multi-layer arrangement of insulating and conducting layers within the body of the probe assembly. The tips of the probe elements are canted relative to vertical so that when the probe assembly is pushed down into mating position onto a VLSI circuit, the probe elements uniformly deflect laterally in one direction only and give a "wiping" action in contacting surface pads of the VLSI circuit together with a desired normal contact force. The method of fabricating the probe assembly includes forcing all of the probe elements through staggered vias in the multilayer arrangement. This step simultaneously makes desired electrical interconnections to the probe elements, precisely aligns and captivates the probe elements, and bends (cants) their ends so that they deflect uniformly in one direction only when the probe assembly is mated with a VLSI circuit.
摘要翻译：公开了一种高密度测试探针组件及其制造方法。探针组件具有多个线状探针元件，其暴露的尖端在中心X和Y上间隔开以匹配VLSI电路的紧密间隔的表面焊盘的中心。与探头元件（用于连接到外部测试设备）的互连通过探针组件的主体内的绝缘和导电层的多层布置提供。探针元件的尖端相对于垂直方向倾斜，使得当探针组件被向下推入到VLSI电路中的配合位置时，探针元件仅在一个方向上均匀地偏转横向，并在接触表面垫中的“擦拭” VLSI电路与所需的正常接触力一起。制造探针组件的方法包括通过多层布置中的交错通孔迫使所有探针元件。该步骤同时使得对探针元件的期望的电互连，精确地对准和捕获探针元件，并且使其端部弯曲（倾斜），使得仅当探针组件与VLSI电路配合时，它们在一个方向上均匀偏转。

6. 发明授权

US5276964A Method of manufacturing a high density connector system 失效
标题翻译：制造高密度连接器系统的方法
公开(公告)号：US5276964A
公开(公告)日：1994-01-11
申请号：US2159
申请日：1993-01-11
申请人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
发明人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
IPC分类号： H01R4/02 , H01R12/52 , H01R43/02 , H01R43/16 , H05K3/40 , H05K3/20
CPC分类号： H01R12/526 , H05K3/4015 , H05K3/4046 , H01R4/02 , H01R43/02 , H01R43/16 , H05K2201/0129 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/09754 , H05K2201/10234 , H05K2203/1105 , H05K2203/1189 , H05K3/403 , Y10S29/044 , Y10S439/951 , Y10T29/49167 , Y10T29/49853 , Y10T29/53191
摘要： There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.
摘要翻译：公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。这些迹线的输出触点由小金属球提供。金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。球可接触绝缘体两层的导电迹线，从而提供导电迹线之间的电连接。制造连接器系统的方法包括以下步骤：将塑料体加热到升高的温度，并通过或抵靠相应的导电迹线驱动小金属球并进入塑料体，由此吸收它。导电迹线可以是焊接电镀的。在与导电迹线接触球后，可以回流焊接电镀。

7. 发明授权

US5259110A Method for forming a multilayer microelectronic wiring module 失效
标题翻译：多层微电子布线模块的形成方法
公开(公告)号：US5259110A
公开(公告)日：1993-11-09
申请号：US863627
申请日：1992-04-03
申请人： Arthur Bross , Robert O. Lussow , Thomas J. Walsh
发明人： Arthur Bross , Robert O. Lussow , Thomas J. Walsh
IPC分类号： H01L21/48 , H01L23/14 , H01L23/498 , H05K1/11 , H05K3/28 , H05K3/40 , H05K3/46 , H05K3/36 , B29C47/00 , B32B31/20 , H01K3/10
CPC分类号： H05K3/4632 , H01L21/4857 , H01L23/145 , H01L23/49822 , H05K3/4617 , H01L2924/0002 , H01L2924/09701 , H05K2201/0129 , H05K2201/0141 , H05K2201/10234 , H05K2201/10378 , H05K2201/10416 , H05K3/28 , H05K3/4046 , Y10T29/49126 , Y10T29/49165
摘要： A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

8. 发明授权

US5251806A Method of forming dual height solder interconnections 失效
标题翻译：形成双高度焊料互连的方法
公开(公告)号：US5251806A
公开(公告)日：1993-10-12
申请号：US870647
申请日：1992-04-16
申请人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
发明人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
IPC分类号： H01L21/60 , H01L23/485 , H05K3/34 , H01L21/283
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/11901 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13676 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L24/16 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H05K3/3431 , H05K3/3457
摘要： The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
摘要翻译：本发明一般涉及新的互连及其制造方法，更具体地说，涉及一种细长的焊料互连及其制造方法。在电子载体上，形成焊盘，在其上沉积焊料块并用金属层封盖，从而形成细长的焊料互连。现在可以通过在已经被金属层覆盖的第一焊料块上形成第二焊料块来形成另外细长的焊料互连。可以通过用金属覆盖层封盖前述焊料块和/或最后的焊料块来形成附加的细长焊料互连。或者，封装层可以是形成在焊料块的侧壁上的侧壁间隔物的形式。

9. 发明授权

US5130779A Solder mass having conductive encapsulating arrangement 失效
标题翻译：具有导电包装安排的焊接质量
公开(公告)号：US5130779A
公开(公告)日：1992-07-14
申请号：US540256
申请日：1990-06-19
申请人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
发明人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
IPC分类号： H01L21/60 , H01L23/485 , H05K3/34
CPC分类号： H01L24/13 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/13082 , H01L2224/131 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13676 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H05K3/3431 , H05K3/3457
摘要： The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
摘要翻译：本发明一般涉及新的互连及其制造方法，更具体地说，涉及一种细长的焊料互连及其制造方法。在电子载体上，形成焊盘，在其上沉积焊料块并用金属层封盖，从而形成细长的焊料互连。现在可以通过在已经被金属层覆盖的第一焊料块上形成第二焊料块来形成另外细长的焊料互连。可以通过用金属覆盖层封盖前述焊料块和/或最后的焊料块来形成附加的细长焊料互连。或者，封装层可以是形成在焊料块的侧壁上的侧壁间隔物的形式。

10. 发明授权

US5517751A Multilayer microelectronic wiring module and method for forming the same 失效
标题翻译：多层微电子布线模块及其形成方法
公开(公告)号：US5517751A
公开(公告)日：1996-05-21
申请号：US145273
申请日：1993-10-29
申请人： Arthur Bross , Robert O. Lussow , Thomas J. Walsh
发明人： Arthur Bross , Robert O. Lussow , Thomas J. Walsh
IPC分类号： H01L21/48 , H01L23/14 , H01L23/498 , H05K1/11 , H05K3/28 , H05K3/40 , H05K3/46 , H05K3/36
CPC分类号： H05K3/4632 , H01L21/4857 , H01L23/145 , H01L23/49822 , H05K3/4617 , H01L2924/0002 , H01L2924/09701 , H05K2201/0129 , H05K2201/0141 , H05K2201/10234 , H05K2201/10378 , H05K2201/10416 , H05K3/28 , H05K3/4046 , Y10T29/49126 , Y10T29/49165
摘要： A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.
摘要翻译：通过将通过注射，压缩或其它合适的模制技术形成的各个热塑性聚合物片层压在一起形成的多层微电子模块。优选通过原位插入成型将形成所需形状和尺寸的通孔的金属片插入模制板中。通孔提供从片材的顶部到底部表面的电连接。

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