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1. 发明申请

US20050118936A1 Integrated pad and belt for chemical mechanical polishing 审中-公开
标题翻译：用于化学机械抛光的集成垫和皮带
公开(公告)号：US20050118936A1
公开(公告)日：2005-06-02
申请号：US10724350
申请日：2003-11-26
申请人： Anil Pant , Rahul Jairath , Kamal Mishra , Saket Chadda , Wilbur Krusell
发明人： Anil Pant , Rahul Jairath , Kamal Mishra , Saket Chadda , Wilbur Krusell
IPC分类号： B24B37/20 , B24B21/00 , B24B21/04 , B24B37/04 , B24B37/24 , B24D11/00 , B24D11/06 , H01L21/304 , B24B1/00
CPC分类号： B24B37/04 , B24B21/04 , B24D11/00 , B24D11/06
摘要： An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface.
摘要翻译：一种用于抛光表面的集成垫和带，包括与抛光垫一体的带，其形成无缝抛光表面。

2. 发明授权

US06616772B2 Methods for wafer proximity cleaning and drying 有权
标题翻译：晶圆接近清洗和干燥方法
公开(公告)号：US06616772B2
公开(公告)日：2003-09-09
申请号：US10309641
申请日：2002-12-03
申请人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
发明人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
IPC分类号： B08B300
CPC分类号： H01L21/67051 , B08B3/04 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： A method for preparing a semiconductor wafer surface is provided which includes providing a plurality of source inlets and a plurality of source outlets and applying isopropyl alcohol (IPA) vapor gas through the plurality of source inlets to the wafer surface when the plurality of source inlets and outlets are in close proximity to the wafer surface. The method also includes applying a fluid through the plurality of source inlets to the wafer surface while applying the IPA vapor gas, and removing the applied IPA vapor gas and fluid from the wafer surface through the plurality of source outlets.
摘要翻译：提供了一种制备半导体晶片表面的方法，其包括提供多个源入口和多个源出口，并且当多个源入口和出口靠近晶片表面。该方法还包括在施加IPA蒸汽气体的同时将流体通过多个源入口施加到晶片表面，以及通过多个源出口从晶片表面去除所施加的IPA蒸汽气体和流体。

3. 发明授权

US06500056B1 Linear reciprocating disposable belt polishing method and apparatus 失效
公开(公告)号：US06500056B1
公开(公告)日：2002-12-31
申请号：US09607727
申请日：2000-06-30
申请人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
发明人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
IPC分类号： B24B2100
CPC分类号： B24B37/245 , B24B21/04 , B24B37/26
摘要： An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

4. 发明授权

US06488040B1 Capillary proximity heads for single wafer cleaning and drying 有权
标题翻译：用于单片清洁和干燥的毛细管接近头
公开(公告)号：US06488040B1
公开(公告)日：2002-12-03
申请号：US09608244
申请日：2000-06-30
申请人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
发明人： John Martin de Larios , Mike Ravkin , Glen Travis , Jim Keller , Wilbur Krusell
IPC分类号： B08B300
CPC分类号： H01L21/67051 , B08B3/04 , H01L21/67028 , H01L21/67034 , Y10S134/902
摘要： A wafer cleaner and dryer to be used in wafer manufacturing operations is provided. The wafer cleaner and dryer has a proximity head which moves toward a wafer surface to complete either a cleaning or a drying operation. The proximity head includes a plurality of source inlets where the plurality of source inlets generates a first pressure on a fluid film present on the wafer surface when the proximity head is in a first position that is close to the wafer surface. The proximity head also contains a plurality of source outlets which introduces a second pressure on the fluid film present on the wafer surface when the proximity head is in the first position. The first pressure generated by the plurality of source inlets is greater than the second pressure created by the plurality of source outlets so as to create a pressure difference where the pressure difference causes removal of the fluid film from the wafer surface.
摘要翻译：提供了用于晶片制造操作的晶片清洁器和干燥器。晶片清洁器和干燥器具有朝向晶片表面移动以完成清洁或干燥操作的接近头。邻近头部包括多个源入口，其中当邻近头处于靠近晶片表面的第一位置时，多个源入口在存在于晶片表面上的流体膜上产生第一压力。邻近头还包含多个源极出口，当邻近头处于第一位置时，该出口在晶片表面上存在的流体膜上引入第二压力。由多个源入口产生的第一压力大于由多个源出口产生的第二压力，从而产生压力差，其中压力差导致流体膜从晶片表面移除。

5. 发明授权

US06428394B1 Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed 失效
标题翻译：使用连续抛光构件进料的半导体晶片的化学机械平面化和抛光的方法和装置
公开(公告)号：US06428394B1
公开(公告)日：2002-08-06
申请号：US09541144
申请日：2000-03-31
申请人： Ben Mooring , Wilbur Krusell , Glenn Travis , Erik Engdahl
发明人： Ben Mooring , Wilbur Krusell , Glenn Travis , Erik Engdahl
IPC分类号： B24B100
CPC分类号： B24B37/24 , B24B21/04 , B24B37/245
摘要： A method and apparatus are disclosed for chemically-mechanically polishing and planarizing semiconductors. An apparatus includes first and second rollers connected by a tension belt. A polishing member is releasably attached to the first and second rollers. A method includes clamping a first portion of a continuous strip of polishing member to a first roller, clamping a second portion of the continuous strip to a second roller, applying a tension to the continuous strip and rotationally reciprocating the rollers while pressing a semiconductor wafer against the continuous strip.
摘要翻译：公开了用于化学机械抛光和平面化半导体的方法和装置。一种装置包括通过张紧带连接的第一和第二辊。抛光构件可释放地附接到第一和第二辊。一种方法包括：将第一部分的抛光构件的连续条夹持到第一辊上，将连续条带的第二部分夹紧到第二辊上，向连续条施加张力，并在将半导体晶片压在一起的同时旋转地往复运动连续条。

6. 发明授权

US06746320B2 Linear reciprocating disposable belt polishing method and apparatus 失效
标题翻译：线性往复式一次性皮带抛光方法和装置
公开(公告)号：US06746320B2
公开(公告)日：2004-06-08
申请号：US10136600
申请日：2002-04-30
申请人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
发明人： Wilbur Krusell , Glenn Travis , Erik Engdahl , James Bagley
IPC分类号： B24B2100
CPC分类号： B24B37/245 , B24B21/04 , B24B37/26
摘要： An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.
摘要翻译：公开了一种用于化学机械平面化半导体晶片的设备，其具有连续的抛光带，第一侧具有固定的研磨表面和与第一侧相对的第二侧。在一个实施例中，第一驱动辊保持抛光条的第一端，第二驱动辊保持抛光条的第二端，并且一对支撑辊在抛光的任一端接触抛光条的第二侧带支撑。驱动马达可操作地连接到第一和第二驱动辊，用于以线性双向的方式移动抛光条。

7. 发明授权

US06594847B1 Single wafer residue, thin film removal and clean 有权
标题翻译：单晶片残留，薄膜去除和清洁
公开(公告)号：US06594847B1
公开(公告)日：2003-07-22
申请号：US09537913
申请日：2000-03-28
申请人： Wilbur Krusell , John M. de Larios , Mike Ravkin
发明人： Wilbur Krusell , John M. de Larios , Mike Ravkin
IPC分类号： G03D506
CPC分类号： H01L21/67051 , B08B1/04 , B08B3/10 , H01L21/67046 , Y10S134/902
摘要： A system is provided for use in semiconductor wafer cleaning operations. The cleaning system has a top cap and a bottom cap. The top cap seals on a top surface contact ring of a wafer, and the bottom cap seals on a bottom surface contact ring of the wafer. The wafer is held between the top cap and the bottom cap. An edge clean roller is used for cleaning an edge of the wafer. A drive roller is configured to rotate the wafer, the top cap, and the bottom cap. The edge clean roller rotates at a first velocity and the drive roller rotates at a second velocity so as to facilitate an edge cleaning of the wafer by the edge clean roller.
摘要翻译：提供了一种用于半导体晶片清洗操作的系统。清洁系统具有顶盖和底盖。顶盖在晶片的顶表面接触环上密封，并且底盖密封在晶片的底表面接触环上。晶片保持在顶盖和底盖之间。边缘清洁辊用于清洁晶片的边缘。驱动辊构造成旋转晶片，顶盖和底盖。边缘清洁辊以第一速度旋转，并且驱动辊以第二速度旋转，以便于通过边缘清洁辊对晶片进行边缘清洁。

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