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1. 发明授权

US10500694B2 Chemical mechanical polishing apparatus and methods 有权
公开(公告)号：US10500694B2
公开(公告)日：2019-12-10
申请号：US15635770
申请日：2017-06-28
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
IPC分类号： B24B37/04 , B24B57/02 , H01L21/321 , H01L21/306 , H01L21/67
CPC分类号： B24B37/044 , B24B57/02 , H01L21/30625 , H01L21/3212 , H01L21/67075 , H01L21/67092
摘要： A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

2. 发明授权

US11453097B2 Chemical mechanical polishing apparatus and methods 有权
公开(公告)号：US11453097B2
公开(公告)日：2022-09-27
申请号：US16691581
申请日：2019-11-21
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
IPC分类号： B24B37/04 , B24B57/02 , H01L21/67 , H01L21/321 , H01L21/306 , H01L21/304 , B24B37/11 , B24B37/30
摘要： A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

3. 发明申请

US20200086452A1 Chemical Mechanical Polishing Apparatus and Methods 审中-公开
公开(公告)号：US20200086452A1
公开(公告)日：2020-03-19
申请号：US16691581
申请日：2019-11-21
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
IPC分类号： B24B37/04 , B24B57/02 , H01L21/67 , H01L21/321 , H01L21/306
摘要： A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

4. 发明申请

US20140308813A1 METHODS AND APPARATUS FOR A NON-CONTACT EDGE POLISHING MODULE USING ION MILLING 审中-公开
标题翻译：使用离心铣削的非接触边缘抛光模块的方法和装置
公开(公告)号：US20140308813A1
公开(公告)日：2014-10-16
申请号：US13862696
申请日：2013-04-15
申请人： APPLIED MATERIALS, INC.
发明人： Samuel Hsu , Hung Chen , Jay Gurusamy , Gautam Dandavate
IPC分类号： H01L21/67 , H01L21/306
CPC分类号： H01L21/30625 , H01J37/3053 , H01J2237/30466 , H01J2237/30472 , H01J2237/3151 , H01L21/3065
摘要： Systems, methods and apparatus for polishing a substrate edge without mechanical contact are disclosed. The apparatus includes a rotatable chuck configured to secure a substrate, an ion milling machine configured to project an ion beam on an edge of the substrate and to sputter off matter from the substrate, and an endpoint detection sensor configured to determine if a material removal endpoint of the substrate has been reached. Numerous additional features are disclosed.
摘要翻译：公开了用于在没有机械接触的情况下抛光衬底边缘的系统，方法和装置。该设备包括构造成固定基板的可旋转卡盘，被配置为将离子束投影在基板的边缘上并从基板溅射物质的离子铣床，以及端点检测传感器，被配置为确定材料去除端点的基底已经达到。公开了许多附加特征。

5. 发明申请

US20150336236A1 CONDITIONING OF GROOVING IN POLISHING PADS 有权
标题翻译：抛光垫的调理
公开(公告)号：US20150336236A1
公开(公告)日：2015-11-26
申请号：US14285545
申请日：2014-05-22
申请人： Applied Materials, Inc.
发明人： Hung Chen , Rajeev Bajaj , Brian J. Brown , Robert T. Lum , Fred C. Redeker
IPC分类号： B24B53/017 , H01L21/306 , B26F3/00 , H01L21/268 , B24B37/26 , B23K26/36
CPC分类号： B24B53/017 , B23K26/36 , B24B37/26 , B26D3/06 , B26F3/004
摘要： Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.
摘要翻译：除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。

6. 发明申请

US20170297163A1 CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS 审中-公开
公开(公告)号：US20170297163A1
公开(公告)日：2017-10-19
申请号：US15635770
申请日：2017-06-28
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
IPC分类号： B24B37/04 , H01L21/321 , B24B57/02
CPC分类号： B24B37/044 , B24B57/02 , H01L21/30625 , H01L21/3212 , H01L21/67075 , H01L21/67092
摘要： A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.

7. 发明授权

US09308623B2 Multi-disk chemical mechanical polishing pad conditioners and methods 有权
标题翻译：多盘化学机械抛光垫调节剂及方法
公开(公告)号：US09308623B2
公开(公告)日：2016-04-12
申请号：US14256704
申请日：2014-04-18
申请人： Applied Materials, Inc.
发明人： Hung Chen , Shou-Sung Chang , Jason Garcheung Fung , Matthew A. Gallelli , Paul D. Butterfield , Kevin Chou
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.
摘要翻译：衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。多个垫调节器组件可以附接到主组件基板。在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。还提供了调整抛光垫的方法，以及其它方面。

8. 发明申请

US20140315473A1 MULTI-DISK CHEMICAL MECHANICAL POLISHING PAD CONDITIONERS AND METHODS 有权
标题翻译：多盘化学机械抛光垫片调节器及方法
公开(公告)号：US20140315473A1
公开(公告)日：2014-10-23
申请号：US14256704
申请日：2014-04-18
申请人： Applied Materials, Inc.
发明人： Hung Chen , Shou-Sung Chang , Jason Garcheung Fung , Matthew A. Gallelli , Paul D. Butterfield , Kevin Chou
IPC分类号： B24B53/017
CPC分类号： B24B53/017
摘要： A pad conditioner may include multiple independently mounted conditioning elements configured to condition a polishing pad used in, e.g., a chemical mechanical polishing (CMP) process. In some embodiments, the pad conditioner may include a main assembly disk and a main assembly base plate attached to the main assembly disk via a gimbal connection. A plurality of pad conditioner assemblies may be attached to the main assembly base plate. In some embodiments, each pad conditioner assembly may include a pad conditioner disk attached to the main assembly base plate, a pad conditioner base attached to the pad conditioner disk via a gimbal connection, and a conditioning element attached to the pad conditioner base. Methods of conditioning a polishing pad are also provided, as are other aspects.
摘要翻译：衬垫调节器可以包括多个独立安装的调节元件，其被配置为调节在例如化学机械抛光（CMP）工艺中使用的抛光垫。在一些实施例中，垫调节器可以包括主组件盘和通过万向接头连接到主组件盘的主组件底板。多个垫调节器组件可以附接到主组件基板。在一些实施例中，每个垫调节器组件可以包括附接到主组件基板的垫调节器盘，通过万向接头连接到垫调节盘的垫调节器基座和附接到垫调节器基座的调节元件。还提供了调整抛光垫的方法，以及其它方面。

9. 发明授权

US09486893B2 Conditioning of grooving in polishing pads 有权
标题翻译：调理抛光垫中的切槽
公开(公告)号：US09486893B2
公开(公告)日：2016-11-08
申请号：US14285545
申请日：2014-05-22
申请人： Applied Materials, Inc.
发明人： Hung Chen , Rajeev Bajaj , Brian J. Brown , Robert T. Lum , Fred C. Redeker
IPC分类号： H01L21/302 , B24B53/017 , B24B37/26 , B26F3/00 , B23K26/36 , B26D3/06
CPC分类号： B24B53/017 , B23K26/36 , B24B37/26 , B26D3/06 , B26F3/004
摘要： Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.
摘要翻译：除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。

10. 发明申请

US20150021498A1 CHEMICAL MECHANICAL POLISHING RETAINING RING METHODS AND APPARATUS 审中-公开
标题翻译：化学机械抛光保持环方法和装置
公开(公告)号：US20150021498A1
公开(公告)日：2015-01-22
申请号：US13944204
申请日：2013-07-17
申请人： Applied Materials, Inc.
发明人： Samuel Hsu , Jeonghoon Oh , Gautam Dandavate , Hung Chen
IPC分类号： B24B37/32 , G21K5/00 , B24C1/10
CPC分类号： B24B37/32
摘要： A chemical mechanical polishing (CMP) system includes a substrate held in a substrate holder having a substrate retaining ring, the substrate having a peripheral edge supported by the substrate retaining ring, the retaining ring including a polymer ring having a polymer contact portion in contact with at least a portion of the peripheral edge, wherein the polymer contact portion has a hardness that is greater than a remaining portion of the polymer ring. CMP methods and retaining ring apparatus for CMP are provided, as are numerous other aspects.
摘要翻译：化学机械抛光（CMP）系统包括保持在具有基板保持环的基板保持器中的基板，所述基板具有由基板保持环支撑的周边边缘，保持环包括聚合物环，聚合物环具有与所述外围边缘的至少一部分，其中所述聚合物接触部分具有大于所述聚合物环的剩余部分的硬度。提供了用于CMP的CMP方法和保持环装置，以及许多其它方面。

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