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    • 3. 发明授权
    • Transducer housing employing crimped leads
    • 使用压接引线的传感器外壳
    • US4513623A
    • 1985-04-30
    • US530525
    • 1983-09-09
    • Anthony D. KurtzJoseph R. Mallon, Jr.
    • Anthony D. KurtzJoseph R. Mallon, Jr.
    • G01L9/00G01L19/14G01L9/06
    • G01L19/0084G01L19/14G01L19/143
    • A transducer housing consists of a first and a second section. The first section contains an internal hollow into which a transistor header is mounted. The header, as mounted in the first section, is firmly secured within the section by means of a locking ring or other arrangement. Located in the internal hollow of the first section is a printed circuit board which has a plurality of apertures on the surface thereof each of which communicates with an extending tubular post on the opposite surface. Leads from the header are directed through the apertures in the printed circuit board and extend into the tubular posts. The second housing section is emplaced on the first section and contains a series of hollow metal tubular connectors or posts. These are inserted over the metal tubular posts of the header containing the leads and are crimped so that the posts of the transistor header as well as the leads are connected both electrically and mechanically to the tubular posts extending from the second housing section. Based on the above noted configuration, the housing sections serve to hold the transducer as mounted in the header in a firm and fixed position while enabling installation and interconnection of the transistor header in a rapid and simple manner based on the fact that the leads emanating from the header are crimped internally within the housing sections.
    • 传感器外壳由第一和第二部分组成。 第一部分包含安装晶体管集管的内部空心。 安装在第一部分中的头部通过锁定环或其他布置牢固地固定在该部分内。 位于第一部分的内部中空部分中的印刷电路板在其表面上具有多个孔,每个孔与相对表面上的延伸管状柱连通。 从集管引出的引导通过印刷电路板中的孔并延伸到管状柱中。 第二壳体部分放置在第一部分上并且包含一系列中空金属管状连接器或柱。 这些插入到包含引线的插头的金属管状柱上,并且被压接,使得晶体管集管的端子以及引线电连接和机械连接到从第二壳体部分延伸的管状柱体。 基于上述配置,壳体部分用于将固定在集管中的换能器固定在固定位置,同时能够以快速且简单的方式安装和互连晶体管集管,基于以下事实:从 插头内部压接在外壳部分内。
    • 9. 发明授权
    • Method for fabricating a high pressure piezoresistive transducer
    • 制造高压压阻式换能器的方法
    • US5702619A
    • 1997-12-30
    • US723519
    • 1996-09-30
    • Anthony D. KurtzAndrew V. BemisTimothy A. NunnAlexander A. Ned
    • Anthony D. KurtzAndrew V. BemisTimothy A. NunnAlexander A. Ned
    • G01L9/00H01L21/00B44C1/22
    • G01L9/0055
    • A method of fabricating a high pressure piezoresistive pressure transducer having a substantially linear pressure versus stress output over its full range of operation. The method involves bonding a carrier wafer having a dielectric isolating layer on one surface and a supporting member on the opposite surface, to a pattern wafer containing at least two single crystalline longitudinal piezoresistive sensing elements of a second conductivity. Both the pattern wafer and sections of the carrier wafer are etched leaving the piezoresistive sensing elements bonded directly to the dielectric isolating layer, and a diaphragm member having a deflecting portion and a non-deflecting portion. The diaphragm member is constructed to have an aspect ratio which is of the order of magnitude of one. The piezoresistive sensing elements have a large transverse piezoresistive coefficient normal to the plane of the diaphragm and both a large longitudinal piezoresistive coefficient and a small transverse piezoresistive coefficient in the plane of the diaphragm. One of the at least two piezoresistive sensing elements is positioned above the non-deflection portion of the diaphragm in an area of minimal longitudinal stress and the other is positioned above the deflecting portion of the diaphragm in an area of high compressive stress. The positioning of the second sensor over the deflecting portion of the diaphragm is selected so that there will be equal and opposite resistance changes registered from the sensors. The method results in an improved transducer design when compared to prior art devices.
    • 一种制造高压压阻式压力传感器的方法,该压力传感器在其全部操作范围内具有基本线性的压力与应力输出。 该方法包括将具有介电隔离层的载体晶片和相对表面上的支撑构件结合到包含至少两个具有第二导电性的单晶纵向压阻式感测元件的图案晶片。 蚀刻晶片和载体晶片的两个部分,留下直接结合到绝缘隔离层的压阻感测元件,以及具有偏转部分和非偏转部分的隔膜部件。 隔膜构件被构造成具有一个数量级的纵横比。 压阻感测元件具有垂直于隔膜平面的大的横向压阻系数,并且在隔膜平面中具有大的纵向压阻系数和小的横向压阻系数。 至少两个压阻感测元件中的一个在最小纵向应力的区域中位于隔膜的非偏转部分上方,另一个位于隔膜的偏转部分的高压缩应力区域的上方。 选择第二传感器在隔膜的偏转部分上的定位,使得从传感器注册相同和相反的阻力变化。 与现有技术的装置相比,该方法导致改进的换能器设计。
    • 10. 发明授权
    • Glass header structure for a semiconductor pressure transducer
    • 半导体压力传感器的玻璃头结构
    • US4764747A
    • 1988-08-16
    • US124089
    • 1987-11-23
    • Anthony D. KurtzJoseph R. MallonTimothy A. Nunn
    • Anthony D. KurtzJoseph R. MallonTimothy A. Nunn
    • G01L9/00G01L1/22
    • G01L19/0645G01L19/147
    • A glass header structure for a pressure transducer employs a cylindrical member fabricated from a borosilicate glass having a thermal expansion coefficient which matches silicon. The glass header has a central aperture which extends from the top to the bottom surface. Positioned about the central aperture are four smaller apertures located at 90 degree intervals and each containing an elongated terminal pin. The pins are of a nail head configuration with a flat top head of a larger diameter than the diameter of the apertures and of the main pin body. Affixed to the flat top surfaces of the terminal pins by means of ball bonding are wires which connect to the terminal areas of a semiconductor pressure transducer which is mounted over the central aperture of the header. In this manner, the glass header serves to electrically and mechanically isolate the semiconductor transducer from the external environment and to further provide isolation of the transducer from voltage and heating effects which are produced during the assembly process necessary to fabricate a complete transducer unit.
    • 用于压力传感器的玻璃头部结构采用由具有与硅相匹配的热膨胀系数的硼硅酸盐玻璃制成的圆柱形构件。 玻璃头部具有从顶部延伸到底部表面的中心孔。 围绕中心孔定位的是四个较小的孔,位于90度的间隔处,每个孔包含细长的端子销。 销具有指甲头构型,其具有直径大于孔和主销体直径的平顶头。 通过滚珠接合固定在端子销的平坦顶面上的是连接到安装在集管的中心孔上的半导体压力传感器的端子区域的导线。 以这种方式,玻璃接头用于将半导体换能器与外部环境电气和机械隔离,并进一步提供换能器与制造完整换能器单元所需组装过程中产生的电压和加热效应的隔离。