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1. 发明授权

US11638979B2 Additive manufacturing of polishing pads 有权
公开(公告)号：US11638979B2
公开(公告)日：2023-05-02
申请号：US16897195
申请日：2020-06-09
申请人： Applied Materials, Inc
发明人： Uma Sridhar , Sivapackia Ganapathiappan , Ashwin Murugappan Chockalingam , Rajeev Bajaj , Daniel Redfield , Mayu Felicia Yamamura , Yingdong Luo , Nag B. Patibandla
IPC分类号： B24B37/24 , C09D11/102 , C09D11/101 , B33Y80/00 , B29C64/112 , B33Y10/00 , B33Y70/00 , H01L21/306 , B29K63/00 , B29K75/00 , B29L31/00
摘要： A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

2. 发明授权

US11530478B2 Method for forming a hydrophobic and icephobic coating 有权
公开(公告)号：US11530478B2
公开(公告)日：2022-12-20
申请号：US16795431
申请日：2020-02-19
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Mei Chang , Deenesh Padhi
IPC分类号： C23C16/30 , C23C16/44
摘要： A method of depositing a coating and a layered structure is provided. A coating is deposited on a substrate to make a layered structure, such that an interface between the coating and the substrate is formed. The coating includes silicon, oxygen, and carbon, where the carbon doping in the coating increases between the interface and the top surface of the coating. The top surface of the coating is inherently hydrophobic and icephobic, and reduces the wetting of water or ice film on the layered structure, without requiring reapplication of the coating.

3. 发明授权

US11453097B2 Chemical mechanical polishing apparatus and methods 有权
公开(公告)号：US11453097B2
公开(公告)日：2022-09-27
申请号：US16691581
申请日：2019-11-21
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
IPC分类号： B24B37/04 , B24B57/02 , H01L21/67 , H01L21/321 , H01L21/306 , H01L21/304 , B24B37/11 , B24B37/30
摘要： A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

4. 发明授权

US11446788B2 Precursor formulations for polishing pads produced by an additive manufacturing process 有权
公开(公告)号：US11446788B2
公开(公告)日：2022-09-20
申请号：US16541641
申请日：2019-08-15
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Ashwin Chockalingam , Ashavani Kumar , Fred C. Redeker , Nag B. Patibandla
IPC分类号： B24D18/00 , B24D3/28 , B33Y80/00 , B33Y10/00
摘要： Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

5. 发明申请

US20220001507A1 CORRECTION OF FABRICATED SHAPES IN ADDITIVE MANUFACTURING 有权
公开(公告)号：US20220001507A1
公开(公告)日：2022-01-06
申请号：US17478836
申请日：2021-09-17
申请人： Applied Materials, Inc.
发明人： Mayu Felicia Yamamura , Jason Garcheung Fung , Daniel Redfield , Rajeev Bajaj , Hou T. Ng
IPC分类号： B24B37/26 , B24D18/00 , B29C64/393 , B29C64/112 , B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , B24B37/20
摘要： A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.

6. 发明授权

US10953515B2 Apparatus and method of forming a polishing pads by use of an additive manufacturing process 有权
公开(公告)号：US10953515B2
公开(公告)日：2021-03-23
申请号：US15352647
申请日：2016-11-16
申请人： Applied Materials, Inc.
发明人： Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Daniel Redfield , Rajeev Bajaj , Mahendra C. Orilall , Hou T. Ng , Jason G. Fung , Mayu Yamamura
IPC分类号： B24B37/24 , B24B37/22 , B24B37/26 , B29C64/112 , B24D3/28 , B24D11/00 , B24D11/04 , B33Y10/00 , B33Y80/00 , B29C35/08 , C09D4/00 , C09G1/16 , B33Y70/00 , B29K33/04
摘要： Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

7. 发明申请

US20210069856A1 Printing a Chemical Mechanical Polishing Pad 有权
公开(公告)号：US20210069856A1
公开(公告)日：2021-03-11
申请号：US17102181
申请日：2020-11-23
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Barry Lee Chin , Terrance Y. Lee
IPC分类号： B24B37/26 , B33Y80/00 , B24D18/00 , B29C64/393 , B33Y10/00 , B29C35/08 , B29C64/112 , B33Y30/00 , B33Y50/02 , B29C64/209
摘要： A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

8. 发明申请

US20200086452A1 Chemical Mechanical Polishing Apparatus and Methods 审中-公开
公开(公告)号：US20200086452A1
公开(公告)日：2020-03-19
申请号：US16691581
申请日：2019-11-21
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
IPC分类号： B24B37/04 , B24B57/02 , H01L21/67 , H01L21/321 , H01L21/306
摘要： A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

9. 发明申请

US20160136787A1 ADVANCED POLISHING PAD MATERIALS AND FORMULATIONS 审中-公开
标题翻译：高级抛光垫材料和配方
公开(公告)号：US20160136787A1
公开(公告)日：2016-05-19
申请号：US15002384
申请日：2016-01-20
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Ashwin Chockalingam
IPC分类号： B24D11/00 , B24B37/24 , B24D3/28
CPC分类号： B24D11/001 , B24B37/22 , B24B37/24 , B24B37/26 , B24D3/28 , B24D11/04 , B33Y10/00 , B33Y70/00 , B33Y80/00
摘要： Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
摘要翻译：本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。

10. 发明申请

US20160027668A1 CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS 审中-公开
标题翻译：化学机械抛光装置及方法
公开(公告)号：US20160027668A1
公开(公告)日：2016-01-28
申请号：US14341762
申请日：2014-07-25
申请人： Applied Materials, Inc.
发明人： Thomas H. Osterheld , Rajeev Bajaj
IPC分类号： H01L21/67 , H01L21/3105 , H01L21/321 , H01L21/306
CPC分类号： H01L21/30625 , B24B37/042 , B24B37/10 , B24B57/02 , H01L21/31055 , H01L21/3212 , H01L21/67075 , H01L21/67092
摘要： Embodiments of the invention provide a non-uniform substrate polishing apparatus that includes a polishing pad with two or more zones, each zone adapted to apply a different slurry chemistry to a different area on a substrate to create a film thickness profile on the substrate having at least two different film thicknesses. Polishing methods and systems adapted to polish substrates are also provided, as are numerous other aspects.
摘要翻译：本发明的实施例提供了一种不均匀的衬底抛光装置，其包括具有两个或更多个区域的抛光垫，每个区域适于将不同的浆料化学品施加到衬底上的不同区域上，以在衬底上形成膜厚分布，最少两个不同的膜厚度。还提供了适于抛光底物的抛光方法和系统，以及许多其它方面。

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