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1. 发明授权

US5305523A Method of direct transferring of electrically conductive elements into a substrate 失效
标题翻译：将导电元件直接转印到基板中的方法
公开(公告)号：US5305523A
公开(公告)日：1994-04-26
申请号：US996445
申请日：1992-12-24
申请人： Arthur Bross , Julian G. Cempa , Robert O. Lussow , James A. McDonald , Donald E. Myers , Joseph D. Peruffo , Thomas J. Walsh , Thomas J. Walsh, III
发明人： Arthur Bross , Julian G. Cempa , Robert O. Lussow , James A. McDonald , Donald E. Myers , Joseph D. Peruffo , Thomas J. Walsh , Thomas J. Walsh, III
IPC分类号： H01L23/12 , H01L21/48 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/04 , H05K3/20 , H05K3/40 , H05K3/46 , H05K3/30
CPC分类号： H01L21/4839 , H05K1/16 , H05K3/4046 , H05K1/0306 , H05K1/092 , H05K2201/0129 , H05K2201/0141 , H05K2201/10416 , H05K2203/033 , H05K3/403 , Y10T29/4913 , Y10T29/49144 , Y10T29/53174
摘要： A method is provided for forming one or more electrical conductors in a multilayer structure such as a computer component during a punching operation. A conducting sheet is placed in direct contact with a sheet of a deformable dielectric material. A punch is used to form a conducting slug from the sheet and to simultaneously transfer the slug into the dielectric material. During the transfer operation, a portion of the dielectric material is displaced so as to cause a mechanical interference between the slug and dielectric material.
摘要翻译：提供一种用于在冲压操作期间在诸如计算机部件的多层结构中形成一个或多个电导体的方法。将导电片放置成与可变形电介质材料的片材直接接触。使用冲头从片材形成导电块并同时将块塞转移到电介质材料中。在传送操作期间，电介质材料的一部分被移位，以便引起芯块和电介质材料之间的机械干涉。

2. 发明授权

US5205738A High density connector system 失效
标题翻译：高密度连接器系统
公开(公告)号：US5205738A
公开(公告)日：1993-04-27
申请号：US863643
申请日：1992-04-03
申请人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
发明人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
IPC分类号： H01R4/02 , H01R12/52 , H01R43/02 , H01R43/16 , H05K3/40
CPC分类号： H01R12/526 , H05K3/4015 , H05K3/4046 , H01R4/02 , H01R43/02 , H01R43/16 , H05K2201/0129 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/09754 , H05K2201/10234 , H05K2203/1105 , H05K2203/1189 , H05K3/403 , Y10S29/044 , Y10S439/951 , Y10T29/49167 , Y10T29/49853 , Y10T29/53191
摘要： There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.
摘要翻译：公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。这些迹线的输出触点由小金属球提供。金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。

3. 发明授权

US5276964A Method of manufacturing a high density connector system 失效
标题翻译：制造高密度连接器系统的方法
公开(公告)号：US5276964A
公开(公告)日：1994-01-11
申请号：US2159
申请日：1993-01-11
申请人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
发明人： Herbert R. Anderson, Jr. , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
IPC分类号： H01R4/02 , H01R12/52 , H01R43/02 , H01R43/16 , H05K3/40 , H05K3/20
CPC分类号： H01R12/526 , H05K3/4015 , H05K3/4046 , H01R4/02 , H01R43/02 , H01R43/16 , H05K2201/0129 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/09754 , H05K2201/10234 , H05K2203/1105 , H05K2203/1189 , H05K3/403 , Y10S29/044 , Y10S439/951 , Y10T29/49167 , Y10T29/49853 , Y10T29/53191
摘要： There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.
摘要翻译：公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。这些迹线的输出触点由小金属球提供。金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。球可接触绝缘体两层的导电迹线，从而提供导电迹线之间的电连接。制造连接器系统的方法包括以下步骤：将塑料体加热到升高的温度，并通过或抵靠相应的导电迹线驱动小金属球并进入塑料体，由此吸收它。导电迹线可以是焊接电镀的。在与导电迹线接触球后，可以回流焊接电镀。

4. 发明授权

US5401911A Via and pad structure for thermoplastic substrates and method and apparatus for forming the same 失效
标题翻译：用于热塑性基材的通孔和垫结构及其形成方法和装置
公开(公告)号：US5401911A
公开(公告)日：1995-03-28
申请号：US863645
申请日：1992-04-03
申请人： Herbert Anderson , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
发明人： Herbert Anderson , Arthur Bross , Julian G. Cempa , Robert O. Lussow , Donald E. Myers , Thomas J. Walsh
IPC分类号： B29C65/70 , H01R12/04 , H01R43/20 , H05K1/11 , H05K3/00 , H05K3/36 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4046 , H01L2224/11003 , H01L2224/11334 , H05K2201/0129 , H05K2201/0141 , H05K2201/091 , H05K2201/10234 , H05K2203/1105 , H05K2203/1189 , Y10T29/49126 , Y10T29/49153
摘要： An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer. Perfecting features of the substrate and method and apparatus for forming the substrate, embedding to a selected depth to form protrusions and recesses to assist in registration of a substrate layer with another substrate layer, metallization to form pads, improved connection between metallization patterns on the substrate and the conductive elements, the regulation of pressurization of substrate material by means of differently shaped dimples or a renewable surface and several alternative arrangements for positioning and embedding the conductive elements. Multiple types of conductive elements may be simultaneously embedded to different depths in a single substrate and from either or both sides thereof to form a variety of substrate structures.
摘要翻译：通过在热塑性材料（其优选为液晶聚合物）中将诸如针的导电元件嵌入一个或多个球或球体上而形成改进的连接。衬底可以被加热以便于嵌入过程，其中衬底层的材料在压力下被回流以通过预加载力来保持导电元件。与引脚或多个导电元件的这种连接的形成允许独立于连接的纵横比，因此独立于衬底上导电图案的特征尺寸和衬底层的厚度。衬底的完善特征以及用于形成衬底的方法和装置，嵌入到所选择的深度以形成突出和凹陷以辅助衬底层与另一衬底层对准，金属化以形成衬垫，改善衬底上的金属化图案之间的连接和导电元件，通过不同形状的凹坑或可再生表面调节衬底材料的加压以及用于定位和嵌入导电元件的几种替代布置。多种类型的导电元件可以同时嵌入到单个基板中的不同深度并且从其一侧或两侧嵌入到不同深度以形成各种基板结构。

5. 发明授权

US5303862A Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures 失效
标题翻译：用于连接I / O引脚和创建多层结构的单步电/机械连接过程
公开(公告)号：US5303862A
公开(公告)日：1994-04-19
申请号：US999440
申请日：1992-12-31
申请人： Arthur Bross , James J. Hedrick , Robert D. Johnson , Robert O. Lussow , James R. Lyerla, Jr. , Donald E. Myers , Joseph D. Peruffo , Krishna G. Sachdev , Thomas J. Walsh
发明人： Arthur Bross , James J. Hedrick , Robert D. Johnson , Robert O. Lussow , James R. Lyerla, Jr. , Donald E. Myers , Joseph D. Peruffo , Krishna G. Sachdev , Thomas J. Walsh
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498 , H01L25/065 , H05K3/28 , H05K3/30 , H05K3/40 , H05K3/46
CPC分类号： H01L25/0657 , H01L21/4857 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/29 , H01L24/83 , H05K3/4617 , H01L2224/16237 , H01L2224/29101 , H01L2224/29298 , H01L2224/8319 , H01L2224/838 , H01L2225/06586 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H01L2924/15312 , H05K2201/096 , H05K2201/10234 , H05K2201/10977 , H05K2203/1105 , H05K3/28 , H05K3/305 , H05K3/4046
摘要： A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).
摘要翻译：单步电/机械连接工艺利用图案化在衬底（1或21）上的粘合剂层（3或26）来机械连接多层结构（28）中的相邻衬底或将销（2）组件连接到设备（5）。在优选实施例中，粘合剂层（3或26）和基底（1或21）由在热和压力下进行酯交换的材料制成，以在它们之间产生非常强的粘结。粘合剂层（3或26）位于针连接器组件或成型/片材（21）中的对准孔（24）内并且不覆盖焊料（4），从而允许粘结冶金以形成正电连接在多层结构（28）中的销（2）和衬垫（6）和相邻球体（22）之间。

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